FR2459557A1 - Support metallique pour reseau d'interconnexion de composants electroniques et procede de fabrication de ce support - Google Patents

Support metallique pour reseau d'interconnexion de composants electroniques et procede de fabrication de ce support Download PDF

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Publication number
FR2459557A1
FR2459557A1 FR7915398A FR7915398A FR2459557A1 FR 2459557 A1 FR2459557 A1 FR 2459557A1 FR 7915398 A FR7915398 A FR 7915398A FR 7915398 A FR7915398 A FR 7915398A FR 2459557 A1 FR2459557 A1 FR 2459557A1
Authority
FR
France
Prior art keywords
aluminum
layer
support
substrate
support according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7915398A
Other languages
English (en)
French (fr)
Other versions
FR2459557B1 (https=
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LEROUZIX JEAN
Original Assignee
LEROUZIX JEAN
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LEROUZIX JEAN filed Critical LEROUZIX JEAN
Priority to FR7915398A priority Critical patent/FR2459557A1/fr
Priority to US06/156,263 priority patent/US4285781A/en
Priority to CA000353906A priority patent/CA1151316A/en
Priority to DE19803022268 priority patent/DE3022268A1/de
Publication of FR2459557A1 publication Critical patent/FR2459557A1/fr
Application granted granted Critical
Publication of FR2459557B1 publication Critical patent/FR2459557B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12583—Component contains compound of adjacent metal
    • Y10T428/1259—Oxide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
FR7915398A 1979-06-15 1979-06-15 Support metallique pour reseau d'interconnexion de composants electroniques et procede de fabrication de ce support Granted FR2459557A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR7915398A FR2459557A1 (fr) 1979-06-15 1979-06-15 Support metallique pour reseau d'interconnexion de composants electroniques et procede de fabrication de ce support
US06/156,263 US4285781A (en) 1979-06-15 1980-06-03 Metal support for an electronic component interconnection network and process for manufacturing this support
CA000353906A CA1151316A (en) 1979-06-15 1980-06-12 Metal support for an electronic component interconnection network and process for manufacturing this support
DE19803022268 DE3022268A1 (de) 1979-06-15 1980-06-13 Traeger fuer ein netz zur verbindung von elektronischen bauelementen und verfahren zu seiner herstellung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7915398A FR2459557A1 (fr) 1979-06-15 1979-06-15 Support metallique pour reseau d'interconnexion de composants electroniques et procede de fabrication de ce support

Publications (2)

Publication Number Publication Date
FR2459557A1 true FR2459557A1 (fr) 1981-01-09
FR2459557B1 FR2459557B1 (https=) 1982-05-21

Family

ID=9226682

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7915398A Granted FR2459557A1 (fr) 1979-06-15 1979-06-15 Support metallique pour reseau d'interconnexion de composants electroniques et procede de fabrication de ce support

Country Status (4)

Country Link
US (1) US4285781A (https=)
CA (1) CA1151316A (https=)
DE (1) DE3022268A1 (https=)
FR (1) FR2459557A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2546878A1 (fr) * 1983-05-31 1984-12-07 Slonina Jean Pierre Plaque support d'un substrat ceramique, leger, a forte conductivite thermique et coefficient de dilatation adapte pour toutes applications dans le domaine electronique
EP0180219A3 (en) * 1984-11-01 1986-12-17 Nec Corporation Capacitor built-in integrated circuit packaged unit and process of fabrication thereof
EP0221531A3 (en) * 1985-11-06 1992-02-19 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha High heat conductive insulated substrate and method of manufacturing the same
WO1996003771A1 (en) * 1994-07-25 1996-02-08 Micro Components & Systems Ltd. Method of manufacturing a composite structure for use in electronic devices and structure, manufactured by said method
WO1998053499A1 (en) * 1997-05-20 1998-11-26 Micro Components Ltd. Substrate for electronic packaging, pin jig fixture
WO2000031797A3 (en) * 1998-11-25 2000-11-23 Micro Components Ltd Device for electronic packaging, pin jig fixture

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3501372A1 (de) * 1985-01-17 1986-07-17 Brown, Boveri & Cie Ag, 6800 Mannheim Substrat fuer leiterplatten
US4799309A (en) * 1987-12-24 1989-01-24 Ford Motor Company Method of making a rectifier and control module for an alternator
US4971894A (en) * 1989-02-13 1990-11-20 International Business Machines Corporation Method and structure for preventing wet etchant penetration at the interface between a resist mask and an underlying metal layer
WO2007091976A1 (en) * 2006-02-10 2007-08-16 Opulent Electronics International Pte Ltd Anodised aluminium, dielectric, and method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1243254B (de) * 1964-08-07 1967-06-29 Telefunken Patent Traegerkoerper fuer Mikroschaltkreise
NL7712929A (en) * 1977-11-23 1979-05-28 Gennady Grigorievich Smolko Semiconductor with dielectric substrate in housing - has contact zone connected to capacitor with coatings separated by dielectric
FR2414281A1 (fr) * 1978-01-05 1979-08-03 Smolko Gennady Perfectionnements apportes aux dispositifs electroniques, notamment aux microcircuits

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3423821A (en) * 1965-03-18 1969-01-28 Hitachi Ltd Method of producing thin film integrated circuits
US3607381A (en) * 1968-06-14 1971-09-21 Platron Corp Spray process for creating electrical circuits
JPS4995591A (https=) * 1973-01-12 1974-09-10
US3941630A (en) * 1974-04-29 1976-03-02 Rca Corporation Method of fabricating a charged couple radiation sensing device
GB1536177A (en) * 1976-12-07 1978-12-20 Nat Res Dev Anodising a compound semiconductor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1243254B (de) * 1964-08-07 1967-06-29 Telefunken Patent Traegerkoerper fuer Mikroschaltkreise
NL7712929A (en) * 1977-11-23 1979-05-28 Gennady Grigorievich Smolko Semiconductor with dielectric substrate in housing - has contact zone connected to capacitor with coatings separated by dielectric
FR2414281A1 (fr) * 1978-01-05 1979-08-03 Smolko Gennady Perfectionnements apportes aux dispositifs electroniques, notamment aux microcircuits

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2546878A1 (fr) * 1983-05-31 1984-12-07 Slonina Jean Pierre Plaque support d'un substrat ceramique, leger, a forte conductivite thermique et coefficient de dilatation adapte pour toutes applications dans le domaine electronique
EP0180219A3 (en) * 1984-11-01 1986-12-17 Nec Corporation Capacitor built-in integrated circuit packaged unit and process of fabrication thereof
EP0221531A3 (en) * 1985-11-06 1992-02-19 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha High heat conductive insulated substrate and method of manufacturing the same
WO1996003771A1 (en) * 1994-07-25 1996-02-08 Micro Components & Systems Ltd. Method of manufacturing a composite structure for use in electronic devices and structure, manufactured by said method
US5661341A (en) * 1994-07-25 1997-08-26 Microcomponents And Systems Ltd. Method of manufacturing a composite structure for use in electronic devices and structure, manufactured by said method
WO1998053499A1 (en) * 1997-05-20 1998-11-26 Micro Components Ltd. Substrate for electronic packaging, pin jig fixture
US6448510B1 (en) 1997-05-20 2002-09-10 Micro Components Ltd. Substrate for electronic packaging, pin jig fixture
WO2000031797A3 (en) * 1998-11-25 2000-11-23 Micro Components Ltd Device for electronic packaging, pin jig fixture

Also Published As

Publication number Publication date
FR2459557B1 (https=) 1982-05-21
CA1151316A (en) 1983-08-02
US4285781A (en) 1981-08-25
DE3022268A1 (de) 1980-12-18

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