DE2623716C3 - Verfahren zur Vorbehandlung von Polysulf onsubstraten vor der stromlosen Beschichtung mit einem Metall - Google Patents
Verfahren zur Vorbehandlung von Polysulf onsubstraten vor der stromlosen Beschichtung mit einem MetallInfo
- Publication number
- DE2623716C3 DE2623716C3 DE2623716A DE2623716A DE2623716C3 DE 2623716 C3 DE2623716 C3 DE 2623716C3 DE 2623716 A DE2623716 A DE 2623716A DE 2623716 A DE2623716 A DE 2623716A DE 2623716 C3 DE2623716 C3 DE 2623716C3
- Authority
- DE
- Germany
- Prior art keywords
- metal
- etching
- substrate
- acid
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 title claims description 28
- 229910052751 metal Inorganic materials 0.000 title claims description 20
- 239000002184 metal Substances 0.000 title claims description 20
- 238000000034 method Methods 0.000 title claims description 13
- 238000007772 electroless plating Methods 0.000 title claims description 5
- 238000005530 etching Methods 0.000 claims description 25
- 239000000243 solution Substances 0.000 claims description 23
- 229920002492 poly(sulfone) Polymers 0.000 claims description 21
- 150000002366 halogen compounds Chemical class 0.000 claims description 15
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims description 13
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims description 13
- 239000007864 aqueous solution Substances 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 238000000454 electroless metal deposition Methods 0.000 claims description 2
- 238000000576 coating method Methods 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 239000004033 plastic Substances 0.000 description 10
- 229920003023 plastic Polymers 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- -1 aliphatic halogen compounds Chemical class 0.000 description 8
- JXTHNDFMNIQAHM-UHFFFAOYSA-N dichloroacetic acid Chemical compound OC(=O)C(Cl)Cl JXTHNDFMNIQAHM-UHFFFAOYSA-N 0.000 description 8
- XEPXTKKIWBPAEG-UHFFFAOYSA-N 1,1-dichloropropan-1-ol Chemical compound CCC(O)(Cl)Cl XEPXTKKIWBPAEG-UHFFFAOYSA-N 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000001465 metallisation Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000000839 emulsion Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910000510 noble metal Inorganic materials 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229910052783 alkali metal Chemical group 0.000 description 4
- 229960005215 dichloroacetic acid Drugs 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- CSVFWMMPUJDVKH-UHFFFAOYSA-N 1,1-dichloropropan-2-one Chemical compound CC(=O)C(Cl)Cl CSVFWMMPUJDVKH-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000001805 chlorine compounds Chemical class 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 239000003085 diluting agent Substances 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 159000000000 sodium salts Chemical class 0.000 description 3
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 3
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001340 alkali metals Chemical group 0.000 description 2
- 239000012736 aqueous medium Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- QEWYKACRFQMRMB-UHFFFAOYSA-N fluoroacetic acid Chemical compound OC(=O)CF QEWYKACRFQMRMB-UHFFFAOYSA-N 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- FUFCUFWFGUOCIY-UHFFFAOYSA-N 1,1,1-trichloro-3-fluoropropan-2-one Chemical compound FCC(=O)C(Cl)(Cl)Cl FUFCUFWFGUOCIY-UHFFFAOYSA-N 0.000 description 1
- 229940051269 1,3-dichloro-2-propanol Drugs 0.000 description 1
- DEWLEGDTCGBNGU-UHFFFAOYSA-N 1,3-dichloropropan-2-ol Chemical compound ClCC(O)CCl DEWLEGDTCGBNGU-UHFFFAOYSA-N 0.000 description 1
- PVDLUGWWIOGCNH-UHFFFAOYSA-N 1,3-difluoro-2-propanol Chemical compound FCC(O)CF PVDLUGWWIOGCNH-UHFFFAOYSA-N 0.000 description 1
- KPWDGTGXUYRARH-UHFFFAOYSA-N 2,2,2-trichloroethanol Chemical compound OCC(Cl)(Cl)Cl KPWDGTGXUYRARH-UHFFFAOYSA-N 0.000 description 1
- BWAQLYSNPAWYRG-UHFFFAOYSA-N 2,2-dichloro-2-fluoroacetyl chloride Chemical compound FC(Cl)(Cl)C(Cl)=O BWAQLYSNPAWYRG-UHFFFAOYSA-N 0.000 description 1
- QSKPIOLLBIHNAC-UHFFFAOYSA-N 2-chloro-acetaldehyde Chemical compound ClCC=O QSKPIOLLBIHNAC-UHFFFAOYSA-N 0.000 description 1
- HLHNOIAOWQFNGW-UHFFFAOYSA-N 3-bromo-4-hydroxybenzonitrile Chemical compound OC1=CC=C(C#N)C=C1Br HLHNOIAOWQFNGW-UHFFFAOYSA-N 0.000 description 1
- SSZWWUDQMAHNAQ-UHFFFAOYSA-N 3-chloropropane-1,2-diol Chemical compound OCC(O)CCl SSZWWUDQMAHNAQ-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 241000530268 Lycaena heteronea Species 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- SXDBWCPKPHAZSM-UHFFFAOYSA-N bromic acid Chemical compound OBr(=O)=O SXDBWCPKPHAZSM-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000005587 carbonate group Chemical group 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 229910001430 chromium ion Inorganic materials 0.000 description 1
- 229940117975 chromium trioxide Drugs 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 1
- GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 239000013068 control sample Substances 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- PBWZKZYHONABLN-UHFFFAOYSA-N difluoroacetic acid Chemical compound OC(=O)C(F)F PBWZKZYHONABLN-UHFFFAOYSA-N 0.000 description 1
- KPVWDKBJLIDKEP-UHFFFAOYSA-L dihydroxy(dioxo)chromium;sulfuric acid Chemical compound OS(O)(=O)=O.O[Cr](O)(=O)=O KPVWDKBJLIDKEP-UHFFFAOYSA-L 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N ethyl formate Chemical compound CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000003701 inert diluent Substances 0.000 description 1
- JDNTWHVOXJZDSN-UHFFFAOYSA-N iodoacetic acid Chemical compound OC(=O)CI JDNTWHVOXJZDSN-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- UMFCIIBZHQXRCJ-NSCUHMNNSA-N trans-anol Chemical compound C\C=C\C1=CC=C(O)C=C1 UMFCIIBZHQXRCJ-NSCUHMNNSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/581,038 US4125649A (en) | 1975-05-27 | 1975-05-27 | Pre-etch conditioning of polysulfone and other polymers for electroless plating |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2623716A1 DE2623716A1 (de) | 1976-12-09 |
| DE2623716B2 DE2623716B2 (de) | 1979-06-13 |
| DE2623716C3 true DE2623716C3 (de) | 1980-02-07 |
Family
ID=24323653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2623716A Expired DE2623716C3 (de) | 1975-05-27 | 1976-05-26 | Verfahren zur Vorbehandlung von Polysulf onsubstraten vor der stromlosen Beschichtung mit einem Metall |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4125649A (OSRAM) |
| JP (1) | JPS51145576A (OSRAM) |
| CA (1) | CA1062133A (OSRAM) |
| DE (1) | DE2623716C3 (OSRAM) |
| FR (1) | FR2312572A1 (OSRAM) |
| GB (1) | GB1544456A (OSRAM) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4309462A (en) * | 1978-12-19 | 1982-01-05 | Crown City Plating Co. | Conditioning of caprolactam polymers for electroless plating |
| US4335164A (en) * | 1978-12-19 | 1982-06-15 | Crown City Plating Co. | Conditioning of polyamides for electroless plating |
| GB2040969B (en) * | 1978-12-19 | 1983-04-13 | Crown City Plating Co | Conditioning of polyamides for electroless plating |
| US4315045A (en) * | 1978-12-19 | 1982-02-09 | Crown City Plating Co. | Conditioning of polyamides for electroless plating |
| US4246320A (en) * | 1979-03-15 | 1981-01-20 | Stauffer Chemical Company | Plated acrylate/styrene/acrylonitrile article |
| US4325991A (en) * | 1981-01-05 | 1982-04-20 | Crown City Plating Co. | Electroless plating of polyesters |
| US4325992A (en) * | 1981-01-05 | 1982-04-20 | Crown City Plating Co. | Electroless plating of polycarbonates |
| US4447471A (en) * | 1982-12-30 | 1984-05-08 | Gould Inc. | Method of treating thermoplastic surfaces |
| US4828921A (en) * | 1986-10-17 | 1989-05-09 | Mobay Corporation | Polycarbonate molding compositions |
| US5308387A (en) * | 1987-09-25 | 1994-05-03 | Elf Atochem North America, Inc. | Pre-etch treatment of a plastic substrate |
| CA1335703C (en) * | 1987-09-25 | 1995-05-30 | Barry Sydney James | Pre-etch treatment for preparing a plastics substrate for plating with a metal |
| EP0311232B2 (en) * | 1987-10-02 | 1999-08-04 | Polyplastics Co. Ltd. | Process for surface treatment of moldings of liquid-crystalline polyester resin |
| US5087524A (en) * | 1988-09-22 | 1992-02-11 | Mobay Corporation | Article molded from a polycarbonate composition having improved platability |
| US5053106A (en) * | 1988-10-12 | 1991-10-01 | Occidental Chemical Corporation | Low friction, wear resistant plastic parts |
| US4941940A (en) * | 1988-11-07 | 1990-07-17 | Jp Laboratories, Inc. | Pre-swelling and etching of plastics for plating |
| US5049230A (en) * | 1988-11-07 | 1991-09-17 | Jp Laboratories, Inc. | Single step pre-swelling and etching of plastics for plating |
| US5015329A (en) * | 1988-11-07 | 1991-05-14 | Jp Laboratories, Inc. | Pre-swelling and etching of plastics for plating |
| FR2660671B1 (fr) * | 1990-04-06 | 1993-05-07 | Thomson Csf | Procede de metallisation du polyethersulfone. |
| DE4132330A1 (de) * | 1990-11-23 | 1992-05-27 | Lacks Ind Inc | Verfahren zum elektroplattieren hochschlagfester kunststoffe |
| US5198096A (en) * | 1990-11-28 | 1993-03-30 | General Electric Company | Method of preparing polycarbonate surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
| US5380474A (en) * | 1993-05-20 | 1995-01-10 | Sandia Corporation | Methods for patterned deposition on a substrate |
| US5332465A (en) * | 1993-09-08 | 1994-07-26 | Macdermid, Incorporated | Process for preparing plastic surfaces to be plated |
| US5928727A (en) * | 1997-06-02 | 1999-07-27 | Lacks Industries, Inc. | Method for electroplating elastomer-modified polyphthalamide articles |
| US5962073A (en) * | 1997-06-02 | 1999-10-05 | Lacks Industries, Inc. | Method for electroplating elastomer-modified polyphthalamide articles |
| TWI230726B (en) | 1998-06-17 | 2005-04-11 | Bayer Ag | Thermoplastic molding compositions having improved plateability |
| US6168825B1 (en) | 1998-11-02 | 2001-01-02 | O'brien Dudley | Process for producing thin transparent gold coatings |
| AU2003297401A1 (en) * | 2002-12-20 | 2004-07-22 | E.I. Du Pont De Nemours And Company | Surface treatment of polyacetal articles |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1508104A (fr) * | 1965-06-28 | 1968-01-05 | Ibm | Corrosion par l'acide |
| US3561995A (en) * | 1967-04-03 | 1971-02-09 | M & T Chemicals Inc | Method of activating a polymer surface and resultant article |
| US3574070A (en) * | 1967-05-11 | 1971-04-06 | Shipley Co | Metal plating over plastic |
| US3600217A (en) * | 1968-03-04 | 1971-08-17 | Fotochem Werke Berlin Veb | Process for pretreating polyester film support for the coating with photographic emulsions |
| JPS5333628B1 (OSRAM) * | 1969-09-05 | 1978-09-14 | ||
| US3607354A (en) * | 1969-11-14 | 1971-09-21 | Minnesota Mining & Mfg | Method of delustering polyethylene terephthalate film |
| US3740252A (en) * | 1970-10-23 | 1973-06-19 | Xidex Corp | Adhesion of organic materials to organic polymers |
| DE2062215C3 (de) * | 1970-12-17 | 1978-05-18 | Hoechst Ag, 6000 Frankfurt | Verfahren zur Abscheidung von Metallschichten auf Formkörpern aus Polyestern |
| NL176479C (nl) * | 1971-12-08 | 1985-04-16 | Hoechst Ag | Werkwijze voor het bekleden van kunststofvoorwerpen met koper. |
| US3902950A (en) * | 1974-03-27 | 1975-09-02 | Goodyear Tire & Rubber | Rubber to polyester adhesion |
-
1975
- 1975-05-27 US US05/581,038 patent/US4125649A/en not_active Expired - Lifetime
-
1976
- 1976-05-11 CA CA252,179A patent/CA1062133A/en not_active Expired
- 1976-05-26 FR FR7616027A patent/FR2312572A1/fr active Granted
- 1976-05-26 JP JP51061025A patent/JPS51145576A/ja active Granted
- 1976-05-26 DE DE2623716A patent/DE2623716C3/de not_active Expired
- 1976-05-27 GB GB22043/76A patent/GB1544456A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2312572B1 (OSRAM) | 1979-07-13 |
| JPS51145576A (en) | 1976-12-14 |
| DE2623716A1 (de) | 1976-12-09 |
| GB1544456A (en) | 1979-04-19 |
| FR2312572A1 (fr) | 1976-12-24 |
| JPS5730138B2 (OSRAM) | 1982-06-26 |
| CA1062133A (en) | 1979-09-11 |
| US4125649A (en) | 1978-11-14 |
| DE2623716B2 (de) | 1979-06-13 |
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