WO2003098665A1 - Verfahren zum verarbeiten von elektrischen bauteilen, insbesondere zum verarbeiten von halbleiterchips sowie elektrischen bauelementen, sowie vorrichtung zum durchführen des verfahrens. - Google Patents
Verfahren zum verarbeiten von elektrischen bauteilen, insbesondere zum verarbeiten von halbleiterchips sowie elektrischen bauelementen, sowie vorrichtung zum durchführen des verfahrens. Download PDFInfo
- Publication number
- WO2003098665A1 WO2003098665A1 PCT/DE2003/001152 DE0301152W WO03098665A1 WO 2003098665 A1 WO2003098665 A1 WO 2003098665A1 DE 0301152 W DE0301152 W DE 0301152W WO 03098665 A1 WO03098665 A1 WO 03098665A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- components
- carrier film
- pick
- carrier
- rows
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 83
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000012545 processing Methods 0.000 title claims abstract description 21
- 238000000151 deposition Methods 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 5
- 230000002950 deficient Effects 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 238000012360 testing method Methods 0.000 claims 1
- 239000011888 foil Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1906—Delaminating means responsive to feed or shape at delamination
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
Definitions
- the invention relates to a method according to the preamble of claim 1 and to a device according to the preamble of claim 27.
- semiconductor chips in multiple uses is known, i.e. on a semiconductor wafer, which is then used for further processing of the semiconductor chips on a carrier, i.e. is releasably attached to a carrier foil (blue foil) clamped in a carrier frame.
- the wafer is then cut into the individual semiconductor chips, in such a way that these semiconductor chips continue to adhere to the carrier film.
- the further processing of the semiconductor chips is carried out according to the prior art, for example in so-called die bonders, in such a way that these chips are each individually removed from the carrier film by means of a pick-up element and then placed on a “second” carrier, which is, for example, from a lead frame or a substrate arranged in this lead frame
- the movement of the pick-up element requires movement strokes in at least two axial directions, namely a transport stroke in the horizontal direction between the semiconductor wafer and the second carrier and at the beginning and end
- This transport stroke is a vertical stroke for gripping and removing a semiconductor chip from the carrier film or for depositing the respective semiconductor chip on the second carrier.
- the object of the invention is to demonstrate a method and a device in which or in which the processing of electrical components detachably held on a carrier foil is possible with a significantly higher output.
- a method according to claim 1 is designed to achieve this object.
- a device is designed according to claim 27.
- electrical components are, in particular, semiconductor chips which are detachably provided on a carrier foil (blue foil) held in a carrier frame and are held by cutting a semiconductor wafer and thereby form a chip arrangement on the carrier foil which, in the arrangement of the Corresponds to chips in the wafer, specifically in a number of rows arranged parallel to one another and extending in an axial direction.
- components within the meaning of the invention are also electrical components, in particular also those which each consist of a semiconductor chip with a housing produced by extrusion coating, for example plastic housing and which, for example, are also used in multiples using a common semiconductor wafer and after being placed on the Carrier film are separated into the individual components.
- Processing means in the simplest case the transfer of the electrical components from the carrier film to the second carrier in the sense of the invention a “pick and place operation” using a pick-up element which is moved between the carrier film and the second carrier for this purpose.
- “Second carrier” in the sense means, for example, the transport surface of a suitable transport element or any other suitable carrier on which the components are placed.
- Processing the first rows means in the sense of the invention that the electrical components or the groups of these components are each taken from the individual rows formed on the carrier film one after the other, preferably in such a way that the components of one in the successive work steps or strokes new, first row can only be transferred if the components of previous rows have already been completely transferred to the second carrier.
- the special feature of the method according to the invention is that in each working stroke several components are simultaneously removed directly from the carrier film as a group and placed on the second carrier, preferably by an electronic control device such that the components form at least a second row on the second carrier , in which the components then preferably follow one another at equal intervals.
- Fig. 1 in a simplified representation and in plan view a support frame with a
- Fig. 2 in a simplified representation and in vertical section, the pick-up unit and the tappet unit of a work station for performing the method of the figure
- Transport element shows a vertical section through the work station of FIG. 2 in a section plane running perpendicular to FIG. 2;
- FIG. 4 shows the pick-up head of the pick-up unit of FIGS. 2 and 3 in individual representation; 5 shows a further possible embodiment of FIG.
- Formation of the tappet unit; 8 shows a simplified perspective functional illustration of a work station similar to FIGS. 2 and 3, together with the transport element adjoining this work station and a further transporter or transport element adjoining the transport element via a turning station.
- 1 is a semiconductor wafer which is separated into a multiplicity of semiconductor chips 2 (integrated circuits or components) and is arranged on a carrier film 3, which in turn is held in a carrier frame 4.
- the semiconductor chips 2 are spaced apart from one another, but form an arrangement on the carrier film 3 in which the semiconductor chips 2 are arranged in a plurality of rows R1-Rn and are arranged in a plurality of columns, namely in accordance with the originally circular disk-shaped configuration of the wafer 1 in such a way that the rows R1-Rn and the columns running perpendicular thereto have different lengths, in the form that the length of the columns and rows for The center of the wafer 1 or the chip arrangement increases.
- the semiconductor chips 2 are removed from the carrier film 3 and onto a conveyor generally designated 6 in FIG placed, which is suitable for transporting semiconductor chips and can have a wide variety of training, for example on a conveyor which is formed by a self-adhesive tape-shaped film or by a conveyor belt on which the semiconductor chips 2 are held by a vacuum, etc.
- the pick-up Unit 5, 5a or 5b is part of a workstation 7 with the transport element 6, the semiconductor chips 2 are transported away from this workstation or from the support frame 4 with the support film 3 and are used for further use, as indicated by the arrow A.
- FIGS. 3 the spatial axis extending perpendicular to one another is shown in FIGS. 3, namely the X axis, the Y axis and the Z axis, of which the X axis and Y axis are horizontal axes and the define the horizontal XY plane, while the Z axis is the vertical axis.
- the carrier film 3 and thus also the wafer 1 arranged on this carrier film are arranged in the horizontal X-Y plane.
- the transport plane of the transport element 6, on which the semiconductor chips 2 are arranged is also the horizontal XY plane.
- the transport direction A des Transport element 6 runs parallel to the Y axis in the illustrated embodiment.
- the semiconductor chips 2 are placed on the transport element 6 or on the transport plane there in such a way that they have several, i.e. In the embodiment shown, a total of seven rows of semiconductor chips 2 running parallel to the transport direction A and parallel to one another form, preferably closed rows, each semiconductor chip 2 in a row perpendicular to the transport direction, i. in the X-axis a semiconductor chip 2 is adjacent to an adjacent row, i.e. the semiconductor chips 2 are arranged on the transport element 6 in the direction of the X-axis columns, each with seven semiconductor chips 2.
- the peculiarity of the work station 7 or the method carried out with this station is, on the one hand, that the semiconductor chips 2 are transferred over a short distance from the wafer 1 to the transport element 6, but, on the other hand, that this transfer takes place in such a way that several each Semiconductor chips 2, each in a row R1-Rn, are removed as a group from the carrier film 3 in one operation and placed on the transport element 6, for which the pick-up element 5, 5a, 5b at least one reciprocating movement in the direction of the Y- Axis (horizontal stroke Hy) and a vertical stroke (Vz) in the Z axis for removing the group of semiconductor chips 2 from the carrier film 3 at one end of the
- the horizontal stroke Hy is parallel to the transport direction A.
- the pick-up is in each working stroke -Elementes 5 each six semiconductor chips 2 removed from the carrier film 3 and then deflected onto the transport element 6.
- the workstation 7 also has a holder 8, in which the support frame 4 is arranged and with which this support frame is aligned so that the rows R1 - Rn does not extend in the Y-axis and the associated columns in the X-axis and, in addition, each row R'1 - R'n formed on the transport element 6 is provided in the same axis as a row R1 - Rn on the carrier film 3.
- the alignment of the support frame 4 and thus of the wafer 1 takes place by means of electronics 9 having a camera system and image processing.
- the camera system of the electronics 9 detects the formation of the wafer 1 or the arrangement of the semiconductor chips 2 on the support film 3. Furthermore, the camera system also detects those semiconductor chips or their position and stores them in a memory of the electronics 9, which were found to be unusable in a previous inspection process of the wafer 1 and were accordingly provided with a marking 10.
- the movement of the pick-up unit 5 is controlled in such a way that the groups 2 'of the semiconductor chips 2 deposited on the transport element 6 each form the closed R'1-R'n.
- the pick-up unit 5 is designed in such a way that only semiconductor chips 2 of a certain row R1-Rn are removed from the carrier film 3 in each work step.
- the pick-up unit 5 is designed such that it is in addition to the
- Horizontal stroke Hy in the transport direction A can also carry out a horizontal stroke Hx transverse to the transport direction.
- the marked faulty semiconductor chips 2 are also deposited on the transport element 6 in the method shown and are only triggered in a later method step by the control electronics 9, in whose memory the position of the marked faulty semiconductor chips on the transport element 6 is also stored.
- At least the horizontal stroke Hy has a different one, controlled by the control electronics 9 Length on, ie the beginning and end of this stroke Hy when removing the group 2 'from the carrier film 3 and when placing the relevant group 2' on the transport element 6 are by the control electronics 9 taking into account the shape of the wafer or the arrangement of the Controlled semiconductor chips 2 on the carrier film 3, so that the continuous rows R'1 - R'n result.
- the control program of the control electronics 9 is designed, for example, such that when the individual rows R1-Rn are processed, the maximum possible number of semiconductor chips 2 of the carrier film 3 is removed in each working stroke and placed on the transport element 6 and then the remaining ones in a final working stroke Semiconductor chips in the relevant row R1 - Rn.
- the holder 8 can also be moved in the X axis for processing the individual rows R1-Rn.
- the controlled, different length of the stroke Hy takes into account on the one hand that at the work station 7 for processing the rows R1-Rn, a feed B for the support frame 4 is only provided in the X-axis, and that the rows R1-Rn have different lengths have, so that when the semiconductor chips are removed and when these chips or the groups 2 'are deposited, the pick-up element must in any case move to different positions in the Y-axis.
- the work station 7 or the pick-up unit 5 there and an associated plunger unit 11 which are used to detach the individual semiconductor chips 2 from the carrier film 3 (self-adhesive film or blue foil) is necessary, are shown in detail in FIGS. 2 and 3.
- the pick-up unit 5 consists of a pick-up head 12 in or in the housing 13 of which a plurality of vacuum holders 14 are provided so as to be displaceable in the direction of the Z axis, with a limited stroke in accordance with the arrow arrow C.
- the individual vacuum holders 14 are designed like lamellae, i.e. they consist of a flat, plate-shaped body 15 with a rectangular cut, which is arranged with its longer sides in the housing 13 parallel to the Z-axis and has a molded projection 16 on a lower narrow side, which is parallel in one plane at its free end forms the contact surface 17 to the XY plane, at which a vacuum or vacuum channel 18 opens.
- the body 15 is shaped such that it forms a resilient tongue 19 with which the vacuum holder 14 is supported on a surface of the guide 20 for the body 15 of the vacuum holder 14 formed in the housing 13.
- the vacuum holders 14 are arranged with their bodies 15 like lamellae next to one another in the opening or guide of the housing 13, in such a way that the larger surface sides of the plate-shaped bodies 15 each lie in the XZ plane.
- a transport system 21 which has drives (not shown in more detail), for example stepper motors for executing the controlled movements Hx, Hy, Vz, V'z.
- a vacuum connection indicated only generally by 22 in the figures, which is connected to a vacuum or vacuum source, not shown, for supplying the vacuum channels 14.
- the plunger unit 1 1 consists essentially of a housing 23, which is movable on a frame or a base plate 24 of the work station 7 by a motor drive, not shown, controlled by the electronic control device 9 in the direction of the Y axis by a predetermined stroke D (FIG. 3) is led.
- the top of the housing 23 forms an abutment or support surface 25 for the underside of the carrier film 3, specifically on a housing part 26, in which in the direction of the Z axis several, each tapering at their upper end and parallel to their axis Tappets 27 arranged in the Z axis are guided so as to be axially displaceable, specifically for a movement stroke in accordance with the double arrow E of FIG. 2.
- the tappets 27 are provided offset with respect to one another in the direction of the Y axis.
- the number of plungers 27 is equal to the number of vacuum holders 14, ie a plunger 27 is assigned to each vacuum holder 14.
- spring means which are formed in the embodiment shown by leaf springs 29, each plunger 27 is biased into a lower position, in which the free end of the respective tip 28 is located below the contact surface 25.
- a shaft 31 is rotatably mounted about an axis parallel to the Y axis on the housing 23 or on a circuit board 30 there, which is driven in rotation by a stepper motor 32, also controlled by the control electronics 9 (arrow F in FIG. 2).
- a plurality of cam disks 33 are provided on the shaft, axially offset from one another, each of which forms a control cam 34.
- the axis of the shaft 31 is arranged in a YZ plane in which the axis of the plunger 27 also lie. Furthermore, the shaft 31 is located below the tappet 27.
- Each tappet 27 is assigned a cam disk 33, in such a way that with each full revolution of the shaft 31 the tappet 27 in question is countered once from its initial position by the control cam 34 provided on the cam disk 33 the Effect of the spring element 29 is moved up into an upper stroke position, in which the plunger 27 in question protrudes with its tip 28 through the carrier film 4 clearly above the top of the carrier film or above the level formed by the top of the wafer 1.
- the number of tappets 27 corresponds to six cam disks 33.
- the cams 34 of the individual cam disks 33 are provided offset at uniform angular intervals around the axis of the shaft 31, so that when the shaft 31 rotates, the tappets 27 are moved upwards one after the other from their initial position.
- An annular groove 35 which surrounds the arrangement of the plungers 27, is provided on the housing part 26 in the region of the contact surface 25, which is open on the contact surface 25 and can be acted upon by a controlled vacuum.
- the support frame 4 with the support frame holder 8 is first moved in the feed direction B so that the row R1-Rn, which is to be processed, is in the central plane M of the plunger 27.
- This level is indicated in Figure 2 as the middle level M.
- the pick-up head 12 is then moved in such a way that the vacuum holders 14 are located above the semiconductor chips 2 of the relevant row R1-Rn intended for removal.
- the plunger unit 1 1 is also controlled by the control electronics 9 so that a plunger 27 is located below a chip 2 of the group 2 'to be removed from the carrier film 3.
- the pick-up head 12 is lowered in the vertical direction in accordance with the stroke Vz, each first Contact surface 17 of each vacuum holder 14 comes to bear against a semiconductor chip 2 or its top side facing away from the carrier film 3.
- the vacuum holders 14 are in the lower position of their lifting or sliding movement C relative to the housing 13.
- the tappets 27 are then moved up and down again one after the other by the cam disks 33 provided on the rotating shaft 31.
- a plunger 27 Each time a plunger 27 moves upwards, it pierces the carrier film 3 with its tip 28, detaches the corresponding semiconductor chip 2 from the carrier film 3 and moves this semiconductor chip, which is already resting against the contact surface 17 and held there with the vacuum (vacuum channel 18) 2 upwards, the tappet 27 also pushing the vacuum holder 14 in the guide 20 upwards.
- the respective tongue of the vacuum holder 14 is retained in the guide 20 by the resilient tongue 19, so that when the respective plunger 27 is moved downwards again, ie when the associated control cam 34 releases the lower end of the plunger 27 again, the relevant semiconductor chip 2 on the
- the vacuum holders 14 are brought into their lower starting position by a common slide 36, indicated by broken lines in FIGS. 2 and 3 moved back. Due to the vacuum applied to the annular groove 35, the support sheet 3 is during removal of the Semiconductor chip 2 fixed to the contact surface 25, whereby the removal of the semiconductor chips 2 is significantly improved.
- each chip 2 can be removed from the self-adhesive carrier film 3 without any problems, namely in that the carrier film 3 is deformed by the respective tip 28 in such a way that the carrier film is deformed 3 completely detaches from the underside of the respective semiconductor chip 2 and only adheres to the holder conductor chip 2 at the point of contact between the tip 28 and the underside.
- FIG. 5 shows, in a representation like FIG. 2, a further possible embodiment of a workstation 7a, which differs from workstation 7 essentially only in that in each working stroke, semiconductor chips 2 of two adjacent rows R1-Rn as group 2 'of the carrier film 3 can be removed.
- two rows of vacuum holders 14 are provided on the pick-up head 12a of the pick-up element 5a, which corresponds in function to the pick-up element 5, namely on both sides of the central plane M in a housing 13a 'and 13a "displaceably in the direction of the Z axis.
- Each tappet 27a corresponding to a tappet 27 forms two tips 28.
- the center distance which the vacuum holders 14 or their contact surfaces 17 have in the direction of the X axis is equal to the center distance of the two tips 28 in this X-axis and in the illustrated embodiment equal to the center distance two rows R1 ... Rn.
- the tips 28 are arranged in two rows extending in the direction of the Y-axis, in such a way that when the Semiconductor chips 2 of the carrier foil 3 have a tip 28 arranged coaxially with each vacuum holder 4.
- the mode of operation of the work station 7a corresponds to the mode of operation of the work station 7, with the only difference that each the semiconductor chips 2 of two adjacent rows R1 ... Rn successively detached from the carrier film 3 and with the respective plunger 27a held on the respective vacuum holder 2 can be lifted above the level of the wafer 1, specifically the two semiconductor chips 2 adjacent to the X axis of the two adjacent rows R1 ... Rn.
- FIG. 6 shows a further possible embodiment of a work station 7b, which differs from the work station 7 only in that a plunger unit 11 b is provided instead of the plunger unit 11.
- This in turn has a plurality of plungers 27b on a housing 23b corresponding to the housing 23, each forming a tip 28 and axially, i.e. slidable in the direction of the Z axis by the stroke E.
- the movement of the plunger 27b is controlled by a
- Control spool 37 is reached, which is mounted in the housing 23b so that it can be pushed back and forth in the direction of the Y axis, controlled by the control electronics 9, by a drive (not shown) (double arrow I in FIG. 7).
- the slide 37 is provided with a control curve 38 from a groove 39 which extends over the greater part of its length in the direction of the Y axis and forms a section 39 'in which the control curve 38 rises obliquely in the direction of the Z axis and then falls off again.
- a driver 40 engages in the control groove 39 on each tappet 27b.
- FIG. 8 shows a simplified perspective illustration of a workstation 7c which is designed similarly to workstation 7a, but in the embodiment shown serves for processing electrical components 40 which consist of a semiconductor chip enclosed in a plastic housing and in the same way as the semiconductor chips 2 are arranged on the carrier film 3 in the carrier frame 4, in a rectangular arrangement with several rows and columns.
- electrical components 40 consist of a semiconductor chip enclosed in a plastic housing and in the same way as the semiconductor chips 2 are arranged on the carrier film 3 in the carrier frame 4, in a rectangular arrangement with several rows and columns.
- the pick-up head 12c of the pick-up element 5c has a row of vacuum holders 14 on two housings 13c 'and 13c ", which are connected to one another in each housing in the direction of the Y axis.
- the two housings 13' and 1 3 " are still movable relative to each other in the direction of the X axis, namely by a predetermined stroke, as indicated by the double arrow G.
- the components 40 of the two rows R'1 and R'2 are successively connected to a vacuum holder 44 with the aid of a turning station 41, which has groups of two vacuum holders in each case offset on a housing 42 which is driven to rotate around the X-axis, at 90 ° Hand over transporter 45.
- the vacuum holders 43 can be moved in a controlled manner radially to the axis of rotation of the housing 41 (X-axis), specifically for the removal of the components 40 on the transport element 6c and for the transfer of two components to the vacuum holders 44 of the transport element 45.
- BL denotes a reference line extending in the direction of the X axis and thus perpendicular to the rows R1-Rn. The ends of the rows are at a different distance from this reference line.
- the invention has been described above using exemplary embodiments. It is understood that numerous changes and modifications are possible. It is thus possible, for example, to dispense with the vertical lift Vz and / or V'z for the respective pick-up heads 12, 12a, 12b and the corresponding vertical movement for the pick-up elements 5, 5a, 5b
- the vacuum holders 14 can be brought up to the chips 2 on the carrier film 3 or for depositing the chips 2 on the transport element 6 simply by moving the vacuum holders 14 within the respective pick-up heads 12, 12a or 12b.
- Support frame 5a, 5b, 5c pick-up element, 6c transport element, 7a, 7b, 7c work station
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004506065A JP2005526393A (ja) | 2002-05-17 | 2003-04-09 | 電気部品とくに半導体チップおよび電気部品の処理方法、および該方法を実行するための装置 |
AU2003240387A AU2003240387A1 (en) | 2002-05-17 | 2003-04-09 | Method for processing electrical parts, particularly for processing semiconductor chips and electrical components, and device for carrying out said method |
EP03729820A EP1506569A1 (de) | 2002-05-17 | 2003-04-09 | Verfahren zum verarbeiten von elektrischen bauteilen, insbesondere zum verarbeiten von halbleiterchips sowie elektrischen bauelementen, sowie vorrichtung zum durchf hren des verfahrens. |
US10/512,086 US20050224186A1 (en) | 2002-05-17 | 2003-04-09 | Method for processing electrical parts, particularly for processing semiconductor chips and electrical components, and device for carrying out said method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10222620A DE10222620A1 (de) | 2002-05-17 | 2002-05-17 | Verfahren zum Verarbeiten von elektrischen Bauteilen, insbesondere zum Verarbeiten von Halbleiterchips sowie elektrischen Bauelementen, sowie Vorrichtung zum Durchführen des Verfahrens |
DE10222620.2 | 2002-05-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003098665A1 true WO2003098665A1 (de) | 2003-11-27 |
Family
ID=29414027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2003/001152 WO2003098665A1 (de) | 2002-05-17 | 2003-04-09 | Verfahren zum verarbeiten von elektrischen bauteilen, insbesondere zum verarbeiten von halbleiterchips sowie elektrischen bauelementen, sowie vorrichtung zum durchführen des verfahrens. |
Country Status (6)
Country | Link |
---|---|
US (1) | US20050224186A1 (de) |
EP (1) | EP1506569A1 (de) |
JP (1) | JP2005526393A (de) |
AU (1) | AU2003240387A1 (de) |
DE (1) | DE10222620A1 (de) |
WO (1) | WO2003098665A1 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006063652A1 (en) * | 2004-12-16 | 2006-06-22 | Smart Res S.R.L. | System for multiple removal of microchips from a wafer consisting of a plurality of microchips |
EP2914079A4 (de) * | 2012-10-29 | 2015-10-28 | Fuji Machine Mfg | Komponentenzuführvorrichtung |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006013073A (ja) * | 2004-06-24 | 2006-01-12 | Sharp Corp | ボンディング装置、ボンディング方法及び半導体装置の製造方法 |
JP4810531B2 (ja) * | 2005-04-06 | 2011-11-09 | 株式会社 ハリーズ | 電子部品の製造装置 |
DE102006002367B3 (de) * | 2006-01-17 | 2007-10-04 | Mühlbauer Ag | Vorrichtung und Verfahren zur Übertragung einer Mehrzahl von Chips von einem Wafer auf ein Substrat |
US20110182701A1 (en) * | 2010-01-28 | 2011-07-28 | Ui Holding Co. | Method and apparatus for transferring die from a wafer |
JP5592710B2 (ja) | 2010-06-17 | 2014-09-17 | セイコーインスツル株式会社 | ピッチ変換装置 |
US9611102B2 (en) * | 2012-10-26 | 2017-04-04 | Illinois Tool Works Inc. | Laning robot systems and methods |
JP7090066B2 (ja) | 2016-07-13 | 2022-06-23 | ユニバーサル インスツルメンツ コーポレーション | モジュール式ダイ取扱いシステム |
TWI682492B (zh) * | 2018-03-23 | 2020-01-11 | 旺矽科技股份有限公司 | 晶粒挑揀總成及晶粒移動方法 |
DE102018128616A1 (de) * | 2018-06-24 | 2019-12-24 | Besi Switzerland Ag | Vorrichtung und Verfahren zum Ablösen eines Chips von einer Klebefolie |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5232143A (en) * | 1991-07-19 | 1993-08-03 | Motorola, Inc. | Multi-chip die bonder |
JPH06216169A (ja) * | 1993-01-19 | 1994-08-05 | Rohm Co Ltd | 半導体部品製造用リードフレームに対する半導体チップの供給装置 |
US6283693B1 (en) * | 1999-11-12 | 2001-09-04 | General Semiconductor, Inc. | Method and apparatus for semiconductor chip handling |
US20020046450A1 (en) * | 1997-09-04 | 2002-04-25 | Hitoshi Odashima | Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card |
JP2003109979A (ja) * | 2001-09-28 | 2003-04-11 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3219906A1 (de) * | 1982-05-27 | 1983-12-01 | Pirzer, Carl, 8402 Neutraubling | Etikettiermaschine |
JP2844300B2 (ja) * | 1993-12-28 | 1999-01-06 | 横浜ゴム株式会社 | スプールの搬送移載方法及びその装置 |
US5857572A (en) * | 1995-12-21 | 1999-01-12 | Bird; Gerald C. | Component carrier tape |
JPH09293995A (ja) * | 1996-02-26 | 1997-11-11 | Matsushita Electric Ind Co Ltd | 部品吸着方法 |
US6364089B1 (en) * | 1999-12-10 | 2002-04-02 | National Semiconductor Corporation | Multi-station rotary die handling device |
DE10044418C2 (de) * | 2000-09-08 | 2002-09-19 | Siemens Ag | Bestückelemente-Entnahmeeinrichtung und Verfahren zum Entnehmen von Bestückelementen aus einem Bestückelemente-Gurt |
-
2002
- 2002-05-17 DE DE10222620A patent/DE10222620A1/de not_active Withdrawn
-
2003
- 2003-04-09 JP JP2004506065A patent/JP2005526393A/ja active Pending
- 2003-04-09 WO PCT/DE2003/001152 patent/WO2003098665A1/de not_active Application Discontinuation
- 2003-04-09 EP EP03729820A patent/EP1506569A1/de not_active Withdrawn
- 2003-04-09 AU AU2003240387A patent/AU2003240387A1/en not_active Abandoned
- 2003-04-09 US US10/512,086 patent/US20050224186A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5232143A (en) * | 1991-07-19 | 1993-08-03 | Motorola, Inc. | Multi-chip die bonder |
JPH06216169A (ja) * | 1993-01-19 | 1994-08-05 | Rohm Co Ltd | 半導体部品製造用リードフレームに対する半導体チップの供給装置 |
US20020046450A1 (en) * | 1997-09-04 | 2002-04-25 | Hitoshi Odashima | Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card |
US6283693B1 (en) * | 1999-11-12 | 2001-09-04 | General Semiconductor, Inc. | Method and apparatus for semiconductor chip handling |
JP2003109979A (ja) * | 2001-09-28 | 2003-04-11 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 018, no. 573 (E - 1624) 2 November 1994 (1994-11-02) * |
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 08 6 August 2003 (2003-08-06) * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006063652A1 (en) * | 2004-12-16 | 2006-06-22 | Smart Res S.R.L. | System for multiple removal of microchips from a wafer consisting of a plurality of microchips |
EP2914079A4 (de) * | 2012-10-29 | 2015-10-28 | Fuji Machine Mfg | Komponentenzuführvorrichtung |
Also Published As
Publication number | Publication date |
---|---|
AU2003240387A1 (en) | 2003-12-02 |
JP2005526393A (ja) | 2005-09-02 |
US20050224186A1 (en) | 2005-10-13 |
DE10222620A1 (de) | 2003-12-04 |
EP1506569A1 (de) | 2005-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1678744B1 (de) | Positionierungsvorrichtung und verfahren für die übertragung elektronischer bauteile | |
WO2003098665A1 (de) | Verfahren zum verarbeiten von elektrischen bauteilen, insbesondere zum verarbeiten von halbleiterchips sowie elektrischen bauelementen, sowie vorrichtung zum durchführen des verfahrens. | |
DE19947015A1 (de) | Verfahren zum Schneiden und Trennen einer gebogenen Platte in einzelne kleine Teile | |
EP0426798B1 (de) | Vorrichtung zum handhaben von objekten und anwendung der vorrichtung | |
DE4244640C2 (de) | Transporteinrichtung für Bauelemente | |
DE4015315A1 (de) | Verfahren sowie vorrichtung zum einbringen von bauelementen, insbesondere elektrischen bauelementen, bevorzugt chips in vertiefungen eines gurtes | |
DE1266839B (de) | Verfahren und Anordnung zum automatischen Aufsetzen von Schaltungsteilen mit einer Zufuehrvorrichtung auf eine Schaltung mit flaechenhaften Leitungszuegen | |
DE3638025C2 (de) | Betückungsautomat für axial und radial bedrahtete Bauteile | |
DE2341524C2 (de) | Maschine zum Bestücken von bedruckten Leiterplatten | |
EP2140746B1 (de) | Bestückautomat und verfahren zum bestücken von substraten mit bauelementen | |
EP1125869B1 (de) | Montagevorrichtung | |
DE10214347A1 (de) | Vorrichtung zum Ver- und/oder Bearbeiten von Halbleiterchips- oder Bauelementen sowie Transfer- und Wendemodul | |
DE19629800C1 (de) | Verfahren und Vorrichtung zum Zuführen von mehreren Teilen bei der Montage zu einem neuen Teil | |
WO1998034452A1 (de) | Vorrichtung zum fördern und/oder sortieren von kleinen bauelementen, insbesondere von kleinen elektrischen bauelementen | |
DE19515684C2 (de) | Verfahren zur Vereinzelung von elektrischen Bauelementen | |
EP1490894A1 (de) | Verfahren zum verarbeiten von elektrischen bauelementen, insbesondere von halbleiterchips, sowie vorrichtung zum durchf hren des verfahrens | |
WO2004093515A1 (de) | Vorrichtung zum ver- und/oder bearbeiten von halbleiterchips- oder bauelementen sowie transfer- und wendemodul | |
DE2209252A1 (de) | Einrichtung zum Ausrichten flacher kleiner Werkstücke | |
AT414077B (de) | Verfahren und einrichtung zur positionsveränderung von elektronischen bauteilen | |
DE4244965C2 (de) | Vorrichtung zum Ver- und Bearbeiten von Bauelementen sowie Biegestation | |
DE19748442A1 (de) | Vorrichtung zum Fördern von kleinen Bauelementen, insbesondere von kleine elektrischen Bauelementen | |
DE19709022A1 (de) | Vorrichtung zum Fördern von kleinen Bauelementen, insbesondere von kleinen elektrischen Bauelementen | |
EP4343860A2 (de) | Bestückung einer transporteinheit beim herstellen von solarmodulen | |
DE10212935B4 (de) | Bestückkopf zum Bestücken von Substraten mit elektrischen Bauelementen | |
DE10230901B4 (de) | Vorrichtung zum Bestücken von Substraten mit Bauelementen mittels eines Bestückkopfes |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PH PL PT RO RU SC SD SE SG SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2004506065 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10512086 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2003729820 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 2003729820 Country of ref document: EP |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 2003729820 Country of ref document: EP |