DE2649343A1 - Vorrichtung und verfahren zur herstellung eines traegers fuer ein halbleiterbauelement - Google Patents

Vorrichtung und verfahren zur herstellung eines traegers fuer ein halbleiterbauelement

Info

Publication number
DE2649343A1
DE2649343A1 DE19762649343 DE2649343A DE2649343A1 DE 2649343 A1 DE2649343 A1 DE 2649343A1 DE 19762649343 DE19762649343 DE 19762649343 DE 2649343 A DE2649343 A DE 2649343A DE 2649343 A1 DE2649343 A1 DE 2649343A1
Authority
DE
Germany
Prior art keywords
layer
carrier
metal blank
semiconductor element
tool half
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19762649343
Other languages
German (de)
English (en)
Inventor
Yoshio Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE2649343A1 publication Critical patent/DE2649343A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492Bases or plates or solder therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4878Mechanical treatment, e.g. deforming
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00Metal working
    • Y10S29/047Extruding with other step
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Forging (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE19762649343 1975-12-11 1976-10-29 Vorrichtung und verfahren zur herstellung eines traegers fuer ein halbleiterbauelement Withdrawn DE2649343A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50146918A JPS5271176A (en) 1975-12-11 1975-12-11 Method of manufacturing base for pressure contact type semiconductor

Publications (1)

Publication Number Publication Date
DE2649343A1 true DE2649343A1 (de) 1977-06-30

Family

ID=15418497

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762649343 Withdrawn DE2649343A1 (de) 1975-12-11 1976-10-29 Vorrichtung und verfahren zur herstellung eines traegers fuer ein halbleiterbauelement

Country Status (6)

Country Link
US (1) US4124935A (enExample)
JP (1) JPS5271176A (enExample)
DE (1) DE2649343A1 (enExample)
FR (1) FR2335048A1 (enExample)
GB (2) GB1559618A (enExample)
NL (1) NL7613313A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4192063A (en) * 1975-12-10 1980-03-11 Yoshio Sato Method for manufacturing a base of a semi-conductor device
US4149310A (en) * 1978-03-27 1979-04-17 The Nippert Company Method of making a heat sink mounting
FR2446541A1 (fr) * 1979-01-12 1980-08-08 Sev Alternateurs Diode de puissance destinee notamment a equiper un pont redresseur d'alternateur
WO2008063239A1 (en) * 2006-11-17 2008-05-29 Shale And Sands Oil Recovery Llc Method for extraction of hydrocarbons from limestone formations

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL120008C (enExample) * 1959-05-15
US3197843A (en) * 1961-05-19 1965-08-03 Nippert Electric Products Comp Method of forming a mount for semiconductors
NL129350C (enExample) * 1962-12-26
NL142278B (nl) * 1964-06-20 1974-05-15 Philips Nv Werkwijze voor het vervaardigen van een bodem van een voor een halfgeleidende inrichting bestemde omhulling en bodem, vervaardigd volgens deze werkwijze.

Also Published As

Publication number Publication date
US4124935A (en) 1978-11-14
JPS5271176A (en) 1977-06-14
FR2335048A1 (fr) 1977-07-08
FR2335048B1 (enExample) 1979-03-02
GB1559617A (en) 1980-01-23
JPS5510138B2 (enExample) 1980-03-14
NL7613313A (nl) 1977-06-14
GB1559618A (en) 1980-01-23

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee