DE2728313A1 - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
DE2728313A1
DE2728313A1 DE19772728313 DE2728313A DE2728313A1 DE 2728313 A1 DE2728313 A1 DE 2728313A1 DE 19772728313 DE19772728313 DE 19772728313 DE 2728313 A DE2728313 A DE 2728313A DE 2728313 A1 DE2728313 A1 DE 2728313A1
Authority
DE
Germany
Prior art keywords
semiconductor
semiconductor elements
semiconductor component
housing
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19772728313
Other languages
German (de)
English (en)
Inventor
Werner Egerbacher
Heinz Martin
Werner Mitzkus
Dieter Wunderlich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DE19772728313 priority Critical patent/DE2728313A1/de
Priority to GB19726/78A priority patent/GB1559969A/en
Priority to FR7817756A priority patent/FR2395603A1/fr
Priority to US05/916,197 priority patent/US4218695A/en
Priority to JP7529378A priority patent/JPS5410672A/ja
Publication of DE2728313A1 publication Critical patent/DE2728313A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thyristors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
DE19772728313 1977-06-23 1977-06-23 Halbleiterbauelement Ceased DE2728313A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE19772728313 DE2728313A1 (de) 1977-06-23 1977-06-23 Halbleiterbauelement
GB19726/78A GB1559969A (en) 1977-06-23 1978-05-16 Semiconductor component housing assemblies
FR7817756A FR2395603A1 (fr) 1977-06-23 1978-06-14 Composant a semi-conducteurs
US05/916,197 US4218695A (en) 1977-06-23 1978-06-16 Semiconductor rectifier housing assembly
JP7529378A JPS5410672A (en) 1977-06-23 1978-06-21 Semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772728313 DE2728313A1 (de) 1977-06-23 1977-06-23 Halbleiterbauelement

Publications (1)

Publication Number Publication Date
DE2728313A1 true DE2728313A1 (de) 1979-01-04

Family

ID=6012187

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19772728313 Ceased DE2728313A1 (de) 1977-06-23 1977-06-23 Halbleiterbauelement

Country Status (5)

Country Link
US (1) US4218695A (cg-RX-API-DMAC7.html)
JP (1) JPS5410672A (cg-RX-API-DMAC7.html)
DE (1) DE2728313A1 (cg-RX-API-DMAC7.html)
FR (1) FR2395603A1 (cg-RX-API-DMAC7.html)
GB (1) GB1559969A (cg-RX-API-DMAC7.html)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130958A (en) * 1980-02-13 1981-10-14 Semikron Gleichrichterbau Semiconductor forming unit
US4313128A (en) * 1979-05-08 1982-01-26 Westinghouse Electric Corp. Compression bonded electronic device comprising a plurality of discrete semiconductor devices
DE3143339A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
DE3232184A1 (de) * 1982-08-30 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleiterelement
DE3232154A1 (de) * 1982-08-30 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleitermodul
DE3508456A1 (de) * 1985-03-09 1986-09-11 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul
DE3628556C1 (en) * 1986-08-22 1988-04-14 Semikron Elektronik Gmbh Semiconductor device

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2942409A1 (de) * 1979-10-19 1981-04-23 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit mehreren halbleiterkoerpern
DE2942401C2 (de) * 1979-10-19 1984-09-06 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit mehreren Halbleiterkörpern
US4574299A (en) * 1981-03-02 1986-03-04 General Electric Company Thyristor packaging system
DE3142576A1 (de) * 1981-10-27 1983-05-05 Siemens AG, 1000 Berlin und 8000 München Halbleiteranordnung mit durch druck kontaktierbaren halbleiterkoerpern
DE3143336A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichterbaueinheit
JPS58153340A (ja) * 1982-03-05 1983-09-12 Hitachi Ltd 半導体装置
US4518983A (en) * 1982-10-22 1985-05-21 Westinghouse Electric Corp. Assembly-heat sink for semiconductor devices
DE3241509A1 (de) * 1982-11-10 1984-05-10 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungstransistor-modul
DE3486256T2 (de) * 1983-09-29 1994-05-11 Toshiba Kawasaki Kk Halbleiteranordnung in Druckpackung.
JPS6074461A (ja) * 1983-09-29 1985-04-26 Toshiba Corp 半導体装置
JPS6074462A (ja) * 1983-09-29 1985-04-26 Toshiba Corp 半導体装置
US4739447A (en) * 1984-01-23 1988-04-19 La Telemecanique Electrique Mounting and connection device for power semi-conductors
JPS60176698A (ja) * 1984-02-22 1985-09-10 山本　敏樹 ミシンにおける脇割り仕上方法および装置
DE3586735D1 (de) * 1984-10-19 1992-11-12 Bbc Brown Boveri & Cie Abschaltbares leistungshalbleiterbauelement.
CH668667A5 (de) * 1985-11-15 1989-01-13 Bbc Brown Boveri & Cie Leistungshalbleitermodul.
US4853762A (en) * 1986-03-27 1989-08-01 International Rectifier Corporation Semi-conductor modules
EP0380799B1 (de) * 1989-02-02 1993-10-06 Asea Brown Boveri Ag Druckkontaktiertes Halbleiterbauelement
DE69115799T2 (de) * 1990-08-28 1996-07-11 Ibm Herstellung von Halbleiterpackungen
JP3120575B2 (ja) * 1992-06-29 2000-12-25 富士電機株式会社 半導体装置
US5378928A (en) * 1993-04-27 1995-01-03 Motorola, Inc. Plastic encapsulated microelectronic device and method
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
US6445588B1 (en) 2001-01-02 2002-09-03 Motorola, Inc. Apparatus and method for securing a printed circuit board to a base plate
DE102007003587B4 (de) 2007-01-24 2009-06-10 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Druckkörper
US8120171B2 (en) * 2007-12-26 2012-02-21 Keihin Corporation Power drive unit including a heat sink and a fastener
DE102011004541B4 (de) * 2011-02-22 2014-07-17 Infineon Technologies Bipolar Gmbh & Co. Kg Verbessertes Leistungshalbleitermodul, Anordnung aus Modul und Kühlkörper sowie Verwendung des Moduls
JP2013243264A (ja) * 2012-05-21 2013-12-05 Yaskawa Electric Corp 電子部品取付モジュールおよび電力変換装置
CN108701667B (zh) 2016-06-20 2020-08-28 株洲中车时代电气股份有限公司 半导体设备子组件

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2740075A (en) * 1956-03-27 Metal rectifier assemblies
US2853662A (en) * 1956-06-22 1958-09-23 Int Resistance Co Rectifier construction
US3142000A (en) * 1961-02-15 1964-07-21 Radio Receptor Company Inc Matrix for holding and making electrical connection with a plurality of electrical units
GB1020151A (en) * 1962-06-09 1966-02-16 Standard Telephones Cables Ltd Electrical semiconductor device
DE2064343A1 (de) * 1969-12-31 1971-07-08 Lucas Industries Ltd Zweiweggleichrichter
DE2104726A1 (de) * 1970-02-02 1972-08-10 Gen Electric Halbleiterbauelement
US3763052A (en) * 1971-08-12 1973-10-02 American Optical Corp Low threshold yttrium silicate laser glass with high damage threshold
DE2246423A1 (de) * 1972-09-21 1974-04-04 Siemens Ag Thyristor mit scheibenfoermigem gehaeuse
DE2336152A1 (de) * 1973-07-16 1975-01-30 Siemens Ag Halbleiterbauelement
DE2363725A1 (de) * 1973-12-21 1975-06-26 Semikron Gleichrichterbau Halbleitergleichrichteranordnung
DE7512573U (de) * 1975-04-19 1975-09-04 Semikron Gesellschaft Fuer Gleichri Halbleitergleichrichteranordnung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1255749A (en) * 1969-04-30 1971-12-01 Westinghouse Brake & Signal Semiconductor devices
US3763402A (en) * 1970-11-09 1973-10-02 Gen Electric Fluid cooled rectifier holding assembly
US4106052A (en) * 1975-04-19 1978-08-08 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position
JPS5271625A (en) * 1975-12-10 1977-06-15 Semikron Gleichrichterbau Semiconductor rectifier device
DE2617335A1 (de) * 1976-04-21 1977-11-03 Siemens Ag Halbleiterbauelement

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2740075A (en) * 1956-03-27 Metal rectifier assemblies
US2853662A (en) * 1956-06-22 1958-09-23 Int Resistance Co Rectifier construction
US3142000A (en) * 1961-02-15 1964-07-21 Radio Receptor Company Inc Matrix for holding and making electrical connection with a plurality of electrical units
GB1020151A (en) * 1962-06-09 1966-02-16 Standard Telephones Cables Ltd Electrical semiconductor device
DE2064343A1 (de) * 1969-12-31 1971-07-08 Lucas Industries Ltd Zweiweggleichrichter
DE2104726A1 (de) * 1970-02-02 1972-08-10 Gen Electric Halbleiterbauelement
US3763052A (en) * 1971-08-12 1973-10-02 American Optical Corp Low threshold yttrium silicate laser glass with high damage threshold
DE2246423A1 (de) * 1972-09-21 1974-04-04 Siemens Ag Thyristor mit scheibenfoermigem gehaeuse
DE2336152A1 (de) * 1973-07-16 1975-01-30 Siemens Ag Halbleiterbauelement
DE2363725A1 (de) * 1973-12-21 1975-06-26 Semikron Gleichrichterbau Halbleitergleichrichteranordnung
DE7512573U (de) * 1975-04-19 1975-09-04 Semikron Gesellschaft Fuer Gleichri Halbleitergleichrichteranordnung

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4313128A (en) * 1979-05-08 1982-01-26 Westinghouse Electric Corp. Compression bonded electronic device comprising a plurality of discrete semiconductor devices
JPS56130958A (en) * 1980-02-13 1981-10-14 Semikron Gleichrichterbau Semiconductor forming unit
DE3143339A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
DE3232184A1 (de) * 1982-08-30 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleiterelement
DE3232154A1 (de) * 1982-08-30 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleitermodul
DE3508456A1 (de) * 1985-03-09 1986-09-11 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul
DE3628556C1 (en) * 1986-08-22 1988-04-14 Semikron Elektronik Gmbh Semiconductor device

Also Published As

Publication number Publication date
JPS5410672A (en) 1979-01-26
GB1559969A (en) 1980-01-30
FR2395603B1 (cg-RX-API-DMAC7.html) 1982-11-19
US4218695A (en) 1980-08-19
FR2395603A1 (fr) 1979-01-19

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8131 Rejection