GB1559618A - Die assembly for manufacturing a base of a pressure mount type semiconductor device - Google Patents

Die assembly for manufacturing a base of a pressure mount type semiconductor device Download PDF

Info

Publication number
GB1559618A
GB1559618A GB06650/79A GB665079A GB1559618A GB 1559618 A GB1559618 A GB 1559618A GB 06650/79 A GB06650/79 A GB 06650/79A GB 665079 A GB665079 A GB 665079A GB 1559618 A GB1559618 A GB 1559618A
Authority
GB
United Kingdom
Prior art keywords
cavity
base
metal layer
die
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB06650/79A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of GB1559618A publication Critical patent/GB1559618A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W70/20—
    • H10W70/027—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/047—Extruding with other step
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Forging (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB06650/79A 1975-12-11 1976-11-15 Die assembly for manufacturing a base of a pressure mount type semiconductor device Expired GB1559618A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50146918A JPS5271176A (en) 1975-12-11 1975-12-11 Method of manufacturing base for pressure contact type semiconductor

Publications (1)

Publication Number Publication Date
GB1559618A true GB1559618A (en) 1980-01-23

Family

ID=15418497

Family Applications (2)

Application Number Title Priority Date Filing Date
GB06650/79A Expired GB1559618A (en) 1975-12-11 1976-11-15 Die assembly for manufacturing a base of a pressure mount type semiconductor device
GB47558/76A Expired GB1559617A (en) 1975-12-11 1976-11-15 Method of manufacturing a base of a pressure mount type semiconductor device

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB47558/76A Expired GB1559617A (en) 1975-12-11 1976-11-15 Method of manufacturing a base of a pressure mount type semiconductor device

Country Status (6)

Country Link
US (1) US4124935A (enExample)
JP (1) JPS5271176A (enExample)
DE (1) DE2649343A1 (enExample)
FR (1) FR2335048A1 (enExample)
GB (2) GB1559618A (enExample)
NL (1) NL7613313A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4192063A (en) * 1975-12-10 1980-03-11 Yoshio Sato Method for manufacturing a base of a semi-conductor device
US4149310A (en) * 1978-03-27 1979-04-17 The Nippert Company Method of making a heat sink mounting
FR2446541A1 (fr) * 1979-01-12 1980-08-08 Sev Alternateurs Diode de puissance destinee notamment a equiper un pont redresseur d'alternateur
WO2008063239A1 (en) * 2006-11-17 2008-05-29 Shale And Sands Oil Recovery Llc Method for extraction of hydrocarbons from limestone formations

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL120008C (enExample) * 1959-05-15
US3197843A (en) * 1961-05-19 1965-08-03 Nippert Electric Products Comp Method of forming a mount for semiconductors
NL129350C (enExample) * 1962-12-26
NL142278B (nl) * 1964-06-20 1974-05-15 Philips Nv Werkwijze voor het vervaardigen van een bodem van een voor een halfgeleidende inrichting bestemde omhulling en bodem, vervaardigd volgens deze werkwijze.

Also Published As

Publication number Publication date
JPS5510138B2 (enExample) 1980-03-14
US4124935A (en) 1978-11-14
GB1559617A (en) 1980-01-23
DE2649343A1 (de) 1977-06-30
NL7613313A (nl) 1977-06-14
JPS5271176A (en) 1977-06-14
FR2335048A1 (fr) 1977-07-08
FR2335048B1 (enExample) 1979-03-02

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee