DE2434627C3 - Kühlvorrichtung für ein integriertes Halbleiterbauelement - Google Patents

Kühlvorrichtung für ein integriertes Halbleiterbauelement

Info

Publication number
DE2434627C3
DE2434627C3 DE2434627A DE2434627A DE2434627C3 DE 2434627 C3 DE2434627 C3 DE 2434627C3 DE 2434627 A DE2434627 A DE 2434627A DE 2434627 A DE2434627 A DE 2434627A DE 2434627 C3 DE2434627 C3 DE 2434627C3
Authority
DE
Germany
Prior art keywords
semiconductor component
integrated semiconductor
height
spacer
heat radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2434627A
Other languages
German (de)
English (en)
Other versions
DE2434627A1 (de
DE2434627B2 (de
Inventor
Guiseppe Sesto San Giovanni Cossutta
Bruno Monza Murari
Sergio Mailand Orsucci
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
SGS ATES Componenti Elettronici SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS ATES Componenti Elettronici SpA filed Critical SGS ATES Componenti Elettronici SpA
Publication of DE2434627A1 publication Critical patent/DE2434627A1/de
Publication of DE2434627B2 publication Critical patent/DE2434627B2/de
Application granted granted Critical
Publication of DE2434627C3 publication Critical patent/DE2434627C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/625—Clamping parts not primarily conducting heat

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE2434627A 1973-07-19 1974-07-18 Kühlvorrichtung für ein integriertes Halbleiterbauelement Expired DE2434627C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT26760/73A IT992650B (it) 1973-07-19 1973-07-19 Elemento per accoppiare un radiatore di calore con la massa termica di un dispositivo integra to nel montaggio su circuito stam pato

Publications (3)

Publication Number Publication Date
DE2434627A1 DE2434627A1 (de) 1975-02-06
DE2434627B2 DE2434627B2 (de) 1976-07-29
DE2434627C3 true DE2434627C3 (de) 1980-10-02

Family

ID=11220191

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2434627A Expired DE2434627C3 (de) 1973-07-19 1974-07-18 Kühlvorrichtung für ein integriertes Halbleiterbauelement

Country Status (8)

Country Link
US (1) US3911327A (https=)
JP (1) JPS5050874A (https=)
DE (1) DE2434627C3 (https=)
FR (1) FR2238314B1 (https=)
GB (1) GB1475573A (https=)
IT (1) IT992650B (https=)
NL (1) NL7409696A (https=)
SE (1) SE394171B (https=)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4004528A (en) * 1976-03-26 1977-01-25 The Singer Company Heat sink for an appliance circuit board
US4199654A (en) * 1977-09-14 1980-04-22 Bunker Ramo Corporation Semiconductor mounting assembly
DE2819499C3 (de) * 1978-05-03 1981-01-29 Siemens Ag, 1000 Berlin Und 8000 Muenchen Gehäuse für eine Halbleiteranordnung
US4167031A (en) * 1978-06-21 1979-09-04 Bell Telephone Laboratories, Incorporated Heat dissipating assembly for semiconductor devices
US4251852A (en) * 1979-06-18 1981-02-17 International Business Machines Corporation Integrated circuit package
US4367523A (en) * 1981-02-17 1983-01-04 Electronic Devices, Inc. Rectifier bridge unit
US4498120A (en) * 1982-03-01 1985-02-05 Kaufman Lance R Electrical sub-assembly having a lead frame to be compressed between a circuit board and heat sink
US4447842A (en) * 1982-06-01 1984-05-08 Control Data Corporation Finned heat exchangers for electronic chips and cooling assembly
EP0123676A4 (en) * 1982-11-09 1987-02-19 Silicon Connection Inc CONNECTION ASSEMBLY AND METHOD OF A CHIP WITH AN ELECTRONIC CIRCUIT.
JPS60121652U (ja) * 1984-01-26 1985-08-16 株式会社　メレツク パワ−トランジスタの放熱器への取付構造
FR2567324B1 (fr) * 1984-07-06 1986-11-28 Telemecanique Electrique Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique
US4665467A (en) * 1986-02-18 1987-05-12 Ncr Corporation Heat transfer mounting device
US4878108A (en) * 1987-06-15 1989-10-31 International Business Machines Corporation Heat dissipation package for integrated circuits
US4891686A (en) * 1988-04-08 1990-01-02 Directed Energy, Inc. Semiconductor packaging with ground plane conductor arrangement
US5089936A (en) * 1988-09-09 1992-02-18 Hitachi, Ltd. Semiconductor module
US5258649A (en) * 1989-05-20 1993-11-02 Hitachi, Ltd. Semiconductor device and electronic apparatus using semiconductor device
US5283467A (en) * 1992-06-05 1994-02-01 Eaton Corporation Heat sink mounting system for semiconductor devices
US5377078A (en) * 1993-01-26 1994-12-27 Relm Communications Inc. Apparatus mounting a power semiconductor to a heat sink
US5396404A (en) * 1993-09-20 1995-03-07 Delco Electronics Corp. Heat sinking assembly for electrical components
JP2944405B2 (ja) * 1993-12-29 1999-09-06 日本電気株式会社 半導体素子の冷却構造および電磁遮蔽構造
FR2721438B1 (fr) * 1994-06-21 1996-10-18 Jacques Daniel Lhomme Dispositif de serrage utilisable notamment pour les semi-conducteurs de puissance.
US5477188A (en) * 1994-07-14 1995-12-19 Eni Linear RF power amplifier
US5504653A (en) * 1994-11-21 1996-04-02 Delco Electronics Corp. Heat sinking assembly for electrical components
US5557503A (en) * 1995-05-12 1996-09-17 International Business Machines Corporation Circuit card having a large module strain relief and heat sink support
US5796584A (en) * 1996-04-30 1998-08-18 Telefonaktiebolaget Lm Ericsson Bridge for power transistors with improved cooling
US5825107A (en) * 1997-06-13 1998-10-20 General Electric Company Drive package for a dynamoelectric machine
US6731503B2 (en) * 2001-08-10 2004-05-04 Black & Decker Inc. Electrically isolated module
AU2002343325B2 (en) * 2001-08-10 2006-08-03 Black & Decker Inc. Electrically isolated module
DE10149886A1 (de) * 2001-10-10 2003-04-30 Eupec Gmbh & Co Kg Leistunghalbleitermodul
US20050161195A1 (en) * 2003-07-22 2005-07-28 Hein Gerald K. System for reliably removing heat from a semiconductor junction
ATE448511T1 (de) * 2005-09-06 2009-11-15 Eta Sa Mft Horlogere Suisse Uhr mit einem halbleitenden zifferblatt
US8657031B2 (en) * 2005-10-12 2014-02-25 Black & Decker Inc. Universal control module
US7746653B2 (en) * 2008-01-02 2010-06-29 Harman International Industries Incorporated Clamp for electrical devices
JP2010285980A (ja) * 2009-05-13 2010-12-24 Sanden Corp インバータ一体型電動圧縮機
US8585248B1 (en) 2010-08-16 2013-11-19 NuLEDs, Inc. LED luminaire having heat sinking panels
US8860209B1 (en) 2010-08-16 2014-10-14 NuLEDs, Inc. LED luminaire having front and rear convective heat sinks
US10729000B2 (en) * 2016-09-28 2020-07-28 Intel Corporation Thermal conductivity for integrated circuit packaging

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3219885A (en) * 1961-03-20 1965-11-23 Gen Motors Corp Transistor heat dissipator
US3689804A (en) * 1971-09-30 1972-09-05 Nippon Denso Co Hybrid circuit device
US3812557A (en) * 1973-02-05 1974-05-28 Eaton Corp Holding clamp

Also Published As

Publication number Publication date
JPS5050874A (https=) 1975-05-07
AU7136474A (en) 1976-01-22
NL7409696A (nl) 1975-01-21
DE2434627A1 (de) 1975-02-06
IT992650B (it) 1975-09-30
US3911327A (en) 1975-10-07
FR2238314B1 (https=) 1976-12-24
SE394171B (sv) 1977-06-06
GB1475573A (en) 1977-06-01
DE2434627B2 (de) 1976-07-29
SE7409324L (https=) 1975-01-20
FR2238314A1 (https=) 1975-02-14

Similar Documents

Publication Publication Date Title
DE2434627C3 (de) Kühlvorrichtung für ein integriertes Halbleiterbauelement
DE2527681B2 (de) Elektrische kontaktanordnung
DE2246478C3 (de) Knotenpunktverbindung von räumlichen Fachwerkskonstruktionen
DE3144901A1 (de) Elektrisch isolierte verbindung zwischen zwei gleichachsig angeordneten, stabfoermigen elementen aus metall
DE2636434C3 (de) Rahmeneckverbindung
DE3716205C2 (https=)
DE2753544C2 (de) Vorrichtung zum Anhängen von Freileitungsseilen an eine Mehrfach-Isolatorkette
DE3119806C2 (https=)
DE3623399C1 (en) Totally insulated anchor clamp (tension clamp, dead-end clamp)
DE3539392C2 (https=)
DE2600725A1 (de) Aus einem federstahlstreifen gebildete haltefeder
DE2909898C2 (de) Vorrichtung zum Anhängen von Freileitungsseilen an eine Mehrfach-Isolatorkette
DE722001C (de) Verbindungsklemme fuer Freileitungen, insbesondere fuer Aluminiumleitungen
DE2310581C3 (de) Vorrichtungen zum Einspannen eines scheibenförmigen Halbleiterbauelementes zwischen zwei Kühlkörpern
EP3487004B1 (de) Banderdungsschelle
DE3405358C2 (https=)
DE69618572T2 (de) Verfahren zum Verbinden von Eisenbahnschienen und entsprechend hergestellte Verbindung
CH552286A (de) Elektrische klemme.
DE3744295A1 (de) Klemmvorrichtung zum festklemmen einer linear beweglichen stange
AT224727B (de) Doppelklemme zum Anschluß elektrischer Leitungen
DE2310581B2 (de) Vorrichtungen zum einspannen eines scheibenfoermigen halbleiterbauelementes zwischen zwei kuehlkoerpern
DE1944775C3 (de) Vorrichtung zum Verbinden sich kreuzender Seile eines Flächentragwerks od.dgl
DE7115886U (de) Klemme zum Anschließen insbesondere von massiven Sektorleitern an das im Quer schnitt V förmig gestaltete Ende von Flach schienen in Niederspannungsverteilungen
DE1015890B (de) Anreihklemme
DE1905767C (de) Vorrichtung zum stirnseitigen Anschluß eines Hohlprofilstabs an einen durchlaufenden Stab

Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8328 Change in the person/name/address of the agent

Free format text: KADOR, U., DIPL.-CHEM. DR.RER.NAT. KLUNKER, H., DIPL.-ING. DR.RER.NAT. SCHMITT-NILSON, G., DIPL.-ING. DR.-ING. HIRSCH, P., DIPL.-ING., PAT.-ANW., 8000 MUENCHEN

8328 Change in the person/name/address of the agent

Free format text: KLUNKER, H., DIPL.-ING. DR.RER.NAT. SCHMITT-NILSON, G., DIPL.-ING. DR.-ING. HIRSCH, P., DIPL.-ING.,PAT.-ANW., 8000 MUENCHEN