DE3124692A1 - "halbleitergleichrichter" - Google Patents

"halbleitergleichrichter"

Info

Publication number
DE3124692A1
DE3124692A1 DE19813124692 DE3124692A DE3124692A1 DE 3124692 A1 DE3124692 A1 DE 3124692A1 DE 19813124692 DE19813124692 DE 19813124692 DE 3124692 A DE3124692 A DE 3124692A DE 3124692 A1 DE3124692 A1 DE 3124692A1
Authority
DE
Germany
Prior art keywords
section
semiconductor
rectifier
soldered
synthetic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19813124692
Other languages
German (de)
English (en)
Inventor
Klaus Dipl.-Ing. 7410 Reutlingen Heyke
Andreas Dipl.-Phys. Hößler
Siegfried Dipl.-Ing. Schwenk
Alexander 7413 Gomaringen Wallrauch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19813124692 priority Critical patent/DE3124692A1/de
Priority to EP82901960A priority patent/EP0082167B1/de
Priority to US06/716,472 priority patent/US4586075A/en
Priority to PCT/DE1982/000128 priority patent/WO1983000074A1/de
Priority to DE8282901960T priority patent/DE3266915D1/de
Priority to JP57502002A priority patent/JPS58501013A/ja
Publication of DE3124692A1 publication Critical patent/DE3124692A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings

Landscapes

  • Rectifiers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE19813124692 1981-06-24 1981-06-24 "halbleitergleichrichter" Withdrawn DE3124692A1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE19813124692 DE3124692A1 (de) 1981-06-24 1981-06-24 "halbleitergleichrichter"
EP82901960A EP0082167B1 (de) 1981-06-24 1982-06-16 Halbleitergleichrichter
US06/716,472 US4586075A (en) 1981-06-24 1982-06-16 Semiconductor rectifier
PCT/DE1982/000128 WO1983000074A1 (fr) 1981-06-24 1982-06-16 Redresseur a semiconducteurs
DE8282901960T DE3266915D1 (de) 1981-06-24 1982-06-16 Semiconductor rectifier
JP57502002A JPS58501013A (ja) 1981-06-24 1982-06-16 半導体整流器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813124692 DE3124692A1 (de) 1981-06-24 1981-06-24 "halbleitergleichrichter"

Publications (1)

Publication Number Publication Date
DE3124692A1 true DE3124692A1 (de) 1983-01-13

Family

ID=6135221

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19813124692 Withdrawn DE3124692A1 (de) 1981-06-24 1981-06-24 "halbleitergleichrichter"
DE8282901960T Expired DE3266915D1 (de) 1981-06-24 1982-06-16 Semiconductor rectifier

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE8282901960T Expired DE3266915D1 (de) 1981-06-24 1982-06-16 Semiconductor rectifier

Country Status (5)

Country Link
US (1) US4586075A (enExample)
EP (1) EP0082167B1 (enExample)
JP (1) JPS58501013A (enExample)
DE (2) DE3124692A1 (enExample)
WO (1) WO1983000074A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3315583A1 (de) * 1983-04-29 1984-10-31 Siemens AG, 1000 Berlin und 8000 München Ein elektrisches bauteil tragendes, gut kuehlbares schaltungsmodul
GB2196178B (en) * 1986-10-09 1990-04-11 Amp Inc Semiconductor chip carrier system
US4987476A (en) * 1988-02-01 1991-01-22 General Instrument Corporation Brazed glass pre-passivated chip rectifier
US6420757B1 (en) 1999-09-14 2002-07-16 Vram Technologies, Llc Semiconductor diodes having low forward conduction voltage drop, low reverse current leakage, and high avalanche energy capability
US6433370B1 (en) * 2000-02-10 2002-08-13 Vram Technologies, Llc Method and apparatus for cylindrical semiconductor diodes
US6580150B1 (en) 2000-11-13 2003-06-17 Vram Technologies, Llc Vertical junction field effect semiconductor diodes
DE10057630A1 (de) 2000-11-21 2002-05-23 Bosch Gmbh Robert Brennkraftmaschine mit wenigstens einem Zylinder und einem in diesem beweglichen Hubkolben
US6537921B2 (en) 2001-05-23 2003-03-25 Vram Technologies, Llc Vertical metal oxide silicon field effect semiconductor diodes
JP2004195567A (ja) * 2002-12-16 2004-07-15 Denso Corp 圧入材、整流素子の圧入方法および整流装置
US6958275B2 (en) * 2003-03-11 2005-10-25 Integrated Discrete Devices, Llc MOSFET power transistors and methods
US7009223B1 (en) * 2004-08-31 2006-03-07 Sung Jung Minute Industry Co., Ltd. Rectification chip terminal structure
DE102011081687A1 (de) * 2011-08-26 2013-02-28 Robert Bosch Gmbh Halbleiterbauelement mit einem Kühlkörper

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3081374A (en) * 1960-05-27 1963-03-12 Itt Encapsulated diode assembly
US3267341A (en) * 1962-02-09 1966-08-16 Hughes Aircraft Co Double container arrangement for transistors
FR1436843A (fr) * 1965-03-20 1966-04-29 Radiotechnique Dispositif semi-conducteur, notamment pour hautes tensions, et son procédé de fabrication
US3412788A (en) * 1966-03-11 1968-11-26 Mallory & Co Inc P R Semiconductor device package
DE1944515A1 (de) * 1969-09-02 1971-03-04 Siemens Ag Halbleiterbauelement mit Kunststoffuellung
US3896480A (en) * 1971-10-22 1975-07-22 Gen Electric Semiconductor device with housing of varistor material
DE2158188A1 (de) * 1971-11-24 1973-06-07 Jenaer Glaswerk Schott & Gen Kaltpresschweissbare und kaltpressloetbare druckglasdurchfuehrungen
GB1489603A (en) * 1974-01-18 1977-10-26 Lucas Electrical Ltd Semi-conductor assemblies
FR2421465A1 (fr) * 1978-03-30 1979-10-26 Sev Marchal Diode de puissance a element semi-conducteur destinee notamment a equiper un pont redresseur d'alternateur
US4330790A (en) * 1980-03-24 1982-05-18 National Semiconductor Corporation Tape operated semiconductor device packaging

Also Published As

Publication number Publication date
EP0082167B1 (de) 1985-10-16
DE3266915D1 (de) 1985-11-21
JPS58501013A (ja) 1983-06-23
EP0082167A1 (de) 1983-06-29
JPH0221658B2 (enExample) 1990-05-15
US4586075A (en) 1986-04-29
WO1983000074A1 (fr) 1983-01-06

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee