DE2853328C2 - Halbleiteranordnung - Google Patents
HalbleiteranordnungInfo
- Publication number
- DE2853328C2 DE2853328C2 DE2853328A DE2853328A DE2853328C2 DE 2853328 C2 DE2853328 C2 DE 2853328C2 DE 2853328 A DE2853328 A DE 2853328A DE 2853328 A DE2853328 A DE 2853328A DE 2853328 C2 DE2853328 C2 DE 2853328C2
- Authority
- DE
- Germany
- Prior art keywords
- stiffening body
- film
- semiconductor
- edges
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims description 45
- 239000004020 conductor Substances 0.000 claims description 15
- 239000011888 foil Substances 0.000 claims description 12
- 239000004033 plastic Substances 0.000 claims description 11
- 239000004922 lacquer Substances 0.000 claims description 3
- 239000002966 varnish Substances 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- 229920001225 polyester resin Polymers 0.000 claims description 2
- 239000004645 polyester resin Substances 0.000 claims description 2
- 239000011152 fibreglass Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7713758A NL7713758A (nl) | 1977-12-13 | 1977-12-13 | Halfgeleiderinrichting. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2853328A1 DE2853328A1 (de) | 1979-06-21 |
| DE2853328C2 true DE2853328C2 (de) | 1985-08-01 |
Family
ID=19829740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2853328A Expired DE2853328C2 (de) | 1977-12-13 | 1978-12-09 | Halbleiteranordnung |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4215359A (enExample) |
| JP (1) | JPS5489571A (enExample) |
| BR (1) | BR7808124A (enExample) |
| DE (1) | DE2853328C2 (enExample) |
| FR (1) | FR2412167A1 (enExample) |
| GB (1) | GB2010013B (enExample) |
| NL (1) | NL7713758A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3912893A1 (de) * | 1989-04-19 | 1990-10-25 | Siemens Ag | Als mikropack montierte halbleiteranordnung |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0016522B1 (en) * | 1979-02-19 | 1982-12-22 | Fujitsu Limited | Semiconductor device and method for manufacturing the same |
| JPS57173113A (en) * | 1981-04-17 | 1982-10-25 | Mitsubishi Heavy Ind Ltd | Continuous mixer for powdered body milk of cement, etc. |
| US4866571A (en) * | 1982-06-21 | 1989-09-12 | Olin Corporation | Semiconductor package |
| US5014159A (en) * | 1982-04-19 | 1991-05-07 | Olin Corporation | Semiconductor package |
| EP0092019A3 (en) * | 1982-04-19 | 1985-12-27 | Olin Corporation | Improved semiconductor package |
| US4819041A (en) * | 1983-12-30 | 1989-04-04 | Amp Incorporated | Surface mounted integrated circuit chip package and method for making same |
| US4843036A (en) * | 1987-06-29 | 1989-06-27 | Eastman Kodak Company | Method for encapsulating electronic devices |
| DE69010546T2 (de) * | 1989-04-17 | 1995-02-09 | Matsushita Electric Ind Co Ltd | Hochfrequenz-Halbleiteranordnung. |
| US5077598A (en) * | 1989-11-08 | 1991-12-31 | Hewlett-Packard Company | Strain relief flip-chip integrated circuit assembly with test fixturing |
| US5047830A (en) * | 1990-05-22 | 1991-09-10 | Amp Incorporated | Field emitter array integrated circuit chip interconnection |
| EP0598914B1 (en) * | 1992-06-05 | 2000-10-11 | Mitsui Chemicals, Inc. | Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board |
| US6891110B1 (en) | 1999-03-24 | 2005-05-10 | Motorola, Inc. | Circuit chip connector and method of connecting a circuit chip |
| CA2302957C (en) * | 1999-03-24 | 2009-06-30 | Morgan Adhesives Company | Circuit chip connector and method of connecting a circuit chip |
| EP1109214A1 (de) * | 1999-12-16 | 2001-06-20 | Infineon Technologies AG | Anordnung und Verfahren zur Kontaktierung von Schaltkreisen |
| RU2190768C1 (ru) * | 2001-02-07 | 2002-10-10 | Военный автомобильный институт | Каталитический нейтрализатор для двс |
| NL1021245C2 (nl) * | 2002-08-09 | 2004-02-10 | Tno | Drager voor tenminste een IC en systemen omvattende een dergelijke drager en een IC en/of een dergelijke drager en een verbindingsplaat. |
| US20050282355A1 (en) * | 2004-06-18 | 2005-12-22 | Edwards David N | High density bonding of electrical devices |
| DE102004030383A1 (de) * | 2004-06-23 | 2006-01-12 | Infineon Technologies Ag | Bondfolie und Halbleiterbauteil mit Bondfolie sowie Verfahren zu deren Herstellung |
| US8067253B2 (en) * | 2005-12-21 | 2011-11-29 | Avery Dennison Corporation | Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2151765C2 (de) * | 1970-11-05 | 1983-06-16 | Honeywell Information Systems Italia S.p.A., Caluso, Torino | Verfahren zum Kontaktieren von integrierten Schaltungen mit Beam-Lead-Anschlüssen |
| US3743893A (en) * | 1971-05-27 | 1973-07-03 | Mitsubishi Electric Corp | Fluid cooled compression bonded semiconductor device structure |
| DE2253627A1 (de) * | 1972-11-02 | 1974-05-16 | Philips Patentverwaltung | Elektrisches bauelement in mikrotechnik, vorzugsweise halbleiterbauelement |
-
1977
- 1977-12-13 NL NL7713758A patent/NL7713758A/xx not_active Application Discontinuation
-
1978
- 1978-11-08 US US05/958,769 patent/US4215359A/en not_active Expired - Lifetime
- 1978-12-08 GB GB7847711A patent/GB2010013B/en not_active Expired
- 1978-12-09 DE DE2853328A patent/DE2853328C2/de not_active Expired
- 1978-12-11 BR BR7808124A patent/BR7808124A/pt unknown
- 1978-12-11 FR FR7834817A patent/FR2412167A1/fr active Granted
- 1978-12-11 JP JP15213178A patent/JPS5489571A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3912893A1 (de) * | 1989-04-19 | 1990-10-25 | Siemens Ag | Als mikropack montierte halbleiteranordnung |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5489571A (en) | 1979-07-16 |
| US4215359A (en) | 1980-07-29 |
| JPS5746662B2 (enExample) | 1982-10-05 |
| FR2412167A1 (fr) | 1979-07-13 |
| NL7713758A (nl) | 1979-06-15 |
| GB2010013A (en) | 1979-06-20 |
| DE2853328A1 (de) | 1979-06-21 |
| FR2412167B1 (enExample) | 1984-10-19 |
| GB2010013B (en) | 1982-02-17 |
| BR7808124A (pt) | 1979-07-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |