DE3022268A1 - Traeger fuer ein netz zur verbindung von elektronischen bauelementen und verfahren zu seiner herstellung - Google Patents

Traeger fuer ein netz zur verbindung von elektronischen bauelementen und verfahren zu seiner herstellung

Info

Publication number
DE3022268A1
DE3022268A1 DE19803022268 DE3022268A DE3022268A1 DE 3022268 A1 DE3022268 A1 DE 3022268A1 DE 19803022268 DE19803022268 DE 19803022268 DE 3022268 A DE3022268 A DE 3022268A DE 3022268 A1 DE3022268 A1 DE 3022268A1
Authority
DE
Germany
Prior art keywords
aluminum
carrier
layer
electronic components
grain structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19803022268
Other languages
German (de)
English (en)
Inventor
Rouzic Jean Le
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LE ROUX YVON
Original Assignee
LE ROUX YVON
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LE ROUX YVON filed Critical LE ROUX YVON
Publication of DE3022268A1 publication Critical patent/DE3022268A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12583—Component contains compound of adjacent metal
    • Y10T428/1259—Oxide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE19803022268 1979-06-15 1980-06-13 Traeger fuer ein netz zur verbindung von elektronischen bauelementen und verfahren zu seiner herstellung Withdrawn DE3022268A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7915398A FR2459557A1 (fr) 1979-06-15 1979-06-15 Support metallique pour reseau d'interconnexion de composants electroniques et procede de fabrication de ce support

Publications (1)

Publication Number Publication Date
DE3022268A1 true DE3022268A1 (de) 1980-12-18

Family

ID=9226682

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19803022268 Withdrawn DE3022268A1 (de) 1979-06-15 1980-06-13 Traeger fuer ein netz zur verbindung von elektronischen bauelementen und verfahren zu seiner herstellung

Country Status (4)

Country Link
US (1) US4285781A (https=)
CA (1) CA1151316A (https=)
DE (1) DE3022268A1 (https=)
FR (1) FR2459557A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3501372A1 (de) * 1985-01-17 1986-07-17 Brown, Boveri & Cie Ag, 6800 Mannheim Substrat fuer leiterplatten

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2546878B1 (fr) * 1983-05-31 1988-04-08 Slonina Jean Pierre Plaque support d'un substrat ceramique, leger, a forte conductivite thermique et coefficient de dilatation adapte pour toutes applications dans le domaine electronique
JPS61108160A (ja) * 1984-11-01 1986-05-26 Nec Corp コンデンサ内蔵型半導体装置及びその製造方法
EP0221531A3 (en) * 1985-11-06 1992-02-19 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha High heat conductive insulated substrate and method of manufacturing the same
US4799309A (en) * 1987-12-24 1989-01-24 Ford Motor Company Method of making a rectifier and control module for an alternator
US4971894A (en) * 1989-02-13 1990-11-20 International Business Machines Corporation Method and structure for preventing wet etchant penetration at the interface between a resist mask and an underlying metal layer
IL110431A (en) * 1994-07-25 2001-08-08 Microcomponents And Systems Lt Method of manufacturing a composite structure for use in electronic device and structure manufactured by said method
IL120866A0 (en) 1997-05-20 1997-09-30 Micro Components Systems Ltd Process for producing an aluminum substrate
IL127256A (en) * 1998-11-25 2002-09-12 Micro Components Ltd Device for electronic packaging, a process for manufacturing thereof, and a pin jig fixture for use in the process
WO2007091976A1 (en) * 2006-02-10 2007-08-16 Opulent Electronics International Pte Ltd Anodised aluminium, dielectric, and method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1243254B (de) * 1964-08-07 1967-06-29 Telefunken Patent Traegerkoerper fuer Mikroschaltkreise
US3423821A (en) * 1965-03-18 1969-01-28 Hitachi Ltd Method of producing thin film integrated circuits
US3607381A (en) * 1968-06-14 1971-09-21 Platron Corp Spray process for creating electrical circuits
JPS4995591A (https=) * 1973-01-12 1974-09-10
US3941630A (en) * 1974-04-29 1976-03-02 Rca Corporation Method of fabricating a charged couple radiation sensing device
GB1536177A (en) * 1976-12-07 1978-12-20 Nat Res Dev Anodising a compound semiconductor
NL169394C (nl) * 1977-11-23 1982-07-01 Gennady Grigorievich Smolko Elektronisch apparaat.
FR2414281A1 (fr) * 1978-01-05 1979-08-03 Smolko Gennady Perfectionnements apportes aux dispositifs electroniques, notamment aux microcircuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3501372A1 (de) * 1985-01-17 1986-07-17 Brown, Boveri & Cie Ag, 6800 Mannheim Substrat fuer leiterplatten

Also Published As

Publication number Publication date
FR2459557B1 (https=) 1982-05-21
CA1151316A (en) 1983-08-02
FR2459557A1 (fr) 1981-01-09
US4285781A (en) 1981-08-25

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee