DE3139670A1 - Elektronische duennschichtschaltung und deren herstellungsverfahren - Google Patents

Elektronische duennschichtschaltung und deren herstellungsverfahren

Info

Publication number
DE3139670A1
DE3139670A1 DE19813139670 DE3139670A DE3139670A1 DE 3139670 A1 DE3139670 A1 DE 3139670A1 DE 19813139670 DE19813139670 DE 19813139670 DE 3139670 A DE3139670 A DE 3139670A DE 3139670 A1 DE3139670 A1 DE 3139670A1
Authority
DE
Germany
Prior art keywords
layer
pattern
gold
solderable
galvanically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19813139670
Other languages
German (de)
English (en)
Inventor
Heiko Dipl.Phys.Dr. 7016 Gerlingen Gruner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19813139670 priority Critical patent/DE3139670A1/de
Priority to IT8223537A priority patent/IT1207285B/it
Priority to EP82902975A priority patent/EP0090820B1/de
Priority to US06/509,433 priority patent/US4596762A/en
Priority to PCT/DE1982/000195 priority patent/WO1983001344A1/de
Priority to DE8282902975T priority patent/DE3269431D1/de
Priority to JP57502953A priority patent/JPS58501649A/ja
Publication of DE3139670A1 publication Critical patent/DE3139670A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0505—Double exposure of the same photosensitive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE19813139670 1981-10-06 1981-10-06 Elektronische duennschichtschaltung und deren herstellungsverfahren Withdrawn DE3139670A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE19813139670 DE3139670A1 (de) 1981-10-06 1981-10-06 Elektronische duennschichtschaltung und deren herstellungsverfahren
IT8223537A IT1207285B (it) 1981-10-06 1982-09-30 Circuito elettronico a strato sottile e procedimento per la sua fabbricazione.
EP82902975A EP0090820B1 (de) 1981-10-06 1982-10-05 Elektronische dünnschichtschaltung und deren herstellungsverfahren
US06/509,433 US4596762A (en) 1981-10-06 1982-10-05 Electronic thin-film circuit and method for producing it
PCT/DE1982/000195 WO1983001344A1 (fr) 1981-10-06 1982-10-05 Circuit electronique a couche mince et son procede de fabrication
DE8282902975T DE3269431D1 (en) 1981-10-06 1982-10-05 Thin layered electronic circuit and manufacturing method thereof
JP57502953A JPS58501649A (ja) 1981-10-06 1982-10-05 電子薄膜回路及びその製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813139670 DE3139670A1 (de) 1981-10-06 1981-10-06 Elektronische duennschichtschaltung und deren herstellungsverfahren

Publications (1)

Publication Number Publication Date
DE3139670A1 true DE3139670A1 (de) 1983-04-21

Family

ID=6143494

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19813139670 Withdrawn DE3139670A1 (de) 1981-10-06 1981-10-06 Elektronische duennschichtschaltung und deren herstellungsverfahren
DE8282902975T Expired DE3269431D1 (en) 1981-10-06 1982-10-05 Thin layered electronic circuit and manufacturing method thereof

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE8282902975T Expired DE3269431D1 (en) 1981-10-06 1982-10-05 Thin layered electronic circuit and manufacturing method thereof

Country Status (6)

Country Link
US (1) US4596762A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0090820B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS58501649A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (2) DE3139670A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT1207285B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO (1) WO1983001344A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3907004A1 (de) * 1989-03-04 1990-09-06 Contraves Ag Verfahren zum herstellen von duennschichtschaltungen

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4668603A (en) * 1986-06-26 1987-05-26 E. I. Du Pont De Nemours And Company Method of making raised relief circuit board with soldered connections having nomenclature applied thereto
DE3829195A1 (de) * 1988-08-29 1990-03-08 Bosch Gmbh Robert Temperaturfuehler
WO2018094280A1 (en) 2016-11-18 2018-05-24 Hutchinson Technology Incorporated High aspect ratio electroplated structures and anisotropic electroplating processes
US11387033B2 (en) 2016-11-18 2022-07-12 Hutchinson Technology Incorporated High-aspect ratio electroplated structures and anisotropic electroplating processes
US11521785B2 (en) 2016-11-18 2022-12-06 Hutchinson Technology Incorporated High density coil design and process
US11693423B2 (en) * 2018-12-19 2023-07-04 Waymo Llc Model for excluding vehicle from sensor field of view

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3287191A (en) * 1963-07-23 1966-11-22 Photo Engravers Res Inc Etching of printed circuit components
US3423205A (en) * 1964-10-30 1969-01-21 Bunker Ramo Method of making thin-film circuits
US3649392A (en) * 1968-12-06 1972-03-14 Western Electric Co Thin-film circuit formation
GB1248142A (en) * 1969-06-20 1971-09-29 Decca Ltd Improvements in or relating to electrical circuits assemblies
US3700445A (en) * 1971-07-29 1972-10-24 Us Navy Photoresist processing method for fabricating etched microcircuits
FR2159848A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1971-11-05 1973-06-22 Bosch
US3751248A (en) * 1971-12-27 1973-08-07 Bell Telephone Labor Inc Method of selective multilayered etching
DE2509912C3 (de) * 1975-03-07 1979-11-29 Robert Bosch Gmbh, 7000 Stuttgart Elektronische Dünnfilmschaltung
DE2513859C2 (de) * 1975-03-27 1981-11-12 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen eines Kondensator-Widerstands-Netzwerks
IT1074235B (it) * 1976-12-28 1985-04-17 Selenia Ind Elettroniche Procedimento per la realizzazione degli elementi conduttivi e resististivi in microcircuiti per microonde
DE2906813C2 (de) * 1979-02-22 1982-06-03 Robert Bosch Gmbh, 7000 Stuttgart Elektronische Dünnschichtschaltung
JPS57138168A (en) * 1981-01-15 1982-08-26 Bosch Gmbh Robert Electron thin film circuit
DE3136198A1 (de) * 1981-01-15 1982-08-05 Robert Bosch Gmbh, 7000 Stuttgart "elektronische duennschichtschaltung"

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3907004A1 (de) * 1989-03-04 1990-09-06 Contraves Ag Verfahren zum herstellen von duennschichtschaltungen

Also Published As

Publication number Publication date
JPH0410235B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-02-24
JPS58501649A (ja) 1983-09-29
US4596762A (en) 1986-06-24
EP0090820B1 (de) 1986-02-26
IT1207285B (it) 1989-05-17
DE3269431D1 (en) 1986-04-03
IT8223537A0 (it) 1982-09-30
EP0090820A1 (de) 1983-10-12
WO1983001344A1 (fr) 1983-04-14

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee