DE2903517A1 - Messfuehler und damit ausgestattete testanordnung sowie damit durchzufuehrendes testverfahren - Google Patents
Messfuehler und damit ausgestattete testanordnung sowie damit durchzufuehrendes testverfahrenInfo
- Publication number
- DE2903517A1 DE2903517A1 DE19792903517 DE2903517A DE2903517A1 DE 2903517 A1 DE2903517 A1 DE 2903517A1 DE 19792903517 DE19792903517 DE 19792903517 DE 2903517 A DE2903517 A DE 2903517A DE 2903517 A1 DE2903517 A1 DE 2903517A1
- Authority
- DE
- Germany
- Prior art keywords
- detector
- semiconductor wafer
- arm
- circuit
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000012360 testing method Methods 0.000 title claims description 58
- 238000010998 test method Methods 0.000 title claims description 4
- 239000000523 sample Substances 0.000 claims description 128
- 239000004065 semiconductor Substances 0.000 claims description 82
- 239000000463 material Substances 0.000 claims description 41
- 239000004020 conductor Substances 0.000 claims description 16
- 238000011156 evaluation Methods 0.000 claims description 14
- 238000012544 monitoring process Methods 0.000 claims description 14
- 239000000872 buffer Substances 0.000 claims description 10
- 230000000694 effects Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 229910001369 Brass Inorganic materials 0.000 claims description 3
- 239000010951 brass Substances 0.000 claims description 3
- 238000013459 approach Methods 0.000 claims description 2
- 230000000712 assembly Effects 0.000 claims 2
- 238000000429 assembly Methods 0.000 claims 2
- 230000005284 excitation Effects 0.000 claims 1
- 230000002452 interceptive effect Effects 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 230000009466 transformation Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 59
- 239000000758 substrate Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000003708 edge detection Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US87356478A | 1978-01-30 | 1978-01-30 | |
| US05/893,118 US4195259A (en) | 1978-04-04 | 1978-04-04 | Multiprobe test system and method of using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2903517A1 true DE2903517A1 (de) | 1979-08-02 |
Family
ID=27128303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19792903517 Withdrawn DE2903517A1 (de) | 1978-01-30 | 1979-01-30 | Messfuehler und damit ausgestattete testanordnung sowie damit durchzufuehrendes testverfahren |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS54145482A (enrdf_load_stackoverflow) |
| DE (1) | DE2903517A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2425148B1 (enrdf_load_stackoverflow) |
| GB (2) | GB2094479B (enrdf_load_stackoverflow) |
| IT (1) | IT1113297B (enrdf_load_stackoverflow) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0028719B1 (en) * | 1979-11-05 | 1984-05-30 | Texas Instruments Incorporated | Probe assembly for testing integrated circuits |
| JPS58164236U (ja) * | 1982-04-27 | 1983-11-01 | 日本電気ホームエレクトロニクス株式会社 | 半導体ウエ−ハ特性測定装置 |
| IL79820A0 (en) * | 1985-09-26 | 1986-11-30 | Tektronix Inc | Wafer probe head,and method of assembling same |
| US4758785A (en) * | 1986-09-03 | 1988-07-19 | Tektronix, Inc. | Pressure control apparatus for use in an integrated circuit testing station |
| US4673839A (en) * | 1986-09-08 | 1987-06-16 | Tektronix, Inc. | Piezoelectric pressure sensing apparatus for integrated circuit testing stations |
| US5012186A (en) * | 1990-06-08 | 1991-04-30 | Cascade Microtech, Inc. | Electrical probe with contact force protection |
| EP0547251A1 (en) * | 1991-12-14 | 1993-06-23 | International Business Machines Corporation | A method for testing a micro circuit |
| US6232789B1 (en) | 1997-05-28 | 2001-05-15 | Cascade Microtech, Inc. | Probe holder for low current measurements |
| DE19952943C2 (de) * | 1999-11-03 | 2003-07-03 | Infineon Technologies Ag | Nadelkarten-Justageeinrichtung zur Planarisierung von Nadelsätzen einer Nadelkarte |
| DE10143173A1 (de) | 2000-12-04 | 2002-06-06 | Cascade Microtech Inc | Wafersonde |
| WO2003100445A2 (en) | 2002-05-23 | 2003-12-04 | Cascade Microtech, Inc. | Probe for testing a device under test |
| US6724205B1 (en) | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
| US7633306B2 (en) | 2003-03-14 | 2009-12-15 | Rudolph Technologies, Inc. | System and method of measuring probe float |
| US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
| KR20060126700A (ko) | 2003-12-24 | 2006-12-08 | 캐스케이드 마이크로테크 인코포레이티드 | 능동 웨이퍼 프로브 |
| EP1789812A2 (en) | 2004-09-13 | 2007-05-30 | Cascade Microtech, Inc. | Double sided probing structures |
| US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
| US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
| US7449899B2 (en) | 2005-06-08 | 2008-11-11 | Cascade Microtech, Inc. | Probe for high frequency signals |
| US7619419B2 (en) | 2005-06-13 | 2009-11-17 | Cascade Microtech, Inc. | Wideband active-passive differential signal probe |
| WO2007146285A2 (en) | 2006-06-09 | 2007-12-21 | Cascade Microtech, Inc. | Differential signal probe with integral balun |
| US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
| US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
| US7443186B2 (en) | 2006-06-12 | 2008-10-28 | Cascade Microtech, Inc. | On-wafer test structures for differential signals |
| US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
| US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
| CN107015137B (zh) * | 2017-05-26 | 2023-12-08 | 深圳市赛伦北斗科技有限责任公司 | 一种电路板检测装置、系统及方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1063381A (en) * | 1963-01-18 | 1967-03-30 | Wilmot Breeden Ltd | Improvements in or relating to surface testing apparatus |
| US3446065A (en) * | 1965-08-11 | 1969-05-27 | Transistor Automation Corp | Automatic probing apparatus |
| US3810017A (en) * | 1972-05-15 | 1974-05-07 | Teledyne Inc | Precision probe for testing micro-electronic units |
| US3849728A (en) * | 1973-08-21 | 1974-11-19 | Wentworth Labor Inc | Fixed point probe card and an assembly and repair fixture therefor |
| JPS5178692A (enrdf_load_stackoverflow) * | 1974-12-29 | 1976-07-08 | Sony Corp |
-
1979
- 1979-01-29 GB GB8127051A patent/GB2094479B/en not_active Expired
- 1979-01-29 GB GB7903073A patent/GB2014315B/en not_active Expired
- 1979-01-29 IT IT47813/79A patent/IT1113297B/it active
- 1979-01-30 DE DE19792903517 patent/DE2903517A1/de not_active Withdrawn
- 1979-01-30 JP JP961479A patent/JPS54145482A/ja active Granted
- 1979-01-30 FR FR7902318A patent/FR2425148B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| IT7947813A0 (it) | 1979-01-29 |
| GB2094479B (en) | 1983-03-16 |
| GB2014315B (en) | 1983-02-02 |
| IT1113297B (it) | 1986-01-20 |
| GB2014315A (en) | 1979-08-22 |
| JPH039425B2 (enrdf_load_stackoverflow) | 1991-02-08 |
| GB2094479A (en) | 1982-09-15 |
| JPS54145482A (en) | 1979-11-13 |
| FR2425148A1 (enrdf_load_stackoverflow) | 1979-11-30 |
| FR2425148B1 (enrdf_load_stackoverflow) | 1985-06-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8141 | Disposal/no request for examination |