DE2630286C2 - - Google Patents

Info

Publication number
DE2630286C2
DE2630286C2 DE2630286A DE2630286A DE2630286C2 DE 2630286 C2 DE2630286 C2 DE 2630286C2 DE 2630286 A DE2630286 A DE 2630286A DE 2630286 A DE2630286 A DE 2630286A DE 2630286 C2 DE2630286 C2 DE 2630286C2
Authority
DE
Germany
Prior art keywords
conductor
strip
support structures
metal strip
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2630286A
Other languages
German (de)
English (en)
Other versions
DE2630286A1 (de
Inventor
Carmen D. San Jose Calif. Us Burns
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of DE2630286A1 publication Critical patent/DE2630286A1/de
Application granted granted Critical
Publication of DE2630286C2 publication Critical patent/DE2630286C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/047—Attaching leadframes to insulating supports, e.g. for tape automated bonding [TAB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE19762630286 1975-07-07 1976-07-06 Warmpress-verbindungsband fuer halbleiterbausteine, sowie das zugehoerige herstellungsverfahren Granted DE2630286A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/593,474 US4063993A (en) 1975-07-07 1975-07-07 Method of making gang bonding interconnect tape for semiconductive devices

Publications (2)

Publication Number Publication Date
DE2630286A1 DE2630286A1 (de) 1977-01-27
DE2630286C2 true DE2630286C2 (https=) 1988-10-13

Family

ID=24374859

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762630286 Granted DE2630286A1 (de) 1975-07-07 1976-07-06 Warmpress-verbindungsband fuer halbleiterbausteine, sowie das zugehoerige herstellungsverfahren

Country Status (7)

Country Link
US (1) US4063993A (https=)
JP (1) JPS6053462B2 (https=)
BR (1) BR7603580A (https=)
CA (1) CA1048657A (https=)
DE (1) DE2630286A1 (https=)
FR (1) FR2317852A1 (https=)
GB (1) GB1522409A (https=)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4118858A (en) * 1976-04-19 1978-10-10 Texas Instruments Incorporated Method of making an electronic calculator
FR2393424A1 (fr) * 1977-06-03 1978-12-29 Nippon Electric Co Montage de conducteurs sur armature pour un dispositif semi-conducteur
US4138691A (en) * 1977-06-07 1979-02-06 Nippon Electric Co., Ltd. Framed lead assembly for a semiconductor device comprising insulator reinforcing strips supported by a frame and made integral with lead strips
JPS54139415A (en) * 1978-04-21 1979-10-29 Hitachi Ltd Semiconductor channel switch
US4209355A (en) * 1978-07-26 1980-06-24 National Semiconductor Corporation Manufacture of bumped composite tape for automatic gang bonding of semiconductor devices
US4286860A (en) * 1979-02-01 1981-09-01 Western Electric Co., Inc. Apparatus for making carrier tape
US4339296A (en) * 1979-02-01 1982-07-13 Western Electric Co., Inc. Apparatus for adjustably forming pattern in a strip
US4227983A (en) * 1979-02-01 1980-10-14 Western Electric Company, Inc. Method for making carrier tape
US4320192A (en) * 1979-02-01 1982-03-16 Western Electric Co., Inc. Adjusting successive steps for making carrier tape
US4609936A (en) * 1979-09-19 1986-09-02 Motorola, Inc. Semiconductor chip with direct-bonded external leadframe
JPS5648198A (en) * 1979-09-26 1981-05-01 Matsushita Electric Industrial Co Ltd Method of manufacturing flexible printed circuit board
US4331740A (en) * 1980-04-14 1982-05-25 National Semiconductor Corporation Gang bonding interconnect tape process and structure for semiconductor device automatic assembly
US4362595A (en) * 1980-05-19 1982-12-07 The Boeing Company Screen fabrication by hand chemical blanking
EP0059187A1 (en) * 1980-09-08 1982-09-08 Mostek Corporation Single layer burn-in tape for integrated circuit
FR2493602A1 (fr) * 1980-10-31 1982-05-07 Thomson Csf Embase de boitier d'encapsulation de composants, a electrodes coplanaires et dispositif semiconducteur ainsi encapsule
US4364977A (en) * 1981-07-06 1982-12-21 National Semiconductor Corporation Automatic self-adjusting processing apparatus
US5223321A (en) * 1981-07-17 1993-06-29 British Telecommunications Plc Tape-automated bonding of integrated circuits
EP0081419A3 (en) * 1981-12-03 1985-05-15 FAIRCHILD CAMERA & INSTRUMENT CORPORATION High lead count hermetic mass bond integrated circuit carrier
US4396457A (en) * 1982-03-17 1983-08-02 E. I. Du Pont De Nemours And Company Method of making bumped-beam tape
US4466183A (en) * 1982-05-03 1984-08-21 National Semiconductor Corporation Integrated circuit packaging process
GB2124433B (en) * 1982-07-07 1986-05-21 Int Standard Electric Corp Electronic component assembly
GB2129612B (en) * 1982-09-30 1987-05-07 Sumitomo Metal Mining Co Manufacture of carrier tapes
JPS5988859A (ja) * 1982-11-12 1984-05-22 Sumitomo Metal Mining Co Ltd キヤリヤテ−プの製造方法
US4531285A (en) * 1983-03-21 1985-07-30 The United States Of America As Represented By The Secretary Of The Navy Method for interconnecting close lead center integrated circuit packages to boards
US4505225A (en) * 1983-08-31 1985-03-19 National Semiconductor Corporation Self-aligning apparatus for semiconductor lead frame processing means
US4736520A (en) * 1983-11-04 1988-04-12 Control Data Corporation Process for assembling integrated circuit packages
JPS61296749A (ja) * 1985-06-25 1986-12-27 Toray Silicone Co Ltd 半導体装置用リードフレームの製造方法
US4799128A (en) * 1985-12-20 1989-01-17 Ncr Corporation Multilayer printed circuit board with domain partitioning
US4709468A (en) * 1986-01-31 1987-12-01 Texas Instruments Incorporated Method for producing an integrated circuit product having a polyimide film interconnection structure
US4681654A (en) * 1986-05-21 1987-07-21 International Business Machines Corporation Flexible film semiconductor chip carrier
US4795694A (en) * 1986-06-20 1989-01-03 Siemens Aktiengesellschaft Manufacture of fine structures for semiconductor contacting
US4961806A (en) * 1986-12-10 1990-10-09 Sanders Associates, Inc. Method of making a printed circuit
US5214571A (en) * 1986-12-10 1993-05-25 Miraco, Inc. Multilayer printed circuit and associated multilayer material
US5097390A (en) * 1986-12-10 1992-03-17 Interflex Corporation Printed circuit and fabrication of same
US4836797A (en) * 1986-12-16 1989-06-06 Sym-Tek Systems, Inc. Electrical device contactor
US4855867A (en) * 1987-02-02 1989-08-08 International Business Machines Corporation Full panel electronic packaging structure
US4766670A (en) * 1987-02-02 1988-08-30 International Business Machines Corporation Full panel electronic packaging structure and method of making same
FR2622353B1 (fr) * 1987-10-22 1990-03-23 Bendix Electronics Sa Produit en bande pour supporter et convoyer des composants electroniques et procede pour sa fabrication
JP2744273B2 (ja) * 1988-02-09 1998-04-28 キヤノン株式会社 光電変換装置の製造方法
US5121298A (en) * 1988-08-16 1992-06-09 Delco Electronics Corporation Controlled adhesion conductor
US4959751A (en) * 1988-08-16 1990-09-25 Delco Electronics Corporation Ceramic hybrid integrated circuit having surface mount device solder stress reduction
US5169679A (en) * 1988-10-11 1992-12-08 Delco Electronics Corporation Post-termination apparatus and process for thick film resistors of printed circuit boards
US5184207A (en) * 1988-12-07 1993-02-02 Tribotech Semiconductor die packages having lead support frame
JP2751450B2 (ja) * 1989-08-28 1998-05-18 セイコーエプソン株式会社 テープキャリアの実装構造及びその実装方法
US5171828A (en) * 1989-10-26 1992-12-15 Occidental Chemical Corporation Copolyimide ODPA/BPDA/4,4'-ODA or P-PDA
US5250758A (en) * 1991-05-21 1993-10-05 Elf Technologies, Inc. Methods and systems of preparing extended length flexible harnesses
US5258650A (en) * 1991-08-26 1993-11-02 Motorola, Inc. Semiconductor device having encapsulation comprising of a thixotropic fluorosiloxane material
US5490639A (en) * 1993-12-22 1996-02-13 National Semiconductor Corporation Multi-rail tension equalizer
JP4239352B2 (ja) * 2000-03-28 2009-03-18 株式会社日立製作所 電子装置の製造方法
ATE480666T1 (de) * 2001-06-05 2010-09-15 Buckman Labor Inc Polymere kreppklebemittel und kreppverfahren
CN1185915C (zh) * 2001-06-13 2005-01-19 佳能株式会社 柔性基板、半导体器件、摄像装置和放射线摄像系统

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same
GB1209901A (en) * 1967-01-11 1970-10-21 British Telecomm Res Ltd Improvements relating to the mounting of integrated circuit assemblies
US3689991A (en) * 1968-03-01 1972-09-12 Gen Electric A method of manufacturing a semiconductor device utilizing a flexible carrier
US3763404A (en) * 1968-03-01 1973-10-02 Gen Electric Semiconductor devices and manufacture thereof
US3698076A (en) * 1970-08-03 1972-10-17 Motorola Inc Method of applying leads to an integrated circuit
US3698073A (en) * 1970-10-13 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
US3724068A (en) * 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
US3781596A (en) * 1972-07-07 1973-12-25 R Galli Semiconductor chip carriers and strips thereof
US3838984A (en) * 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
US3904813A (en) * 1974-03-18 1975-09-09 Minnesota Mining & Mfg Adhesive for metal-clad sheeting

Also Published As

Publication number Publication date
JPS5210075A (en) 1977-01-26
CA1048657A (en) 1979-02-13
FR2317852B1 (https=) 1980-03-14
DE2630286A1 (de) 1977-01-27
US4063993A (en) 1977-12-20
JPS6053462B2 (ja) 1985-11-26
BR7603580A (pt) 1977-07-05
GB1522409A (en) 1978-08-23
FR2317852A1 (fr) 1977-02-04

Similar Documents

Publication Publication Date Title
DE2630286C2 (https=)
DE3125518C2 (de) Verfahren zur Herstellung einer dünnen Verdrahtungsanordnung
DE2926200C2 (https=)
EP2027600B1 (de) Verfahren zum Einbetten zumindest eines Bauelements in einem Leiterplattenelement
DE2810054C2 (de) Elektronische Schaltungsanordnung und Verfahren zu deren Herstellung
DE69413602T2 (de) Halbleiteranordnung und Herstellungsverfahren
DE1765434A1 (de) Verfahren zur Herstellung von flexiblen elektrischen Flachkabeln
DE2351056A1 (de) Verfahren zum ausrichten und befestigen von elektronischen schaltungen auf einem substrat
DE2855838C2 (de) Bauteilanordnung
WO1996021947A1 (de) Chipträger-anordnung sowie chipträger zur herstellung einer chip-gehäusung
WO2020043466A1 (de) Bauelement und verfahren zur herstellung eines bauelements
DE102016123129B4 (de) Elektronische Komponente und Verfahren
EP1586117B1 (de) Verfahren zur herstellung von mikrosystemen
DE2461624A1 (de) Anzeigevorrichtung
DE69609921T2 (de) Herstellungsverfahren einer halbleiteranordnung geeignet zur oberflächenmontage
DE2630269A1 (de) Verbindungsband fuer warmpressverbindungen bei halbleiterbausteinen, sowie das zugehoerige herstellungsverfahren
DE1909480A1 (de) Halbleiterbauelement und Verfahren zu seiner Herstellung
DE102012106280A1 (de) Verfahren zum Herstellen eines Halbleitergehäuses
DE3219055A1 (de) Verfahren zur herstellung eines filmtraegers mit leiterstrukturen
DE19809073A1 (de) Chipmodul und Verfahren zur Herstellung einer Chipkarte
DE3622223A1 (de) Verfahren zum herstellen eines elektronischen netzwerkbausteins
DE2945385A1 (de) Halbleiter-anordnung und verfahren zu ihrer herstellung
EP1925192B1 (de) Laminiertes substrat für die montage von elektronischen bauteilen
DE102011004543A1 (de) Impulswiderstand, Leiterplatte und elektrisches oder elektronisches Gerät
DE1439529B2 (de) : Halbleiterbauelement mit einem planaren Halbleiterelement auf einer Kontaktierungsplatte und Verfahren zum Herstellen desselben

Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: RICHTER, J., DIPL.-ING., 1000 BERLIN GERBAULET, H., DIPL.-ING., PAT.-ANWAELTE, 2000 HAMBURG