DE2942704A1 - Verfahren zur herstellung eines monolithischen kondensators und danach hergestellter kondensator - Google Patents

Verfahren zur herstellung eines monolithischen kondensators und danach hergestellter kondensator

Info

Publication number
DE2942704A1
DE2942704A1 DE19792942704 DE2942704A DE2942704A1 DE 2942704 A1 DE2942704 A1 DE 2942704A1 DE 19792942704 DE19792942704 DE 19792942704 DE 2942704 A DE2942704 A DE 2942704A DE 2942704 A1 DE2942704 A1 DE 2942704A1
Authority
DE
Germany
Prior art keywords
capacitor
electrodes
parts
base
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19792942704
Other languages
German (de)
English (en)
Inventor
John L Galvagni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Avx Components Corp
Original Assignee
AVX Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AVX Corp filed Critical AVX Corp
Publication of DE2942704A1 publication Critical patent/DE2942704A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE19792942704 1978-11-16 1979-10-23 Verfahren zur herstellung eines monolithischen kondensators und danach hergestellter kondensator Ceased DE2942704A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US96124778A 1978-11-16 1978-11-16

Publications (1)

Publication Number Publication Date
DE2942704A1 true DE2942704A1 (de) 1980-05-29

Family

ID=25504239

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19792942704 Ceased DE2942704A1 (de) 1978-11-16 1979-10-23 Verfahren zur herstellung eines monolithischen kondensators und danach hergestellter kondensator

Country Status (5)

Country Link
JP (1) JPS5571018A (enrdf_load_stackoverflow)
CA (1) CA1145423A (enrdf_load_stackoverflow)
DE (1) DE2942704A1 (enrdf_load_stackoverflow)
FR (1) FR2441912A1 (enrdf_load_stackoverflow)
GB (1) GB2034521B (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58196007A (ja) * 1982-05-12 1983-11-15 日本電気株式会社 微小電子部品
US4618911A (en) * 1984-11-19 1986-10-21 Sfe Technologies End termination for chip capacitor
JP2915716B2 (ja) * 1992-08-26 1999-07-05 ティーディーケイ株式会社 電子部品
JP3747940B2 (ja) * 2004-06-03 2006-02-22 株式会社村田製作所 積層コンデンサおよびその製造方法
JP4803451B2 (ja) * 2006-12-26 2011-10-26 Ｔｄｋ株式会社 電子部品及びその実装構造
CN114241905B (zh) * 2021-12-04 2024-01-23 昆山国显光电有限公司 显示模组及显示装置
KR102736853B1 (ko) * 2022-07-04 2024-11-29 이성재 방수기능을 갖는 바닥 코어용 멀티코어장치

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1826276U (de) * 1959-06-23 1961-02-09 Messwandler Bau Gmbh Elektrischer flachwickelkondensator, insbesondere fuer hochspannungs- und hochstrom-stosspruefanlagen.
DE1564028A1 (de) * 1965-10-05 1969-12-18 Gen Electric Elektrisches Bauelement
DE2111516A1 (de) * 1970-03-11 1971-10-07 Union Carbide Corp Keramischer Mehrschichtenkondensator und Verfahren zu seiner Herstellung
DE2064007B2 (de) * 1969-12-29 1974-03-21 Erie Technological Products Inc., Erie, Pa. (V.St.A.) Keramischer Kondensator
DE2423851B2 (de) * 1974-05-16 1977-02-10 Siemens AG, 1000 Berlin und 8000 München Keramikscheibenkondensator
DE2904649A1 (de) * 1978-02-08 1979-08-30 Hitachi Ltd Harzzusammensetzung und verfahren zur befestigung von bauteilen auf leiterplatten

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1495139A (fr) * 1966-09-23 1967-09-15 Gen Electric Eléments moulés pour circuits électriques ou électroniques

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1826276U (de) * 1959-06-23 1961-02-09 Messwandler Bau Gmbh Elektrischer flachwickelkondensator, insbesondere fuer hochspannungs- und hochstrom-stosspruefanlagen.
DE1564028A1 (de) * 1965-10-05 1969-12-18 Gen Electric Elektrisches Bauelement
DE2064007B2 (de) * 1969-12-29 1974-03-21 Erie Technological Products Inc., Erie, Pa. (V.St.A.) Keramischer Kondensator
DE2111516A1 (de) * 1970-03-11 1971-10-07 Union Carbide Corp Keramischer Mehrschichtenkondensator und Verfahren zu seiner Herstellung
DE2423851B2 (de) * 1974-05-16 1977-02-10 Siemens AG, 1000 Berlin und 8000 München Keramikscheibenkondensator
DE2904649A1 (de) * 1978-02-08 1979-08-30 Hitachi Ltd Harzzusammensetzung und verfahren zur befestigung von bauteilen auf leiterplatten

Also Published As

Publication number Publication date
CA1145423A (en) 1983-04-26
JPS6133246B2 (enrdf_load_stackoverflow) 1986-08-01
FR2441912B1 (enrdf_load_stackoverflow) 1984-04-20
JPS5571018A (en) 1980-05-28
GB2034521B (en) 1983-07-27
FR2441912A1 (fr) 1980-06-13
GB2034521A (en) 1980-06-04

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8125 Change of the main classification

Ipc: H01G 1/147

8131 Rejection