DE3378605D1 - Resin sealed semiconductor devices - Google Patents

Resin sealed semiconductor devices

Info

Publication number
DE3378605D1
DE3378605D1 DE8383303088T DE3378605T DE3378605D1 DE 3378605 D1 DE3378605 D1 DE 3378605D1 DE 8383303088 T DE8383303088 T DE 8383303088T DE 3378605 T DE3378605 T DE 3378605T DE 3378605 D1 DE3378605 D1 DE 3378605D1
Authority
DE
Germany
Prior art keywords
semiconductor devices
sealed semiconductor
resin sealed
resin
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383303088T
Other languages
German (de)
English (en)
Inventor
Michio Sono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3378605D1 publication Critical patent/DE3378605D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/25—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons against alpha rays, e.g. for outer space applications
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
DE8383303088T 1982-05-28 1983-05-27 Resin sealed semiconductor devices Expired DE3378605D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57090684A JPS58207657A (ja) 1982-05-28 1982-05-28 半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
DE3378605D1 true DE3378605D1 (en) 1989-01-05

Family

ID=14005355

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383303088T Expired DE3378605D1 (en) 1982-05-28 1983-05-27 Resin sealed semiconductor devices

Country Status (5)

Country Link
US (1) US4661837A (enExample)
EP (1) EP0095918B1 (enExample)
JP (1) JPS58207657A (enExample)
DE (1) DE3378605D1 (enExample)
IE (1) IE54713B1 (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4800419A (en) * 1987-01-28 1989-01-24 Lsi Logic Corporation Support assembly for integrated circuits
JPS63196043A (ja) * 1987-02-10 1988-08-15 Toshiba Corp 半導体装置
JP2722451B2 (ja) * 1987-04-15 1998-03-04 三菱電機株式会社 半導体装置
US4953005A (en) * 1987-04-17 1990-08-28 Xoc Devices, Inc. Packaging system for stacking integrated circuits
US4862249A (en) * 1987-04-17 1989-08-29 Xoc Devices, Inc. Packaging system for stacking integrated circuits
JPH01183837A (ja) * 1988-01-18 1989-07-21 Texas Instr Japan Ltd 半導体装置
US4987475A (en) * 1988-02-29 1991-01-22 Digital Equipment Corporation Alignment of leads for ceramic integrated circuit packages
JP2708191B2 (ja) * 1988-09-20 1998-02-04 株式会社日立製作所 半導体装置
US5068712A (en) * 1988-09-20 1991-11-26 Hitachi, Ltd. Semiconductor device
US4947235A (en) * 1989-02-21 1990-08-07 Delco Electronics Corporation Integrated circuit shield
JPH0760837B2 (ja) * 1990-03-13 1995-06-28 株式会社東芝 樹脂封止型半導体装置
DE4038168C2 (de) * 1990-11-30 1998-09-24 Daimler Benz Ag Verfahren zur Herstellung eines Multichip-Moduls
US5166772A (en) * 1991-02-22 1992-11-24 Motorola, Inc. Transfer molded semiconductor device package with integral shield
JP3044872B2 (ja) * 1991-09-25 2000-05-22 ソニー株式会社 半導体装置
EP0550013B1 (en) * 1991-12-27 2000-07-26 Fujitsu Limited Semiconductor device and method of producing the same
US5294827A (en) * 1992-12-14 1994-03-15 Motorola, Inc. Semiconductor device having thin package body and method for making the same
US6613978B2 (en) 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US5880403A (en) 1994-04-01 1999-03-09 Space Electronics, Inc. Radiation shielding of three dimensional multi-chip modules
US5406117A (en) * 1993-12-09 1995-04-11 Dlugokecki; Joseph J. Radiation shielding for integrated circuit devices using reconstructed plastic packages
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
JP3832102B2 (ja) 1998-08-10 2006-10-11 ソニー株式会社 半導体装置の製造方法
US6368899B1 (en) * 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US7382043B2 (en) * 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
DE10332009B4 (de) 2003-07-14 2008-01-31 Infineon Technologies Ag Halbleiterbauelement mit elektromagnetischer Abschirmvorrichtung
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices
US8154881B2 (en) * 2006-11-13 2012-04-10 Telecommunication Systems, Inc. Radiation-shielded semiconductor assembly
US20080315374A1 (en) * 2007-06-25 2008-12-25 Sung Soo Kim Integrated circuit package-in-package system with magnetic film
US9318403B2 (en) 2007-06-25 2016-04-19 Stats Chippac Ltd. Integrated circuit packaging system with magnetic film and method of manufacture thereof
US8999764B2 (en) * 2007-08-10 2015-04-07 International Business Machines Corporation Ionizing radiation blocking in IC chip to reduce soft errors
US8533853B2 (en) 2009-06-12 2013-09-10 Telecommunication Systems, Inc. Location sensitive solid state drive
US20130161564A1 (en) * 2011-12-22 2013-06-27 International Scientific Technologies, Inc. NanoStructured Additives to High-Performance Polymers for Use in Radiation Shielding, Protection Against Atomic Oxygen and in Structural Applications
DE102015205051A1 (de) * 2015-03-20 2016-09-22 Robert Bosch Gmbh Elektronikmodul mit Alphastrahlenschutz für eine Getriebesteuereinheit sowie Getriebesteuereinheit

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4300153A (en) * 1977-09-22 1981-11-10 Sharp Kabushiki Kaisha Flat shaped semiconductor encapsulation
JPS5626448A (en) * 1979-08-13 1981-03-14 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor device
EP0028490B1 (en) * 1979-11-02 1983-12-21 BURROUGHS CORPORATION (a Michigan corporation) Integrated circuit with alpha radiation shielding means
JPS5694650A (en) * 1979-12-27 1981-07-31 Hitachi Ltd Resin-sealed semiconductor device
JPS6015152B2 (ja) * 1980-01-09 1985-04-17 株式会社日立製作所 樹脂封止半導体メモリ装置
JPS56150837A (en) * 1980-04-25 1981-11-21 Hitachi Ltd Field-effect transistor
JPS5848950A (ja) * 1981-09-18 1983-03-23 Nec Corp 半導体装置およびその製造方法

Also Published As

Publication number Publication date
US4661837A (en) 1987-04-28
EP0095918A2 (en) 1983-12-07
IE831279L (en) 1983-11-28
JPS58207657A (ja) 1983-12-03
EP0095918A3 (en) 1986-01-29
EP0095918B1 (en) 1988-11-30
JPS6249741B2 (enExample) 1987-10-21
IE54713B1 (en) 1990-01-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee