DE2426229C3 - Selbsttragender Träger für die Aufnahme von elektronischen Bauelementen - Google Patents

Selbsttragender Träger für die Aufnahme von elektronischen Bauelementen

Info

Publication number
DE2426229C3
DE2426229C3 DE2426229A DE2426229A DE2426229C3 DE 2426229 C3 DE2426229 C3 DE 2426229C3 DE 2426229 A DE2426229 A DE 2426229A DE 2426229 A DE2426229 A DE 2426229A DE 2426229 C3 DE2426229 C3 DE 2426229C3
Authority
DE
Germany
Prior art keywords
thyristor
central web
thyristors
carrier
heat sinks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2426229A
Other languages
German (de)
English (en)
Other versions
DE2426229A1 (de
DE2426229B2 (de
Inventor
Herbert 8521 Spardorf Nitsche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE2426229A priority Critical patent/DE2426229C3/de
Priority to CH617475A priority patent/CH587585A5/xx
Priority to US05/580,773 priority patent/US4015173A/en
Priority to SE7506090A priority patent/SE400693B/xx
Priority to JP50064801A priority patent/JPS511929A/ja
Publication of DE2426229A1 publication Critical patent/DE2426229A1/de
Publication of DE2426229B2 publication Critical patent/DE2426229B2/de
Application granted granted Critical
Publication of DE2426229C3 publication Critical patent/DE2426229C3/de
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031Packaged discrete devices, e.g. to-3 housings, diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4087Mounting accessories, interposers, clamping or screwing parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)
  • Inverter Devices (AREA)
  • Control Of Ac Motors In General (AREA)
  • Power Conversion In General (AREA)
DE2426229A 1974-05-29 1974-05-29 Selbsttragender Träger für die Aufnahme von elektronischen Bauelementen Expired DE2426229C3 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE2426229A DE2426229C3 (de) 1974-05-29 1974-05-29 Selbsttragender Träger für die Aufnahme von elektronischen Bauelementen
CH617475A CH587585A5 (enExample) 1974-05-29 1975-05-14
US05/580,773 US4015173A (en) 1974-05-29 1975-05-27 Support for mounting the electronic components of a single phase unit for an inverter
SE7506090A SE400693B (sv) 1974-05-29 1975-05-28 Sjelvberande berare for att upptaga elektroniska byggelement
JP50064801A JPS511929A (enExample) 1974-05-29 1975-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2426229A DE2426229C3 (de) 1974-05-29 1974-05-29 Selbsttragender Träger für die Aufnahme von elektronischen Bauelementen

Publications (3)

Publication Number Publication Date
DE2426229A1 DE2426229A1 (de) 1975-12-04
DE2426229B2 DE2426229B2 (de) 1979-03-08
DE2426229C3 true DE2426229C3 (de) 1979-10-25

Family

ID=5916897

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2426229A Expired DE2426229C3 (de) 1974-05-29 1974-05-29 Selbsttragender Träger für die Aufnahme von elektronischen Bauelementen

Country Status (5)

Country Link
US (1) US4015173A (enExample)
JP (1) JPS511929A (enExample)
CH (1) CH587585A5 (enExample)
DE (1) DE2426229C3 (enExample)
SE (1) SE400693B (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48111772U (enExample) * 1972-03-31 1973-12-21
US4243894A (en) * 1978-10-02 1981-01-06 Eaton Corporation Solid state motor control universal assembly means and method
US4639845A (en) * 1984-05-11 1987-01-27 Gto Electronics Voltage inverter
US5149216A (en) * 1985-05-16 1992-09-22 Oki Electric Industry Co., Ltd. Printer carriage assembly having thermal dissipating means
JPH071834B2 (ja) * 1986-11-12 1995-01-11 フアナツク株式会社 制御ユニツト
US4772999A (en) * 1986-12-16 1988-09-20 Merlin Gerin Static converter, especially for an uninterruptible electrical power supply system
JP2567853B2 (ja) * 1987-03-16 1996-12-25 株式会社日立製作所 電気車用インバ−タ
US5074226A (en) * 1991-02-15 1991-12-24 Field Service Associates, Inc. Flue gas conditioning system
US5184291A (en) * 1991-06-13 1993-02-02 Crowe Lawrence E Converter and inverter support module
US5245527A (en) * 1991-12-24 1993-09-14 Siemens Electric Limited Modular ac drive controller
US5323295A (en) * 1992-07-21 1994-06-21 P & P Marketing, Inc. Assembly for integrating heat generating electronic device with nonheat generating devices
EP0900471A1 (de) * 1996-05-21 1999-03-10 Siemens Aktiengesellschaft Luftgekühlter umrichter im megawattbereich
EP0900473B1 (de) * 1996-05-21 2003-07-23 Siemens Aktiengesellschaft Antriebsvorrichtung für walzgerüste
JP3159071B2 (ja) * 1996-08-01 2001-04-23 株式会社日立製作所 放熱フィンを有する電気装置
JPH11261265A (ja) * 1998-03-12 1999-09-24 Nec Corp 密閉型装置の放熱構造
JP4108348B2 (ja) * 2002-02-19 2008-06-25 株式会社三社電機製作所 電源装置
EP1996004B1 (de) * 2007-05-25 2014-07-09 SMA Solar Technology AG Wechselrichtergehäuse
JP6458444B2 (ja) * 2014-10-21 2019-01-30 株式会社デンソー 電力変換装置
FR3065319B1 (fr) * 2017-04-13 2019-04-26 Institut Vedecom Module electronique de puissance et convertisseur electrique de puissance l’incorporant
WO2023083497A1 (en) * 2021-11-11 2023-05-19 Eaton Intelligent Power Limited Electrical panelboard for power distribution including a heatsink assembly

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3147402A (en) * 1960-11-10 1964-09-01 Honeywell Regulator Co Printed circuit module with hinged circuit panel
US3219885A (en) * 1961-03-20 1965-11-23 Gen Motors Corp Transistor heat dissipator
US3236296A (en) * 1961-06-21 1966-02-22 Lambda Electronics Corp Heat exchanger
US3143592A (en) * 1961-11-14 1964-08-04 Inland Electronics Products Co Heat dissipating mounting structure for semiconductor devices
US3217793A (en) * 1962-11-30 1965-11-16 Wakefield Eng Inc Heat transfer
DE1614587B2 (de) * 1967-08-24 1976-05-13 Siemens AG, 1000 Berlin und 8000 München Gehaeuse fuer ein halbleiterbauelement
US3536960A (en) * 1968-06-26 1970-10-27 Electric Regulator Corp Heat sink module
US3601661A (en) * 1970-02-02 1971-08-24 Westinghouse Air Brake Co Finned modular electrical equipment package with mounting bracket

Also Published As

Publication number Publication date
DE2426229A1 (de) 1975-12-04
DE2426229B2 (de) 1979-03-08
SE7506090L (sv) 1975-12-01
CH587585A5 (enExample) 1977-05-13
SE400693B (sv) 1978-04-03
JPS511929A (enExample) 1976-01-09
US4015173A (en) 1977-03-29

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee