DE3345285A1 - Leistungs-halbleiteranordnung - Google Patents

Leistungs-halbleiteranordnung

Info

Publication number
DE3345285A1
DE3345285A1 DE19833345285 DE3345285A DE3345285A1 DE 3345285 A1 DE3345285 A1 DE 3345285A1 DE 19833345285 DE19833345285 DE 19833345285 DE 3345285 A DE3345285 A DE 3345285A DE 3345285 A1 DE3345285 A1 DE 3345285A1
Authority
DE
Germany
Prior art keywords
power semiconductor
semiconductor device
frame
connection
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19833345285
Other languages
German (de)
English (en)
Inventor
Erwin 8031 Eichenau Wurz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to DE19833345285 priority Critical patent/DE3345285A1/de
Priority to DE8484114843T priority patent/DE3470255D1/de
Priority to EP19840114843 priority patent/EP0150347B1/de
Priority to JP59264342A priority patent/JPS60153155A/ja
Publication of DE3345285A1 publication Critical patent/DE3345285A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Noodles (AREA)
  • Electronic Switches (AREA)
DE19833345285 1983-12-14 1983-12-14 Leistungs-halbleiteranordnung Withdrawn DE3345285A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE19833345285 DE3345285A1 (de) 1983-12-14 1983-12-14 Leistungs-halbleiteranordnung
DE8484114843T DE3470255D1 (en) 1983-12-14 1984-12-06 Power semiconductor device
EP19840114843 EP0150347B1 (de) 1983-12-14 1984-12-06 Leistungs-Halbleiteranordnung
JP59264342A JPS60153155A (ja) 1983-12-14 1984-12-14 電力用半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19833345285 DE3345285A1 (de) 1983-12-14 1983-12-14 Leistungs-halbleiteranordnung

Publications (1)

Publication Number Publication Date
DE3345285A1 true DE3345285A1 (de) 1985-06-27

Family

ID=6216947

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19833345285 Withdrawn DE3345285A1 (de) 1983-12-14 1983-12-14 Leistungs-halbleiteranordnung
DE8484114843T Expired DE3470255D1 (en) 1983-12-14 1984-12-06 Power semiconductor device

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE8484114843T Expired DE3470255D1 (en) 1983-12-14 1984-12-06 Power semiconductor device

Country Status (3)

Country Link
EP (1) EP0150347B1 (cg-RX-API-DMAC7.html)
JP (1) JPS60153155A (cg-RX-API-DMAC7.html)
DE (2) DE3345285A1 (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3717489A1 (de) * 1987-05-23 1988-12-01 Asea Brown Boveri Leistungshalbleitermodul und verfahren zur herstellung des moduls
US4796076A (en) * 1986-02-28 1989-01-03 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3837920A1 (de) * 1988-11-09 1990-05-10 Semikron Elektronik Gmbh Halbleiterelement
GB2249869B (en) * 1990-09-17 1994-10-12 Fuji Electric Co Ltd Semiconductor device
DE10024377B4 (de) * 2000-05-17 2006-08-17 Infineon Technologies Ag Gehäuseeinrichtung und darin zu verwendendes Kontaktelement
DE102005039946A1 (de) * 2005-08-24 2007-03-01 Semikron Elektronik Gmbh & Co. Kg Anordnung mit Leistungshalbleitermodul und mit Anschlussverbinder
US7995356B2 (en) 2005-08-26 2011-08-09 Siemens Aktiengesellschaft Power semiconductor module comprising load connection elements applied to circuit carriers
JP4894784B2 (ja) 2008-02-27 2012-03-14 三菱電機株式会社 半導体装置とその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2639979C3 (de) * 1976-09-04 1980-05-14 Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg Halbleiterbaueinheit
DE2617335A1 (de) * 1976-04-21 1977-11-03 Siemens Ag Halbleiterbauelement
DE2942409A1 (de) * 1979-10-19 1981-04-23 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit mehreren halbleiterkoerpern
JPS5715453A (en) * 1980-06-30 1982-01-26 Mitsubishi Electric Corp Transistor module
DE3274926D1 (en) * 1981-05-12 1987-02-05 Lucas Ind Plc A multi-phase bridge arrangement
JPS5823469A (ja) * 1981-08-03 1983-02-12 Mitsubishi Electric Corp 複合パワ−トランジスタ
DE3143339C2 (de) * 1981-10-31 1987-05-14 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4796076A (en) * 1986-02-28 1989-01-03 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
DE3717489A1 (de) * 1987-05-23 1988-12-01 Asea Brown Boveri Leistungshalbleitermodul und verfahren zur herstellung des moduls

Also Published As

Publication number Publication date
DE3470255D1 (en) 1988-05-05
JPS60153155A (ja) 1985-08-12
EP0150347A1 (de) 1985-08-07
JPH0345902B2 (cg-RX-API-DMAC7.html) 1991-07-12
EP0150347B1 (de) 1988-03-30

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Legal Events

Date Code Title Description
8130 Withdrawal