DE3277269D1 - Semiconductor device connection lead formation - Google Patents

Semiconductor device connection lead formation

Info

Publication number
DE3277269D1
DE3277269D1 DE8282303255T DE3277269T DE3277269D1 DE 3277269 D1 DE3277269 D1 DE 3277269D1 DE 8282303255 T DE8282303255 T DE 8282303255T DE 3277269 T DE3277269 T DE 3277269T DE 3277269 D1 DE3277269 D1 DE 3277269D1
Authority
DE
Germany
Prior art keywords
semiconductor device
device connection
connection lead
lead formation
formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282303255T
Other languages
German (de)
English (en)
Inventor
Yasunori Kanai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3277269D1 publication Critical patent/DE3277269D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H10W70/611—
    • H10W70/635—
    • H10W70/685—
    • H10W76/153—
    • H10W76/157—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H10W70/682—
    • H10W72/07251—
    • H10W72/20—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE8282303255T 1981-06-26 1982-06-22 Semiconductor device connection lead formation Expired DE3277269D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56100337A JPS582054A (ja) 1981-06-26 1981-06-26 半導体装置

Publications (1)

Publication Number Publication Date
DE3277269D1 true DE3277269D1 (en) 1987-10-15

Family

ID=14271316

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282303255T Expired DE3277269D1 (en) 1981-06-26 1982-06-22 Semiconductor device connection lead formation

Country Status (4)

Country Link
US (1) US4530002A (enExample)
EP (1) EP0069505B1 (enExample)
JP (1) JPS582054A (enExample)
DE (1) DE3277269D1 (enExample)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0117211B1 (en) * 1983-02-18 1991-04-17 Fairchild Semiconductor Corporation Method for fabricating a package for an integrated circuit
US4751199A (en) * 1983-12-06 1988-06-14 Fairchild Semiconductor Corporation Process of forming a compliant lead frame for array-type semiconductor packages
US4677526A (en) * 1984-03-01 1987-06-30 Augat Inc. Plastic pin grid array chip carrier
DE3512628A1 (de) * 1984-04-11 1985-10-17 Moran, Peter, Cork Packung fuer eine integrierte schaltung
JPS6189643A (ja) * 1984-10-09 1986-05-07 Toshiba Corp 半導体装置及びその製造方法
FR2575331B1 (fr) * 1984-12-21 1987-06-05 Labo Electronique Physique Boitier pour composant electronique
GB8514043D0 (en) * 1985-06-04 1985-07-10 Manchester University Of Inst Material processing
US4750092A (en) * 1985-11-20 1988-06-07 Kollmorgen Technologies Corporation Interconnection package suitable for electronic devices and methods for producing same
US4890152A (en) * 1986-02-14 1989-12-26 Matsushita Electric Works, Ltd. Plastic molded chip carrier package and method of fabricating the same
DE3780764T2 (de) * 1986-11-15 1992-12-24 Matsushita Electric Works Ltd Gegossenes kunststoff-chip-gehaeuse mit steckermuster.
US4914741A (en) * 1987-06-08 1990-04-03 Digital Equipment Corporation Tape automated bonding semiconductor package
US5089881A (en) * 1988-11-03 1992-02-18 Micro Substrates, Inc. Fine-pitch chip carrier
JP2760829B2 (ja) * 1989-01-13 1998-06-04 株式会社日立製作所 電子基板
WO1991000619A1 (en) * 1989-06-30 1991-01-10 Raychem Corporation Flying leads for integrated circuits
WO1992005583A1 (fr) * 1990-09-19 1992-04-02 Fujitsu Limited Dispositif a semi-conducteur comportant de nombreuses broches a fils conducteurs
JPH05102262A (ja) * 1991-10-03 1993-04-23 Hitachi Ltd 半導体装置及びそれを実装した実装装置
JPH06244231A (ja) * 1993-02-01 1994-09-02 Motorola Inc 気密半導体デバイスおよびその製造方法
US5563446A (en) * 1994-01-25 1996-10-08 Lsi Logic Corporation Surface mount peripheral leaded and ball grid array package
US5541449A (en) * 1994-03-11 1996-07-30 The Panda Project Semiconductor chip carrier affording a high-density external interface
US5557505A (en) * 1994-07-22 1996-09-17 Ast Research, Inc. Dual pattern microprocessor package footprint
US5889333A (en) * 1994-08-09 1999-03-30 Fujitsu Limited Semiconductor device and method for manufacturing such
US5508556A (en) * 1994-09-02 1996-04-16 Motorola, Inc. Leaded semiconductor device having accessible power supply pad terminals
US6016852A (en) * 1994-12-01 2000-01-25 Intel Corporation Leaded grid array IC package having coplanar bent leads for surface mount technology
US5777853A (en) * 1996-05-03 1998-07-07 Ast Research, Inc. Printed circuit board having a dual square pattern footprints for receiving one of two electronic components having equal printouts per size
US5764488A (en) * 1996-06-11 1998-06-09 Ast Research, Inc. Printed circuit board having a dual pattern footprint for receiving one of two component packages
US5751557A (en) * 1996-06-21 1998-05-12 Ast Research, Inc. Printed circuit board having a triple pattern footprint for receiving one of three component packages
JP2959480B2 (ja) * 1996-08-12 1999-10-06 日本電気株式会社 半導体装置及びその製造方法
DE69637246T2 (de) 1996-09-12 2008-02-14 Ibiden Co., Ltd., Ogaki Leiterplatte zur montage elektronischer bauelemente
JPH10242374A (ja) * 1997-02-27 1998-09-11 Oki Electric Ind Co Ltd 半導体装置
US6064286A (en) * 1998-07-31 2000-05-16 The Whitaker Corporation Millimeter wave module with an interconnect from an interior cavity
JP2001185640A (ja) 1999-12-24 2001-07-06 Nec Corp 表面実装型パッケージ及び電子部品並びに電子部品の製造方法
US6992378B2 (en) * 2000-12-30 2006-01-31 Intel Corporation Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery
US6936502B2 (en) * 2003-05-14 2005-08-30 Nortel Networks Limited Package modification for channel-routed circuit boards
US20080280463A1 (en) * 2007-05-09 2008-11-13 Mercury Computer Systems, Inc. Rugged Chip Packaging
DE102007040662A1 (de) * 2007-08-27 2009-03-26 Elster Meßtechnik GmbH Verfahren zur Montage von elektronischen Bauteilen und elektromechanischen Komponenten auf einer Leiterplatte
JP7443780B2 (ja) * 2020-01-17 2024-03-06 富士電機株式会社 多層基板回路構造
DE102020208214A1 (de) 2020-07-01 2022-01-05 Zf Friedrichshafen Ag Leiterplatte, Inverter, Kraftfahrzeug sowie Verfahren zur Herstellung einer Leiterplatte

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3959579A (en) * 1974-08-19 1976-05-25 International Business Machines Corporation Apertured semi-conductor device mounted on a substrate
JPS5328266A (en) * 1976-08-13 1978-03-16 Fujitsu Ltd Method of producing multilayer ceramic substrate
US4142203A (en) * 1976-12-20 1979-02-27 Avx Corporation Method of assembling a hermetically sealed semiconductor unit
JPS53129863A (en) * 1977-04-19 1978-11-13 Fujitsu Ltd Multilayer printed board
JPS5538078A (en) * 1978-09-11 1980-03-17 Mitsubishi Electric Corp Semiconductor integrated circuit device
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
US4322778A (en) * 1980-01-25 1982-03-30 International Business Machines Corp. High performance semiconductor package assembly
US4296456A (en) * 1980-06-02 1981-10-20 Burroughs Corporation Electronic package for high density integrated circuits

Also Published As

Publication number Publication date
JPS582054A (ja) 1983-01-07
EP0069505B1 (en) 1987-09-09
US4530002A (en) 1985-07-16
EP0069505A2 (en) 1983-01-12
EP0069505A3 (en) 1985-01-02
JPH0234184B2 (enExample) 1990-08-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition