DE3277461D1 - Electroless nickel plating - Google Patents

Electroless nickel plating

Info

Publication number
DE3277461D1
DE3277461D1 DE8282303913T DE3277461T DE3277461D1 DE 3277461 D1 DE3277461 D1 DE 3277461D1 DE 8282303913 T DE8282303913 T DE 8282303913T DE 3277461 T DE3277461 T DE 3277461T DE 3277461 D1 DE3277461 D1 DE 3277461D1
Authority
DE
Germany
Prior art keywords
bath
free
sulfur
nickel plating
electroless nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282303913T
Other languages
English (en)
Inventor
Glenn O Mallory
Konrad Parker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Richardson Chemical Co
Original Assignee
Richardson Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23100919&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3277461(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Richardson Chemical Co filed Critical Richardson Chemical Co
Application granted granted Critical
Publication of DE3277461D1 publication Critical patent/DE3277461D1/de
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DE8282303913T 1981-07-27 1982-07-23 Electroless nickel plating Expired DE3277461D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US28697181A 1981-07-27 1981-07-27

Publications (1)

Publication Number Publication Date
DE3277461D1 true DE3277461D1 (en) 1987-11-19

Family

ID=23100919

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282303913T Expired DE3277461D1 (en) 1981-07-27 1982-07-23 Electroless nickel plating

Country Status (5)

Country Link
EP (1) EP0071436B2 (de)
JP (1) JPS5845368A (de)
AT (1) ATE30251T1 (de)
CA (1) CA1185404A (de)
DE (1) DE3277461D1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4503131A (en) * 1982-01-18 1985-03-05 Richardson Chemical Company Electrical contact materials
US4659605A (en) * 1984-05-16 1987-04-21 Richardson Chemical Company Electroless deposition magnetic recording media process and products produced thereby
KR960003723B1 (ko) * 1986-05-19 1996-03-21 하라마 카세이 고오교오 가부시끼가이샤 기판 금속의 표면상에 금속 필름을 형성하는 방법
JPH03107204U (de) * 1990-02-22 1991-11-05
US6230930B1 (en) * 1997-10-14 2001-05-15 Cross-Given Manufacturing Company Apparatus and method for vending products
JP2007256509A (ja) * 2006-03-22 2007-10-04 Tokai Rubber Ind Ltd 弾性ロールの製法
JP5158320B2 (ja) * 2007-03-30 2013-03-06 上村工業株式会社 無電解ニッケルめっき方法、リンクチェーン及びその製造方法
US8492899B2 (en) 2010-10-14 2013-07-23 International Business Machines Corporation Method to electrodeposit nickel on silicon for forming controllable nickel silicide
ES2663684T3 (es) * 2012-07-17 2018-04-16 Coventya, Inc. Recubrimientos de níquel producidos por reducción química y composiciones y métodos para formar los recubrimientos
US11685999B2 (en) 2014-06-02 2023-06-27 Macdermid Acumen, Inc. Aqueous electroless nickel plating bath and method of using the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2935425A (en) * 1954-12-29 1960-05-03 Gen Am Transport Chemical nickel plating processes and baths therefor
US3782978A (en) * 1971-07-06 1974-01-01 Shipley Co Electroless nickel plating

Also Published As

Publication number Publication date
EP0071436A1 (de) 1983-02-09
EP0071436B1 (de) 1987-10-14
EP0071436B2 (de) 1993-10-13
ATE30251T1 (de) 1987-10-15
CA1185404A (en) 1985-04-16
JPS5845368A (ja) 1983-03-16

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8366 Restricted maintained after opposition proceedings