DE3319328A1 - Vorrichtung zur feinbearbeitung zerbrechlicher werkstuecke - Google Patents

Vorrichtung zur feinbearbeitung zerbrechlicher werkstuecke

Info

Publication number
DE3319328A1
DE3319328A1 DE19833319328 DE3319328A DE3319328A1 DE 3319328 A1 DE3319328 A1 DE 3319328A1 DE 19833319328 DE19833319328 DE 19833319328 DE 3319328 A DE3319328 A DE 3319328A DE 3319328 A1 DE3319328 A1 DE 3319328A1
Authority
DE
Germany
Prior art keywords
suction
chuck
buffing
plate
receptacle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19833319328
Other languages
German (de)
English (en)
Other versions
DE3319328C2 (enrdf_load_stackoverflow
Inventor
Lawrence 60056 Mount Prospect Ill. Day
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SPX Technologies Inc
Original Assignee
General Signal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Signal Corp filed Critical General Signal Corp
Publication of DE3319328A1 publication Critical patent/DE3319328A1/de
Application granted granted Critical
Publication of DE3319328C2 publication Critical patent/DE3319328C2/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE19833319328 1982-06-01 1983-05-27 Vorrichtung zur feinbearbeitung zerbrechlicher werkstuecke Granted DE3319328A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US38353382A 1982-06-01 1982-06-01

Publications (2)

Publication Number Publication Date
DE3319328A1 true DE3319328A1 (de) 1983-12-08
DE3319328C2 DE3319328C2 (enrdf_load_stackoverflow) 1988-12-22

Family

ID=23513596

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19833319328 Granted DE3319328A1 (de) 1982-06-01 1983-05-27 Vorrichtung zur feinbearbeitung zerbrechlicher werkstuecke

Country Status (2)

Country Link
JP (1) JPS591158A (enrdf_load_stackoverflow)
DE (1) DE3319328A1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0756917A4 (en) * 1994-04-22 1997-12-17 Toshiba Kk SEPARATE GRINDING SURFACE SUPPORT PLATE AND ASSOCIATED APPARATUS
EP0818272A1 (en) * 1996-07-12 1998-01-14 Applied Materials, Inc. Holding a polishing pad on a platen in a chemical mechanical polishing system
US6379221B1 (en) 1996-12-31 2002-04-30 Applied Materials, Inc. Method and apparatus for automatically changing a polishing pad in a chemical mechanical polishing system

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61241059A (ja) * 1985-04-16 1986-10-27 Toshiba Corp 研磨装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1355345A (en) * 1919-03-17 1920-10-12 William A Lorenz Disk grinding-machine
DE1982787U (de) * 1968-01-13 1968-04-04 Albert Fezer Vorrichtung zum halten von insbesondere duennwandigen werkstuecken, z. b. duennen blechen, folien od. dgl.
US3562964A (en) * 1970-02-24 1971-02-16 Spitfire Tool & Machine Co Inc Lapping machine
DE1729540A1 (de) * 1968-01-15 1971-06-09 Lissmann Alkor Werk Verfahren und Einrichtung zum Aufbringen von Flaechenmustern auf Kunststoffhohlkoerper
DE2644054A1 (de) * 1976-09-30 1978-04-06 Harro Hoefliger Geraet zum reinigen und polieren von schuettgut, insbesondere von arzneimittel enthaltenden hartgelatinekapseln oder pillen

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1355345A (en) * 1919-03-17 1920-10-12 William A Lorenz Disk grinding-machine
DE1982787U (de) * 1968-01-13 1968-04-04 Albert Fezer Vorrichtung zum halten von insbesondere duennwandigen werkstuecken, z. b. duennen blechen, folien od. dgl.
DE1729540A1 (de) * 1968-01-15 1971-06-09 Lissmann Alkor Werk Verfahren und Einrichtung zum Aufbringen von Flaechenmustern auf Kunststoffhohlkoerper
US3562964A (en) * 1970-02-24 1971-02-16 Spitfire Tool & Machine Co Inc Lapping machine
DE2644054A1 (de) * 1976-09-30 1978-04-06 Harro Hoefliger Geraet zum reinigen und polieren von schuettgut, insbesondere von arzneimittel enthaltenden hartgelatinekapseln oder pillen

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Z.: Werkstatt und Betrieb, 1968, H. 2, S. 113-114 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0756917A4 (en) * 1994-04-22 1997-12-17 Toshiba Kk SEPARATE GRINDING SURFACE SUPPORT PLATE AND ASSOCIATED APPARATUS
US6083083A (en) * 1994-04-22 2000-07-04 Kabushiki Kaisha Toshiba Separation type grinding surface plate and grinding apparatus using same
EP0818272A1 (en) * 1996-07-12 1998-01-14 Applied Materials, Inc. Holding a polishing pad on a platen in a chemical mechanical polishing system
US6379221B1 (en) 1996-12-31 2002-04-30 Applied Materials, Inc. Method and apparatus for automatically changing a polishing pad in a chemical mechanical polishing system

Also Published As

Publication number Publication date
DE3319328C2 (enrdf_load_stackoverflow) 1988-12-22
JPS591158A (ja) 1984-01-06

Similar Documents

Publication Publication Date Title
DE102006018644B4 (de) Bearbeitungsverfahren für einen Halbleiterwafer
US4739589A (en) Process and apparatus for abrasive machining of a wafer-like workpiece
DE69210568T2 (de) Wafer Polierkopf mit schwebendem Halterring
DE3448172C2 (enrdf_load_stackoverflow)
US6030280A (en) Apparatus for holding workpieces during lapping, honing, and polishing
DE2132174A1 (de) Verfahren und Vorrichtung zum Herstellen eines dielektrisch isolierten Halbleitergebildes
DE10295893T5 (de) Verfahren zur Herstellung von Halbleiterchips
DE102008058822A1 (de) Schleifscheibenanbringungsmechanismus
DE102021204071B4 (de) Waferbearbeitungsverfahren
DE102020207491A1 (de) Bearbeitungsvorrichtung
DE10124739A1 (de) Halbleiterwaferanordnung und Bearbeitungsvorrichtung mit Ansaugtischen zum Halten derselben
DE102015222535A1 (de) Schleifverfahren für Werkstücke
DE102022203968A1 (de) Bearbeitungsverfahren
DE3033944C2 (de) Werkstückhalter und Verfahren zu seiner Herstellung
DE3319328A1 (de) Vorrichtung zur feinbearbeitung zerbrechlicher werkstuecke
DE102022212887A1 (de) Konditionierungswerkzeug und konditionierungsverfahren
DE3430359C2 (enrdf_load_stackoverflow)
DE102010040221A1 (de) Schleifvorrichtung mit Waferlademechanismus
DE102012205251A1 (de) Halbleiterbearbeitungsverfahren
DE60210910T2 (de) Verfahren zur Bearbeitung einer Halbleiterscheibe, in dem ein laminiertes Substrat als Stütze für diese Scheibe verwendet wird
DE4124520A1 (de) Traegerteller fuer werkzeugblaetter
DE10054166C2 (de) Vorrichtung zum Polieren von Halbleiterscheiben
EP0115329B1 (de) Sägezahnschleifmaschine
DE102016222144A1 (de) Vorrichtung und Verfahren zum Abrichten von Poliertüchern
DE69711818T2 (de) Verfahren und Vorrichtung zum Polieren einer dünnen Platte

Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee