DE3174815D1 - Method for forming a conductor line in an integrated semiconductor memory and an integrated semiconductor memory with cells including a capacitor and a field effect transistor - Google Patents
Method for forming a conductor line in an integrated semiconductor memory and an integrated semiconductor memory with cells including a capacitor and a field effect transistorInfo
- Publication number
- DE3174815D1 DE3174815D1 DE8181108563T DE3174815T DE3174815D1 DE 3174815 D1 DE3174815 D1 DE 3174815D1 DE 8181108563 T DE8181108563 T DE 8181108563T DE 3174815 T DE3174815 T DE 3174815T DE 3174815 D1 DE3174815 D1 DE 3174815D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor memory
- integrated semiconductor
- capacitor
- forming
- field effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title 2
- 239000003990 capacitor Substances 0.000 title 1
- 239000004020 conductor Substances 0.000 title 1
- 230000005669 field effect Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
- H01L21/76889—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances by forming silicides of refractory metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53271—Conductive materials containing semiconductor material, e.g. polysilicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/98—Utilizing process equivalents or options
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Electrodes Of Semiconductors (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/217,371 US4403394A (en) | 1980-12-17 | 1980-12-17 | Formation of bit lines for ram device |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3174815D1 true DE3174815D1 (en) | 1986-07-17 |
Family
ID=22810796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8181108563T Expired DE3174815D1 (en) | 1980-12-17 | 1981-10-20 | Method for forming a conductor line in an integrated semiconductor memory and an integrated semiconductor memory with cells including a capacitor and a field effect transistor |
Country Status (4)
Country | Link |
---|---|
US (1) | US4403394A (de) |
EP (1) | EP0054129B1 (de) |
JP (1) | JPS57107071A (de) |
DE (1) | DE3174815D1 (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4536941A (en) * | 1980-03-21 | 1985-08-27 | Kuo Chang Kiang | Method of making high density dynamic memory cell |
JPS5940571A (ja) * | 1982-08-30 | 1984-03-06 | Hitachi Ltd | 半導体装置 |
US4569122A (en) * | 1983-03-09 | 1986-02-11 | Advanced Micro Devices, Inc. | Method of forming a low resistance quasi-buried contact |
DE3314879A1 (de) * | 1983-04-25 | 1984-10-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von stabilen, niederohmigen kontakten in integrierten halbleiterschaltungen |
JPS59201461A (ja) * | 1983-04-28 | 1984-11-15 | Toshiba Corp | 読み出し専用半導体記憶装置およびその製造方法 |
JPS6014462A (ja) * | 1983-07-05 | 1985-01-25 | Oki Electric Ind Co Ltd | 半導体メモリ素子 |
JPS6018948A (ja) * | 1983-07-12 | 1985-01-31 | Nec Corp | 半導体集積回路装置 |
NL8303179A (nl) * | 1983-09-15 | 1985-04-01 | Philips Nv | Halfgeleiderinrichting. |
JPS60132353A (ja) * | 1983-12-20 | 1985-07-15 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
JPS60163455A (ja) * | 1984-02-03 | 1985-08-26 | Toshiba Corp | 読み出し専用記憶装置及びその製造方法 |
JPH0640572B2 (ja) * | 1984-05-21 | 1994-05-25 | 沖電気工業株式会社 | 半導体装置の製造方法 |
JPH0673369B2 (ja) * | 1984-06-15 | 1994-09-14 | 沖電気工業株式会社 | 半導体装置 |
EP0222795B1 (de) * | 1985-05-03 | 1990-09-26 | AT&T Corp. | Polycidverfahren bei der halbleiterherstellung |
JPS62136069A (ja) * | 1985-12-10 | 1987-06-19 | Hitachi Ltd | 半導体装置およびその製造方法 |
US4755480A (en) * | 1986-02-03 | 1988-07-05 | Intel Corporation | Method of making a silicon nitride resistor using plasma enhanced chemical vapor deposition |
US4786612A (en) * | 1986-02-03 | 1988-11-22 | Intel Corporation | Plasma enhanced chemical vapor deposited vertical silicon nitride resistor |
JPS62260340A (ja) * | 1986-05-06 | 1987-11-12 | Toshiba Corp | 半導体装置の製造方法 |
US4808555A (en) * | 1986-07-10 | 1989-02-28 | Motorola, Inc. | Multiple step formation of conductive material layers |
JPS63128750A (ja) * | 1986-11-19 | 1988-06-01 | Toshiba Corp | 半導体装置 |
JP2681887B2 (ja) * | 1987-03-06 | 1997-11-26 | シ−メンス、アクチエンゲゼルシヤフト | 3次元1トランジスタメモリセル構造とその製法 |
US4992391A (en) * | 1989-11-29 | 1991-02-12 | Advanced Micro Devices, Inc. | Process for fabricating a control gate for a floating gate FET |
US5006481A (en) * | 1989-11-30 | 1991-04-09 | Sgs-Thomson Microelectronics, Inc. | Method of making a stacked capacitor DRAM cell |
US5116776A (en) * | 1989-11-30 | 1992-05-26 | Sgs-Thomson Microelectronics, Inc. | Method of making a stacked copacitor for dram cell |
US5037772A (en) * | 1989-12-13 | 1991-08-06 | Texas Instruments Incorporated | Method for forming a polysilicon to polysilicon capacitor |
KR100247724B1 (ko) * | 1995-09-01 | 2000-03-15 | 포만 제프리 엘 | 실리사이드화된 접촉 영역을 갖는 확산 저항 구조 및 그의 제조 방법 |
US20060110913A1 (en) * | 2004-11-24 | 2006-05-25 | Haiwei Xin | Gate structure having diffusion barrier layer |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4003036A (en) * | 1975-10-23 | 1977-01-11 | American Micro-Systems, Inc. | Single IGFET memory cell with buried storage element |
US4240092A (en) * | 1976-09-13 | 1980-12-16 | Texas Instruments Incorporated | Random access memory cell with different capacitor and transistor oxide thickness |
US4102714A (en) * | 1976-04-23 | 1978-07-25 | International Business Machines Corporation | Process for fabricating a low breakdown voltage device for polysilicon gate technology |
DE2737073C3 (de) * | 1977-08-17 | 1981-09-17 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Herstellen eines Isolierschicht-Feldeffekttransistors für eine Ein-Transistor-Speicherzelle |
DE2815605C3 (de) * | 1978-04-11 | 1981-04-16 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterspeicher mit Ansteuerleitungen hoher Leitfähigkeit |
US4251571A (en) * | 1978-05-02 | 1981-02-17 | International Business Machines Corporation | Method for forming semiconductor structure with improved isolation between two layers of polycrystalline silicon |
US4264382A (en) * | 1978-05-25 | 1981-04-28 | International Business Machines Corporation | Method for making a lateral PNP or NPN with a high gain utilizing reactive ion etching of buried high conductivity regions |
US4200968A (en) * | 1978-08-09 | 1980-05-06 | Harris Corporation | VMOS transistor and method of fabrication |
DE2837877C2 (de) * | 1978-08-30 | 1987-04-23 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung eines MOS-integrierten Halbleiterspeichers |
JPS5856268B2 (ja) * | 1978-12-26 | 1983-12-14 | 超エル・エス・アイ技術研究組合 | 半導体装置の製造方法 |
JPS6055988B2 (ja) * | 1979-01-26 | 1985-12-07 | 株式会社日立製作所 | 半導体装置の製法 |
US4329706A (en) * | 1979-03-01 | 1982-05-11 | International Business Machines Corporation | Doped polysilicon silicide semiconductor integrated circuit interconnections |
JPS5621372A (en) * | 1979-07-31 | 1981-02-27 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS5826829B2 (ja) * | 1979-08-30 | 1983-06-06 | 富士通株式会社 | ダイナミックメモリセルの製造方法 |
US4272302A (en) * | 1979-09-05 | 1981-06-09 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Method of making V-MOS field effect transistors utilizing a two-step anisotropic etching and ion implantation |
US4369564A (en) * | 1979-10-29 | 1983-01-25 | American Microsystems, Inc. | VMOS Memory cell and method for making same |
JPS5681968A (en) * | 1979-12-07 | 1981-07-04 | Toshiba Corp | Manufacture of semiconductor device |
US4326332A (en) * | 1980-07-28 | 1982-04-27 | International Business Machines Corp. | Method of making a high density V-MOS memory array |
IE52791B1 (en) * | 1980-11-05 | 1988-03-02 | Fujitsu Ltd | Semiconductor devices |
US4341009A (en) * | 1980-12-05 | 1982-07-27 | International Business Machines Corporation | Method for making an electrical contact to a silicon substrate through a relatively thin layer of silicon dioxide on the surface of the substrate |
US4356211A (en) * | 1980-12-19 | 1982-10-26 | International Business Machines Corporation | Forming air-dielectric isolation regions in a monocrystalline silicon substrate by differential oxidation of polysilicon |
-
1980
- 1980-12-17 US US06/217,371 patent/US4403394A/en not_active Expired - Lifetime
-
1981
- 1981-10-01 JP JP56154911A patent/JPS57107071A/ja active Granted
- 1981-10-20 DE DE8181108563T patent/DE3174815D1/de not_active Expired
- 1981-10-20 EP EP81108563A patent/EP0054129B1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0054129B1 (de) | 1986-06-11 |
JPS57107071A (en) | 1982-07-03 |
EP0054129A2 (de) | 1982-06-23 |
JPH0152907B2 (de) | 1989-11-10 |
EP0054129A3 (en) | 1983-08-24 |
US4403394A (en) | 1983-09-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |