DE2500180A1 - Verfahren und vorrichtung zum verarbeiten von ic-chips - Google Patents
Verfahren und vorrichtung zum verarbeiten von ic-chipsInfo
- Publication number
- DE2500180A1 DE2500180A1 DE19752500180 DE2500180A DE2500180A1 DE 2500180 A1 DE2500180 A1 DE 2500180A1 DE 19752500180 DE19752500180 DE 19752500180 DE 2500180 A DE2500180 A DE 2500180A DE 2500180 A1 DE2500180 A1 DE 2500180A1
- Authority
- DE
- Germany
- Prior art keywords
- chips
- strip
- welding tool
- interconnections
- lifting support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims description 24
- 238000003466 welding Methods 0.000 claims description 41
- 238000006073 displacement reaction Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 230000002950 deficient Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 108091081062 Repeated sequence (DNA) Proteins 0.000 description 1
- 230000027455 binding Effects 0.000 description 1
- 238000009739 binding Methods 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7323502A FR2238247B1 (enrdf_load_stackoverflow) | 1973-06-27 | 1973-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2500180A1 true DE2500180A1 (de) | 1976-07-08 |
Family
ID=9121656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19752500180 Withdrawn DE2500180A1 (de) | 1973-06-27 | 1975-01-03 | Verfahren und vorrichtung zum verarbeiten von ic-chips |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5039068A (enrdf_load_stackoverflow) |
| DE (1) | DE2500180A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2238247B1 (enrdf_load_stackoverflow) |
| GB (1) | GB1475831A (enrdf_load_stackoverflow) |
| NL (1) | NL7416624A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2603383A1 (de) * | 1975-01-29 | 1976-08-05 | Cii Honeywell Bull | Traeger fuer die verarbeitung von ic-chips |
| DE3019207A1 (de) * | 1980-05-20 | 1981-11-26 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-chip |
| EP0087796A3 (en) * | 1982-03-02 | 1985-10-09 | Siemens Aktiengesellschaft | Film carrier for an electrical conductor pattern |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2379909A1 (fr) * | 1977-02-04 | 1978-09-01 | Cii Honeywell Bull | Procede et appareil de montage de dispositifs sur un substrat |
| JPS57193203A (en) * | 1981-05-26 | 1982-11-27 | Nippon Kokan Kk <Nkk> | Rolling method for h-steel |
| FR2571923B1 (fr) * | 1984-10-16 | 1987-02-20 | Farco Sa | Procede de soudage d'un composant electrique a un ensemble de pattes de connexion ainsi que machine et ruban pour la mise en oeuvre de ce procede |
| EP0208916A3 (en) * | 1985-06-13 | 1987-08-12 | Matsushita Electric Industrial Co., Ltd. | Inner-lead bonding apparatus |
| JPS62151214A (ja) * | 1985-12-25 | 1987-07-06 | Kawasaki Steel Corp | Ｈ形鋼の厚み制御方法 |
| US4845335A (en) * | 1988-01-28 | 1989-07-04 | Microelectronics And Computer Technology Corporation | Laser Bonding apparatus and method |
| EP0456388A1 (en) * | 1990-05-08 | 1991-11-13 | International Business Machines Corporation | Processing high-density circuit substrates and container for use in such processing |
| CN112390011B (zh) * | 2020-10-29 | 2022-11-04 | 苏州华兴源创科技股份有限公司 | 压紧机构 |
-
1973
- 1973-06-27 FR FR7323502A patent/FR2238247B1/fr not_active Expired
-
1974
- 1974-06-25 JP JP49071972A patent/JPS5039068A/ja active Pending
- 1974-12-20 NL NL7416624A patent/NL7416624A/xx not_active Application Discontinuation
-
1975
- 1975-01-03 DE DE19752500180 patent/DE2500180A1/de not_active Withdrawn
- 1975-01-10 GB GB117875A patent/GB1475831A/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2603383A1 (de) * | 1975-01-29 | 1976-08-05 | Cii Honeywell Bull | Traeger fuer die verarbeitung von ic-chips |
| DE3019207A1 (de) * | 1980-05-20 | 1981-11-26 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-chip |
| US4829666A (en) * | 1980-05-20 | 1989-05-16 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Method for producing a carrier element for an IC-chip |
| EP0087796A3 (en) * | 1982-03-02 | 1985-10-09 | Siemens Aktiengesellschaft | Film carrier for an electrical conductor pattern |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2238247A1 (enrdf_load_stackoverflow) | 1975-02-14 |
| NL7416624A (nl) | 1976-06-22 |
| FR2238247B1 (enrdf_load_stackoverflow) | 1976-11-12 |
| JPS5039068A (enrdf_load_stackoverflow) | 1975-04-10 |
| GB1475831A (en) | 1977-06-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OGA | New person/name/address of the applicant | ||
| 8141 | Disposal/no request for examination |