DE3232184A1 - Power semiconductor element - Google Patents
Power semiconductor elementInfo
- Publication number
- DE3232184A1 DE3232184A1 DE19823232184 DE3232184A DE3232184A1 DE 3232184 A1 DE3232184 A1 DE 3232184A1 DE 19823232184 DE19823232184 DE 19823232184 DE 3232184 A DE3232184 A DE 3232184A DE 3232184 A1 DE3232184 A1 DE 3232184A1
- Authority
- DE
- Germany
- Prior art keywords
- base plate
- frame
- stacks
- rivets
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Emergency Protection Circuit Devices (AREA)
- Noodles (AREA)
- Electronic Switches (AREA)
- Photovoltaic Devices (AREA)
- Die Bonding (AREA)
Abstract
Description
Leistungs-HalbleiterelementPower semiconductor element
Die Erfindung betrifft ein Halbleiterbauelement mit mindestens zwei Halbleiterkörpern mit den Merkmalen: a) Die Halbleiterkörper sind in einem Gehäuse eingeschlossen, b) das Gehäuse hat eine metallene Bodenplatte, c) mit der Bodenplatte ist ein Rahmen verbunden, d) auf der Bodenplatte sind mindestens zwei Stapel von zu kontaktierenden Teilen angeordnet, die je einen der Halbleiterkörper und Anschlußleiter enthalten, e) die Stapel sind durch mindestens eine Feder gegen den Boden gedrückt, f) zwischen den beiden Stapeln ist ein Befestigungselement für die Feder vorgesehen, g) das Befestigungelement ist zwischen den Stapeln mit der Bodenplatte verbunden.The invention relates to a semiconductor component having at least two Semiconductor bodies with the features: a) The semiconductor bodies are in a housing included, b) the housing has a metal base plate, c) with the base plate a frame is connected, d) on the bottom plate are at least two stacks of arranged to be contacted parts, each one of the semiconductor body and connecting conductor included, e) the stacks are pressed against the floor by at least one spring, f) a fastening element for the spring is provided between the two stacks, g) the fastening element is connected to the base plate between the stacks.
Ein solches Halbleiterbauelement ist beispielsweise in der DE-OS 27 28 313 beschrieben worden. Der Rahmen des Gehäuses dieses Halbleiterbauelements weist einen im Innenraum liegenden Steg auf, gegen den sich die Feder abstützt. Die Feder wird durch eine durch den Steg hindurchgehende Schraube fixiert, die in die metallene Bodenplatte eingeschraubt ist. Mit der Befestigung der Feder wird also auch eine feste Verbindung zwischen dem rahmen und der metallenen Bodenplatte erreicht.Such a semiconductor component is for example in DE-OS 27 28 313 has been described. The frame of the housing of this semiconductor component has a web located in the interior, against which the spring is supported. The spring is fixed by a screw going through the bar, which is inserted in the metal base plate is screwed in. With the attachment of the spring will So there is also a solid connection between the frame and the metal base plate achieved.
Bei anderen Gehäuseformen ohne Steg ist diese Art der Verbindung nicht möglich.This type of connection is not available for other housing shapes without a bridge possible.
Dem obengenannten Dokument ist auch bereits zu entnehmen, daß der Rahmen mit der metallenen Bodenplatte verklebt wird. Dies führt aber insbesondere dann zu Schwierigkeiten, wenn die durch die Feder auf den Boden ausgeübte Kraft sehr hoch ist. Dann hat der Boden eine Tendenz, sich vom Gehäuseinneren gesehen konvex aufzuwölben, was dazu führen kann, daß sich die Klebverbindung zwischen Bodenplatte und Rahmen partiell löst.The above document can also be seen that the Frame glued to the metal base plate will. this leads to But especially when the spring hits the ground applied force is very high. Then the bottom has a tendency to move away from the inside of the case seen to bulge convexly, which can lead to the adhesive bond between Partially loosens the base plate and frame.
Der Erfindung liegt die Aufgabe zugrunde, ein Halbleiterbauelement der beschriebenen Art so weiterzubilden, daß eine einfache und dauerhafte Befestigung zwischen Boden platte und Rahmen möglich ist.The invention is based on the object of a semiconductor component the type described so that a simple and permanent attachment between base plate and frame is possible.
Diese Aufgabe wird dadurch gelöst, daß der Rahmen jeweils an den dem Befestigungselement gegenüberliegenden Seiten der Stapel durch Niete mit der Bodenplatte verbunden ist, Weiterbildungen sind Gegenstan; der Unteransprüche.This object is achieved in that the frame is in each case to the Fasten opposite sides of the stack by riveting to the bottom plate connected, further training is the subject matter; of the subclaims.
Die Erfindung wird anhand eines Ausft#rungsbeispiels in Verbindung mit der Figur näher erläutert. Diese Figur zeigt die Seitenansicht auf ein Leistungs-Halbleiterbauelement mit aufgeschnittenem Gehäuse.The invention is illustrated in conjunction with an exemplary embodiment explained in more detail with the figure. This figure shows the side view of a power semiconductor component with the housing cut open.
Das Halbleiterbauelement hat ein Gehäuse mit einer metallenen Bodenplatte 1 und einem Rahmen 2. Dieser besteht vorzugsweise aus Isoliermaterial. Der Rahmen 2 kann mit einem Deckel 3 abgeschlossen sein. Auf der metallenen Bodenplatte 1 sitzen zwei Stapel von untereinander zu kontaktierenden Teilen, die jeweils einen Halbleiterkörper 6 bzw. 12 enthalten. Diese Stapel stehen in thermischem Kontakt mit der Bodenplatte 1. Sie können, wenn eine elektrische Isolation gegen die Bodenplatte 1 gewünscht ist, auf jeweils einem Substratpiättchen 4 bzw.The semiconductor component has a housing with a metal base plate 1 and a frame 2. This is preferably made of insulating material. The frame 2 can be closed with a cover 3. Sit on the metal base plate 1 two stacks of parts to be contacted with one another, each having a semiconductor body 6 or 12 included. These stacks are in thermal contact with the base plate 1. You can, if electrical insulation from the base plate 1 is desired is on a substrate plate 4 resp.
10 aus einem thermischen gut leitenden, jedoch elektrisch isolierenden Material, angeordnet sein. Der in Betrachtungsrichtung rechte Stapel sitzt dann auf dem Substratplättchen 4 und besteht aus einer Zuleitungselektrode 5, dem Halbleiterkörper 6, einer Kontaktelektrode 7, einer Zuleitungselektrode 8 und einem Druckstück 9. Der linke Stapel sitzt auf dem Substratplättchen 10 und besteht aus einer Zuleitungselektrode 11, dem Halbleiterkörper 12, einer Kontaktelektrode 13, einer Zuleitungselektrode 14 und einem Druckstück 15. Beide Stapel sind durch eine Feder, z.B. eine Blattfeder 16, belastet. Diese Feder ist durch einen Gewindebolzen oder eine Schraube 17 mit dem Boden verankert und drückt die genannten Stapel gegen die Bodenplatte 1. Mit Hilfe der Mutter 18 kann der notwendige Kontaktdruck eingestellt werden.10 from a thermal, good conductive, but electrical insulating Material, be arranged. The stack on the right in the viewing direction is then seated on the substrate plate 4 and consists of a lead electrode 5, the semiconductor body 6, a contact electrode 7, a lead electrode 8 and a pressure piece 9. The left stack sits on the substrate plate 10 and consists of a lead electrode 11, the semiconductor body 12, a contact electrode 13, a lead electrode 14 and a pressure piece 15. Both stacks are supported by a spring, e.g. a leaf spring 16, charged. This spring is by a threaded bolt or screw 17 with anchored to the ground and presses said stack against the base plate 1. With The necessary contact pressure can be set using the nut 18.
