DE2518666A1 - Verfahren zum aufbringen von glasuren auf die oberflaeche von halbleiter-aktivteilen, haltevorrichtung zur ausfuehrung des verfahrens und dessen anwendung zum passivieren von pn-uebergaengen - Google Patents

Verfahren zum aufbringen von glasuren auf die oberflaeche von halbleiter-aktivteilen, haltevorrichtung zur ausfuehrung des verfahrens und dessen anwendung zum passivieren von pn-uebergaengen

Info

Publication number
DE2518666A1
DE2518666A1 DE19752518666 DE2518666A DE2518666A1 DE 2518666 A1 DE2518666 A1 DE 2518666A1 DE 19752518666 DE19752518666 DE 19752518666 DE 2518666 A DE2518666 A DE 2518666A DE 2518666 A1 DE2518666 A1 DE 2518666A1
Authority
DE
Germany
Prior art keywords
semiconductor
active
parts
active parts
glass powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19752518666
Other languages
German (de)
English (en)
Inventor
Wolfgang Hinz
Dieter Dipl Phys Dr Kuse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC BROWN BOVERI and CIE
BBC Brown Boveri AG Switzerland
Original Assignee
BBC BROWN BOVERI and CIE
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC BROWN BOVERI and CIE, BBC Brown Boveri AG Switzerland filed Critical BBC BROWN BOVERI and CIE
Publication of DE2518666A1 publication Critical patent/DE2518666A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10156—Shape being other than a cuboid at the periphery
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10157—Shape being other than a cuboid at the active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE19752518666 1975-03-20 1975-04-26 Verfahren zum aufbringen von glasuren auf die oberflaeche von halbleiter-aktivteilen, haltevorrichtung zur ausfuehrung des verfahrens und dessen anwendung zum passivieren von pn-uebergaengen Withdrawn DE2518666A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH355275A CH591762A5 (enrdf_load_stackoverflow) 1975-03-20 1975-03-20

Publications (1)

Publication Number Publication Date
DE2518666A1 true DE2518666A1 (de) 1976-09-30

Family

ID=4258446

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19752518666 Withdrawn DE2518666A1 (de) 1975-03-20 1975-04-26 Verfahren zum aufbringen von glasuren auf die oberflaeche von halbleiter-aktivteilen, haltevorrichtung zur ausfuehrung des verfahrens und dessen anwendung zum passivieren von pn-uebergaengen
DE19757513490 Expired DE7513490U (de) 1975-03-20 1975-04-26 Haltevorrichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19757513490 Expired DE7513490U (de) 1975-03-20 1975-04-26 Haltevorrichtung

Country Status (4)

Country Link
JP (1) JPS51118966A (enrdf_load_stackoverflow)
CH (1) CH591762A5 (enrdf_load_stackoverflow)
DE (2) DE2518666A1 (enrdf_load_stackoverflow)
FR (1) FR2305021A1 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3832750A1 (de) * 1988-09-27 1990-03-29 Asea Brown Boveri Leistungshalbleiterbauelement
DE3832732A1 (de) * 1988-09-27 1990-03-29 Asea Brown Boveri Leistungshalbleiterdiode

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5367363A (en) * 1976-11-27 1978-06-15 Mitsubishi Electric Corp Semiconductor device
FR2469000A1 (fr) * 1979-10-30 1981-05-08 Silicium Semiconducteur Ssc Structure de thyristor tres haute tension glassive et son procede de fabrication
FR2515874A1 (fr) * 1981-11-05 1983-05-06 Comp Generale Electricite Procede d'encapsulation plastique de cellules solaires

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1438826A (fr) * 1964-06-30 1966-05-13 Ibm Formation de films de verre par pulvérisation réactive
US3473959A (en) * 1964-08-10 1969-10-21 Licentia Gmbh Method for coating semiconductors and apparatus
US3437505A (en) * 1965-06-28 1969-04-08 Ibm Method for depositing glass particles on the entire exposed surface of an object
US3639975A (en) * 1969-07-30 1972-02-08 Gen Electric Glass encapsulated semiconductor device fabrication process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3832750A1 (de) * 1988-09-27 1990-03-29 Asea Brown Boveri Leistungshalbleiterbauelement
DE3832732A1 (de) * 1988-09-27 1990-03-29 Asea Brown Boveri Leistungshalbleiterdiode

Also Published As

Publication number Publication date
CH591762A5 (enrdf_load_stackoverflow) 1977-09-30
JPS51118966A (en) 1976-10-19
DE7513490U (de) 1977-05-26
FR2305021A1 (fr) 1976-10-15

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8139 Disposal/non-payment of the annual fee