DE2638474B2 - - Google Patents
Info
- Publication number
- DE2638474B2 DE2638474B2 DE2638474A DE2638474A DE2638474B2 DE 2638474 B2 DE2638474 B2 DE 2638474B2 DE 2638474 A DE2638474 A DE 2638474A DE 2638474 A DE2638474 A DE 2638474A DE 2638474 B2 DE2638474 B2 DE 2638474B2
- Authority
- DE
- Germany
- Prior art keywords
- laser beam
- thin
- photomask
- scanning
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 54
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 49
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 33
- 229910052804 chromium Inorganic materials 0.000 claims description 31
- 239000011651 chromium Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 21
- 230000003287 optical effect Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 230000010355 oscillation Effects 0.000 claims description 6
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 2
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 24
- 230000002950 deficient Effects 0.000 description 17
- 230000007547 defect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000010408 film Substances 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910017356 Fe2C Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- -1 argon ion Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/72—Repair or correction of mask defects
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10303175A JPS5227372A (en) | 1975-08-27 | 1975-08-27 | Photo mask processing system and its device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2638474A1 DE2638474A1 (de) | 1977-03-10 |
| DE2638474B2 true DE2638474B2 (enrdf_load_stackoverflow) | 1978-05-03 |
| DE2638474C3 DE2638474C3 (enrdf_load_stackoverflow) | 1979-01-04 |
Family
ID=14343273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19762638474 Granted DE2638474A1 (de) | 1975-08-27 | 1976-08-26 | Verfahren zur herstellung einer fotomaske |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS5227372A (enrdf_load_stackoverflow) |
| DE (1) | DE2638474A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1554296A (enrdf_load_stackoverflow) |
| NL (1) | NL7609502A (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53120377A (en) * | 1977-03-30 | 1978-10-20 | Nec Corp | Laser machining apparatus for correction of photo masks |
| JPS5871617A (ja) * | 1981-10-23 | 1983-04-28 | Nec Corp | レ−ザアニ−リング装置 |
| JPS5892026U (ja) * | 1981-12-16 | 1983-06-22 | 呉羽合繊株式会社 | 捲物用帯状体 |
| US4548883A (en) * | 1983-05-31 | 1985-10-22 | At&T Bell Laboratories | Correction of lithographic masks |
| JPS61168726A (ja) * | 1985-01-21 | 1986-07-30 | Norin Kogyosha:Goushi | ガス遮断装置 |
| US5338645A (en) * | 1986-06-16 | 1994-08-16 | Motorola, Inc. | Three dimensional printed circuits |
| US6341009B1 (en) * | 2000-02-24 | 2002-01-22 | Quantronix Corporation | Laser delivery system and method for photolithographic mask repair |
-
1975
- 1975-08-27 JP JP10303175A patent/JPS5227372A/ja active Granted
-
1976
- 1976-08-26 NL NL7609502A patent/NL7609502A/xx not_active Application Discontinuation
- 1976-08-26 DE DE19762638474 patent/DE2638474A1/de active Granted
- 1976-08-26 GB GB35575/76A patent/GB1554296A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| NL7609502A (nl) | 1977-03-01 |
| DE2638474A1 (de) | 1977-03-10 |
| GB1554296A (en) | 1979-10-17 |
| DE2638474C3 (enrdf_load_stackoverflow) | 1979-01-04 |
| JPS5227372A (en) | 1977-03-01 |
| JPS5324787B2 (enrdf_load_stackoverflow) | 1978-07-22 |
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| DE2638474C3 (enrdf_load_stackoverflow) | ||
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C3 | Grant after two publication steps (3rd publication) | ||
| 8339 | Ceased/non-payment of the annual fee |