DE2752655A1 - Elektronisches bauelement - Google Patents

Elektronisches bauelement

Info

Publication number
DE2752655A1
DE2752655A1 DE19772752655 DE2752655A DE2752655A1 DE 2752655 A1 DE2752655 A1 DE 2752655A1 DE 19772752655 DE19772752655 DE 19772752655 DE 2752655 A DE2752655 A DE 2752655A DE 2752655 A1 DE2752655 A1 DE 2752655A1
Authority
DE
Germany
Prior art keywords
component
electronic
heat sink
carrier
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19772752655
Other languages
German (de)
English (en)
Other versions
DE2752655C2 (https=
Inventor
Rolf Hohmann
H Eckhard Dr Ing Krueger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blaupunkt Werke GmbH
Original Assignee
Blaupunkt Werke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2742882A external-priority patent/DE2742882C2/de
Application filed by Blaupunkt Werke GmbH filed Critical Blaupunkt Werke GmbH
Priority to DE19772752655 priority Critical patent/DE2752655A1/de
Publication of DE2752655A1 publication Critical patent/DE2752655A1/de
Application granted granted Critical
Publication of DE2752655C2 publication Critical patent/DE2752655C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE19772752655 1977-09-23 1977-11-25 Elektronisches bauelement Granted DE2752655A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19772752655 DE2752655A1 (de) 1977-09-23 1977-11-25 Elektronisches bauelement

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2742882A DE2742882C2 (de) 1977-09-23 1977-09-23 Elektronisches Bauelement
DE19772752655 DE2752655A1 (de) 1977-09-23 1977-11-25 Elektronisches bauelement

Publications (2)

Publication Number Publication Date
DE2752655A1 true DE2752655A1 (de) 1979-06-07
DE2752655C2 DE2752655C2 (https=) 1988-03-24

Family

ID=6024628

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19772752655 Granted DE2752655A1 (de) 1977-09-23 1977-11-25 Elektronisches bauelement

Country Status (1)

Country Link
DE (1) DE2752655A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3300693A1 (de) * 1982-02-05 1983-09-22 Hitachi, Ltd., Tokyo Halbleiteranordnung und verfahren zu ihrer herstellung
DE3514253A1 (de) * 1984-04-19 1985-10-31 Hitachi, Ltd., Tokio/Tokyo Halbleitereinrichtung
DE3433779A1 (de) * 1984-09-14 1986-03-27 Robert Bosch Gmbh, 7000 Stuttgart Schutzschicht fuer halbleiterschaltungen
DE3814469A1 (de) * 1987-04-30 1988-11-17 Mitsubishi Electric Corp Halbleiteranordnung und verfahren zu ihrer herstellung

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4118398C2 (de) * 1991-06-05 1994-07-21 Ant Nachrichtentech Elektronik-Baugruppe mit Metallgehäuse
DE4416460C2 (de) * 1994-05-10 1996-04-11 Hella Kg Hueck & Co Schaltungsanordnung, insbesondere zur Gebläsesteuerung für Kraftfahrzeuge

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2202802A1 (de) * 1971-02-05 1972-08-17 Philips Nv Halbleiteranordnung
DE2124887A1 (de) * 1971-05-19 1972-12-07 Philips Patentverwaltung Elektrisches Bauelement, vorzugsweise Halbleiterbauelement, mit Folienkontaktierung
DE2414297A1 (de) * 1974-03-25 1975-10-02 Siemens Ag Perforiertes kunststoffband zur teilautomatisierten herstellung von zwischentraegern fuer halbleiterbauelemente
DE2444418A1 (de) * 1974-09-17 1976-04-01 Siemens Ag Gehaeuse fuer halbleitereinheit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2202802A1 (de) * 1971-02-05 1972-08-17 Philips Nv Halbleiteranordnung
DE2124887A1 (de) * 1971-05-19 1972-12-07 Philips Patentverwaltung Elektrisches Bauelement, vorzugsweise Halbleiterbauelement, mit Folienkontaktierung
DE2414297A1 (de) * 1974-03-25 1975-10-02 Siemens Ag Perforiertes kunststoffband zur teilautomatisierten herstellung von zwischentraegern fuer halbleiterbauelemente
DE2444418A1 (de) * 1974-09-17 1976-04-01 Siemens Ag Gehaeuse fuer halbleitereinheit

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
In Betracht gezogenes älteres Patent: DE-PS 27 42 882 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3300693A1 (de) * 1982-02-05 1983-09-22 Hitachi, Ltd., Tokyo Halbleiteranordnung und verfahren zu ihrer herstellung
DE3514253A1 (de) * 1984-04-19 1985-10-31 Hitachi, Ltd., Tokio/Tokyo Halbleitereinrichtung
DE3433779A1 (de) * 1984-09-14 1986-03-27 Robert Bosch Gmbh, 7000 Stuttgart Schutzschicht fuer halbleiterschaltungen
DE3814469A1 (de) * 1987-04-30 1988-11-17 Mitsubishi Electric Corp Halbleiteranordnung und verfahren zu ihrer herstellung

Also Published As

Publication number Publication date
DE2752655C2 (https=) 1988-03-24

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