JPS5571018A - Method of manufacturing unit ceramic capacitor and capacitor unit - Google Patents

Method of manufacturing unit ceramic capacitor and capacitor unit

Info

Publication number
JPS5571018A
JPS5571018A JP14830879A JP14830879A JPS5571018A JP S5571018 A JPS5571018 A JP S5571018A JP 14830879 A JP14830879 A JP 14830879A JP 14830879 A JP14830879 A JP 14830879A JP S5571018 A JPS5571018 A JP S5571018A
Authority
JP
Japan
Prior art keywords
capacitor
unit
manufacturing
ceramic capacitor
manufacturing unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14830879A
Other languages
Japanese (ja)
Other versions
JPS6133246B2 (en
Inventor
Eru Garubaguni Jiyon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Avx Components Corp
Original Assignee
AVX Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AVX Corp filed Critical AVX Corp
Publication of JPS5571018A publication Critical patent/JPS5571018A/en
Publication of JPS6133246B2 publication Critical patent/JPS6133246B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP14830879A 1978-11-16 1979-11-15 Method of manufacturing unit ceramic capacitor and capacitor unit Granted JPS5571018A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US96124778A 1978-11-16 1978-11-16

Publications (2)

Publication Number Publication Date
JPS5571018A true JPS5571018A (en) 1980-05-28
JPS6133246B2 JPS6133246B2 (en) 1986-08-01

Family

ID=25504239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14830879A Granted JPS5571018A (en) 1978-11-16 1979-11-15 Method of manufacturing unit ceramic capacitor and capacitor unit

Country Status (5)

Country Link
JP (1) JPS5571018A (en)
CA (1) CA1145423A (en)
DE (1) DE2942704A1 (en)
FR (1) FR2441912A1 (en)
GB (1) GB2034521B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58196007A (en) * 1982-05-12 1983-11-15 日本電気株式会社 Ultrafine electronic part
JP2008166301A (en) * 2006-12-26 2008-07-17 Tdk Corp Electronic component, and mounting structure thereof

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4618911A (en) * 1984-11-19 1986-10-21 Sfe Technologies End termination for chip capacitor
JP2915716B2 (en) * 1992-08-26 1999-07-05 ティーディーケイ株式会社 Electronic components
JP3747940B2 (en) * 2004-06-03 2006-02-22 株式会社村田製作所 Multilayer capacitor and manufacturing method thereof
CN114241905B (en) * 2021-12-04 2024-01-23 昆山国显光电有限公司 Display module and display device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1826276U (en) * 1959-06-23 1961-02-09 Messwandler Bau Gmbh ELECTRIC FLAT-WINDING CAPACITOR, IN PARTICULAR FOR HIGH VOLTAGE AND HIGH CURRENT IMPACT DETECTION SYSTEMS.
GB1117437A (en) * 1965-10-05 1968-06-19 Gen Electric Improvements in molded electronic component
FR1495139A (en) * 1966-09-23 1967-09-15 Gen Electric Molded elements for electrical or electronic circuits
US3590348A (en) * 1969-12-29 1971-06-29 Erie Technological Prod Inc Radial lead ceramic capacitor with integral standoff feet
JPS54105774A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58196007A (en) * 1982-05-12 1983-11-15 日本電気株式会社 Ultrafine electronic part
JPS6348416B2 (en) * 1982-05-12 1988-09-29 Nippon Electric Co
JP2008166301A (en) * 2006-12-26 2008-07-17 Tdk Corp Electronic component, and mounting structure thereof

Also Published As

Publication number Publication date
GB2034521B (en) 1983-07-27
CA1145423A (en) 1983-04-26
GB2034521A (en) 1980-06-04
JPS6133246B2 (en) 1986-08-01
DE2942704A1 (en) 1980-05-29
FR2441912B1 (en) 1984-04-20
FR2441912A1 (en) 1980-06-13

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