Der Rahmen 2 hat auf der metallenen Bodenplatte aufsitzende Fußteile 20, 21. Diese sind mit einer Aussparung versehen, in die Niete 22, 23 hineinragen. Da der Rahmen meistens aus konstruktiven Gründen ein bestimmtes Außenmaß nicht überschreiten darf, sind die Fußteile 20, 21 zweckmäßigerweise nach innen gerichtet. Der Rahmen 2 wird dann vor Aufsetzen des Deckels mit der metallenen Bodenplatte 1 durch Stauchen der Niete vernietet. Wird wie im vorliegenden Fall das Niet 23 durch eine der Zuleitungen verdeckt, so ist in der Zuleitung eine Aussparung 24 vorgesehen, durch das das Nietwerkzeug eingeführt werden kann.The frame 2 has foot parts resting on the metal base plate 20, 21. These are provided with a recess into which rivets 22, 23 protrude. Because the frame usually does not exceed a certain external dimension for structural reasons may, the foot parts 20, 21 are expediently directed inward. The frame 2 is then before putting on the lid with the metal base plate 1 by upsetting the rivet riveted. As in the present case, the rivet 23 is passed through one of the supply lines covered, a recess 24 is provided in the supply line through which the riveting tool can be introduced.
Durch das Vernieten wird eine dauerhafte Verbindung zwischen Rahmen 2 und Bodenplatte 1 erreicht. Die Niete 22, 23 können zweckmäßigerweise aus dem Metallboden 1 gedrückt werden und hinterlassen an der LTnterseite dann Vertiefungen 25, 26.The riveting creates a permanent connection between the frame 2 and base plate 1 reached. The rivets 22, 23 can expediently from the Metal bottom 1 are pressed and then leave indentations on the bottom side 25, 26.
1 Figur 4 Patentanspnichh1 Figure 4 patent application
Claims (4)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19823232184 DE3232184A1 (en) | 1982-08-30 | 1982-08-30 | Power semiconductor element |
JP15567883A JPS5958856A (en) | 1982-08-30 | 1983-08-25 | Power semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19823232184 DE3232184A1 (en) | 1982-08-30 | 1982-08-30 | Power semiconductor element |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3232184A1 true DE3232184A1 (en) | 1984-03-01 |
DE3232184C2 DE3232184C2 (en) | 1987-06-11 |
Family
ID=6172026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19823232184 Granted DE3232184A1 (en) | 1982-08-30 | 1982-08-30 | Power semiconductor element |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS5958856A (en) |
DE (1) | DE3232184A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3508456A1 (en) * | 1985-03-09 | 1986-09-11 | Brown, Boveri & Cie Ag, 6800 Mannheim | Power semiconductor module |
DE3643288A1 (en) * | 1986-12-18 | 1988-06-30 | Semikron Elektronik Gmbh | Semiconductor assembly |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2728313A1 (en) * | 1977-06-23 | 1979-01-04 | Siemens Ag | SEMICONDUCTOR COMPONENT |
DE3005313A1 (en) * | 1980-02-13 | 1981-08-20 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | SEMICONDUCTOR UNIT |
DD214497A1 (en) * | 1983-04-05 | 1984-10-10 | Inst Regelungstechnik | HOUSING AND CONTACT STRIPS FOR POWER ELECTRONIC THREE-POLE SWEEP COUPLES |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2617335A1 (en) * | 1976-04-21 | 1977-11-03 | Siemens Ag | Semiconductor component mounting system - has several elements in recesses of case in good thermal contact with case bottom |
-
1982
- 1982-08-30 DE DE19823232184 patent/DE3232184A1/en active Granted
-
1983
- 1983-08-25 JP JP15567883A patent/JPS5958856A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2728313A1 (en) * | 1977-06-23 | 1979-01-04 | Siemens Ag | SEMICONDUCTOR COMPONENT |
DE3005313A1 (en) * | 1980-02-13 | 1981-08-20 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | SEMICONDUCTOR UNIT |
DD214497A1 (en) * | 1983-04-05 | 1984-10-10 | Inst Regelungstechnik | HOUSING AND CONTACT STRIPS FOR POWER ELECTRONIC THREE-POLE SWEEP COUPLES |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3508456A1 (en) * | 1985-03-09 | 1986-09-11 | Brown, Boveri & Cie Ag, 6800 Mannheim | Power semiconductor module |
DE3643288A1 (en) * | 1986-12-18 | 1988-06-30 | Semikron Elektronik Gmbh | Semiconductor assembly |
Also Published As
Publication number | Publication date |
---|---|
DE3232184C2 (en) | 1987-06-11 |
JPS5958856A (en) | 1984-04-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |