DE3232184A1 - Leistungs-halbleiterelement - Google Patents

Leistungs-halbleiterelement

Info

Publication number
DE3232184A1
DE3232184A1 DE19823232184 DE3232184A DE3232184A1 DE 3232184 A1 DE3232184 A1 DE 3232184A1 DE 19823232184 DE19823232184 DE 19823232184 DE 3232184 A DE3232184 A DE 3232184A DE 3232184 A1 DE3232184 A1 DE 3232184A1
Authority
DE
Germany
Prior art keywords
base plate
frame
stacks
rivets
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19823232184
Other languages
German (de)
English (en)
Other versions
DE3232184C2 (enrdf_load_stackoverflow
Inventor
Werner Egerbacher
Herbert 8000 München Vogt
Dieter 8031 Geisenbullach Wunderlich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to DE19823232184 priority Critical patent/DE3232184A1/de
Priority to JP15567883A priority patent/JPS5958856A/ja
Publication of DE3232184A1 publication Critical patent/DE3232184A1/de
Application granted granted Critical
Publication of DE3232184C2 publication Critical patent/DE3232184C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Noodles (AREA)
  • Electronic Switches (AREA)
  • Die Bonding (AREA)
  • Photovoltaic Devices (AREA)
DE19823232184 1982-08-30 1982-08-30 Leistungs-halbleiterelement Granted DE3232184A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE19823232184 DE3232184A1 (de) 1982-08-30 1982-08-30 Leistungs-halbleiterelement
JP15567883A JPS5958856A (ja) 1982-08-30 1983-08-25 電力用半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19823232184 DE3232184A1 (de) 1982-08-30 1982-08-30 Leistungs-halbleiterelement

Publications (2)

Publication Number Publication Date
DE3232184A1 true DE3232184A1 (de) 1984-03-01
DE3232184C2 DE3232184C2 (enrdf_load_stackoverflow) 1987-06-11

Family

ID=6172026

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823232184 Granted DE3232184A1 (de) 1982-08-30 1982-08-30 Leistungs-halbleiterelement

Country Status (2)

Country Link
JP (1) JPS5958856A (enrdf_load_stackoverflow)
DE (1) DE3232184A1 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3508456A1 (de) * 1985-03-09 1986-09-11 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul
DE3643288A1 (de) * 1986-12-18 1988-06-30 Semikron Elektronik Gmbh Halbleiterbaueinheit

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2728313A1 (de) * 1977-06-23 1979-01-04 Siemens Ag Halbleiterbauelement
DE3005313A1 (de) * 1980-02-13 1981-08-20 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterbaueinheit
DD214497A1 (de) * 1983-04-05 1984-10-10 Inst Regelungstechnik Gehaeuse und kontaktstreifen fuer leistungselektronische dreipolzweigpaare

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2617335A1 (de) * 1976-04-21 1977-11-03 Siemens Ag Halbleiterbauelement

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2728313A1 (de) * 1977-06-23 1979-01-04 Siemens Ag Halbleiterbauelement
DE3005313A1 (de) * 1980-02-13 1981-08-20 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterbaueinheit
DD214497A1 (de) * 1983-04-05 1984-10-10 Inst Regelungstechnik Gehaeuse und kontaktstreifen fuer leistungselektronische dreipolzweigpaare

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3508456A1 (de) * 1985-03-09 1986-09-11 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul
DE3643288A1 (de) * 1986-12-18 1988-06-30 Semikron Elektronik Gmbh Halbleiterbaueinheit

Also Published As

Publication number Publication date
DE3232184C2 (enrdf_load_stackoverflow) 1987-06-11
JPS5958856A (ja) 1984-04-04

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee