DE3277461D1 - Electroless nickel plating - Google Patents
Electroless nickel platingInfo
- Publication number
- DE3277461D1 DE3277461D1 DE8282303913T DE3277461T DE3277461D1 DE 3277461 D1 DE3277461 D1 DE 3277461D1 DE 8282303913 T DE8282303913 T DE 8282303913T DE 3277461 T DE3277461 T DE 3277461T DE 3277461 D1 DE3277461 D1 DE 3277461D1
- Authority
- DE
- Germany
- Prior art keywords
- bath
- free
- sulfur
- nickel plating
- electroless nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US28697181A | 1981-07-27 | 1981-07-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3277461D1 true DE3277461D1 (en) | 1987-11-19 |
Family
ID=23100919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8282303913T Expired DE3277461D1 (en) | 1981-07-27 | 1982-07-23 | Electroless nickel plating |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0071436B2 (de) |
JP (1) | JPS5845368A (de) |
AT (1) | ATE30251T1 (de) |
CA (1) | CA1185404A (de) |
DE (1) | DE3277461D1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4503131A (en) * | 1982-01-18 | 1985-03-05 | Richardson Chemical Company | Electrical contact materials |
US4659605A (en) * | 1984-05-16 | 1987-04-21 | Richardson Chemical Company | Electroless deposition magnetic recording media process and products produced thereby |
KR960003723B1 (ko) * | 1986-05-19 | 1996-03-21 | 하라마 카세이 고오교오 가부시끼가이샤 | 기판 금속의 표면상에 금속 필름을 형성하는 방법 |
JPH03107204U (de) * | 1990-02-22 | 1991-11-05 | ||
US6230930B1 (en) * | 1997-10-14 | 2001-05-15 | Cross-Given Manufacturing Company | Apparatus and method for vending products |
JP2007256509A (ja) * | 2006-03-22 | 2007-10-04 | Tokai Rubber Ind Ltd | 弾性ロールの製法 |
JP5158320B2 (ja) * | 2007-03-30 | 2013-03-06 | 上村工業株式会社 | 無電解ニッケルめっき方法、リンクチェーン及びその製造方法 |
US8492899B2 (en) | 2010-10-14 | 2013-07-23 | International Business Machines Corporation | Method to electrodeposit nickel on silicon for forming controllable nickel silicide |
ES2663684T3 (es) * | 2012-07-17 | 2018-04-16 | Coventya, Inc. | Recubrimientos de níquel producidos por reducción química y composiciones y métodos para formar los recubrimientos |
US11685999B2 (en) | 2014-06-02 | 2023-06-27 | Macdermid Acumen, Inc. | Aqueous electroless nickel plating bath and method of using the same |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2935425A (en) * | 1954-12-29 | 1960-05-03 | Gen Am Transport | Chemical nickel plating processes and baths therefor |
US3782978A (en) * | 1971-07-06 | 1974-01-01 | Shipley Co | Electroless nickel plating |
-
1982
- 1982-07-14 CA CA000407227A patent/CA1185404A/en not_active Expired
- 1982-07-23 DE DE8282303913T patent/DE3277461D1/de not_active Expired
- 1982-07-23 EP EP82303913A patent/EP0071436B2/de not_active Expired - Lifetime
- 1982-07-23 AT AT82303913T patent/ATE30251T1/de not_active IP Right Cessation
- 1982-07-27 JP JP57131067A patent/JPS5845368A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0071436A1 (de) | 1983-02-09 |
EP0071436B1 (de) | 1987-10-14 |
EP0071436B2 (de) | 1993-10-13 |
ATE30251T1 (de) | 1987-10-15 |
CA1185404A (en) | 1985-04-16 |
JPS5845368A (ja) | 1983-03-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8366 | Restricted maintained after opposition proceedings |