DE3205650C2 - Leistungsgleichrichteranordnung - Google Patents

Leistungsgleichrichteranordnung

Info

Publication number
DE3205650C2
DE3205650C2 DE3205650A DE3205650A DE3205650C2 DE 3205650 C2 DE3205650 C2 DE 3205650C2 DE 3205650 A DE3205650 A DE 3205650A DE 3205650 A DE3205650 A DE 3205650A DE 3205650 C2 DE3205650 C2 DE 3205650C2
Authority
DE
Germany
Prior art keywords
power
power rectifier
heat sink
transformer
rectifier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3205650A
Other languages
German (de)
English (en)
Other versions
DE3205650A1 (de
Inventor
Adam Istvan Koroncai
Edmund Reinfried 8900 Augsburg Pötsch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE3205650A priority Critical patent/DE3205650C2/de
Priority to US06/462,391 priority patent/US4506320A/en
Priority to AT83101403T priority patent/ATE24631T1/de
Priority to EP83101403A priority patent/EP0086483B1/de
Priority to JP58024519A priority patent/JPS58153359A/ja
Publication of DE3205650A1 publication Critical patent/DE3205650A1/de
Application granted granted Critical
Publication of DE3205650C2 publication Critical patent/DE3205650C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/115—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Amplifiers (AREA)
  • Bipolar Transistors (AREA)
DE3205650A 1982-02-17 1982-02-17 Leistungsgleichrichteranordnung Expired DE3205650C2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE3205650A DE3205650C2 (de) 1982-02-17 1982-02-17 Leistungsgleichrichteranordnung
US06/462,391 US4506320A (en) 1982-02-17 1983-01-31 Power rectifier arrangement
AT83101403T ATE24631T1 (de) 1982-02-17 1983-02-14 Leistungsgleichrichteranordnung.
EP83101403A EP0086483B1 (de) 1982-02-17 1983-02-14 Leistungsgleichrichteranordnung
JP58024519A JPS58153359A (ja) 1982-02-17 1983-02-16 電力用整流装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3205650A DE3205650C2 (de) 1982-02-17 1982-02-17 Leistungsgleichrichteranordnung

Publications (2)

Publication Number Publication Date
DE3205650A1 DE3205650A1 (de) 1983-08-25
DE3205650C2 true DE3205650C2 (de) 1986-04-24

Family

ID=6155969

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3205650A Expired DE3205650C2 (de) 1982-02-17 1982-02-17 Leistungsgleichrichteranordnung

Country Status (5)

Country Link
US (1) US4506320A (OSRAM)
EP (1) EP0086483B1 (OSRAM)
JP (1) JPS58153359A (OSRAM)
AT (1) ATE24631T1 (OSRAM)
DE (1) DE3205650C2 (OSRAM)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4670817A (en) * 1984-10-01 1987-06-02 Venus Scientific Inc. Heat sink and interconnection arrangement for series connected power diodes
US4606000A (en) * 1985-03-27 1986-08-12 General Motors Corporation Bridge rectifier
ES2021306B3 (es) * 1986-07-10 1991-11-01 Siemens Ag Transmisor de alto rendimiento
US4754390A (en) * 1987-04-29 1988-06-28 International Business Machines Corporation Conductively cooled switching regulator
DE3802593A1 (de) * 1988-01-29 1989-08-10 Heidelberger Druckmasch Ag Umrichter mit gleichspannungs-zwischenkreis
US4864486A (en) * 1988-07-29 1989-09-05 International Business Machines Corporation Plank and frame transformer
DE4222068C1 (OSRAM) * 1992-07-04 1993-06-09 Abb Patent Gmbh, 6800 Mannheim, De
GB2377823B (en) * 2001-06-15 2005-11-23 Marconi Applied Technologies Transformer/rectifier arrangement

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE543787A (OSRAM) * 1954-12-21
US3237079A (en) * 1961-05-05 1966-02-22 Joseph A Mas Compact transformer and rectifier
CH394375A (de) * 1962-06-27 1965-06-30 Bbc Brown Boveri & Cie Transformator für Halbleitergleichrichter
GB981148A (en) * 1962-10-11 1965-01-20 Oerlikon Maschf Improvements in high-current rectifier installations
US3253646A (en) * 1964-04-08 1966-05-31 Udylite Corp Cooling system for power supply apparatus
US3541433A (en) * 1968-11-12 1970-11-17 Ariel R Davis Current supply apparatuses with an inductive winding and heat sink for solid state devices
JPS582522B2 (ja) * 1978-03-31 1983-01-17 株式会社デンソー 電気車制御装置
GB2047473B (en) * 1979-04-19 1983-01-26 Aei Semiconductors Ltd Mounting assemblies for electrical components

Also Published As

Publication number Publication date
JPH0481333B2 (OSRAM) 1992-12-22
JPS58153359A (ja) 1983-09-12
EP0086483A2 (de) 1983-08-24
EP0086483B1 (de) 1986-12-30
EP0086483A3 (en) 1984-09-05
ATE24631T1 (de) 1987-01-15
US4506320A (en) 1985-03-19
DE3205650A1 (de) 1983-08-25

Similar Documents

Publication Publication Date Title
EP0124029B1 (de) Ein elektrisches Bauteil tragendes, gut kühlbares Schaltungsmodul
DE68911644T2 (de) Schutzdiode gegen Überstrom.
DE1937664C3 (de) Halbleiterbauelement
DE69506957T2 (de) Wärmeausstrahlendes Bauelement aus Hochorientiertem Graphit
DE1069235B (OSRAM)
DE3221199A1 (de) Halbleiteranordnung des isolierten typs
EP3095307B1 (de) Leiterplatte, schaltung und verfahren zur herstellung einer schaltung
DE4027072A1 (de) Halbleiteranordnung
DE2932369A1 (de) Montage- und verbindungseinheit mit zuleitungen fuer elektronische schaltkreise
EP0338447A2 (de) Vorrichtung zur Wärmeabfuhr von Bauelementen auf einer Leiterplatte
DE19518522C2 (de) Steuergerät für ein Kraftfahrzeug
DE102018220949C5 (de) Halbleitervorrichtung
DE102021110251A1 (de) Leistungshalbleiteranordnung und wechselrichterbrücke mit leistungshalbleiteranordnung
DE3205650C2 (de) Leistungsgleichrichteranordnung
DE202020106792U1 (de) Umrichtervorrichtung
DE69325847T2 (de) Implantierbarer Herz-Defibrillator mit energetisch dissipativem Widerstand
DE9403108U1 (de) Niederinduktive Hochstromverschienung für Stromrichtermodule
DE112021002273T5 (de) Halbleiterbauteil
DE3201296C2 (de) Transistoranordnung
EP0150347B1 (de) Leistungs-Halbleiteranordnung
DE2611260B2 (de) Stromrichterbaueinheit
DE2855265A1 (de) Thyristor
DE2705085A1 (de) Wickelkondensator
DE1059988B (de) Elektrische Baugruppe
DE2755404A1 (de) Halbleiteranordnung

Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee