CH587585A5 - - Google Patents

Info

Publication number
CH587585A5
CH587585A5 CH617475A CH617475A CH587585A5 CH 587585 A5 CH587585 A5 CH 587585A5 CH 617475 A CH617475 A CH 617475A CH 617475 A CH617475 A CH 617475A CH 587585 A5 CH587585 A5 CH 587585A5
Authority
CH
Switzerland
Application number
CH617475A
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH587585A5 publication Critical patent/CH587585A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
CH617475A 1974-05-29 1975-05-14 CH587585A5 (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2426229A DE2426229C3 (de) 1974-05-29 1974-05-29 Selbsttragender Träger für die Aufnahme von elektronischen Bauelementen

Publications (1)

Publication Number Publication Date
CH587585A5 true CH587585A5 (xx) 1977-05-13

Family

ID=5916897

Family Applications (1)

Application Number Title Priority Date Filing Date
CH617475A CH587585A5 (xx) 1974-05-29 1975-05-14

Country Status (5)

Country Link
US (1) US4015173A (xx)
JP (1) JPS511929A (xx)
CH (1) CH587585A5 (xx)
DE (1) DE2426229C3 (xx)
SE (1) SE400693B (xx)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48111772U (xx) * 1972-03-31 1973-12-21
US4243894A (en) * 1978-10-02 1981-01-06 Eaton Corporation Solid state motor control universal assembly means and method
US4639845A (en) * 1984-05-11 1987-01-27 Gto Electronics Voltage inverter
US5149216A (en) * 1985-05-16 1992-09-22 Oki Electric Industry Co., Ltd. Printer carriage assembly having thermal dissipating means
JPH071834B2 (ja) * 1986-11-12 1995-01-11 フアナツク株式会社 制御ユニツト
US4772999A (en) * 1986-12-16 1988-09-20 Merlin Gerin Static converter, especially for an uninterruptible electrical power supply system
JP2567853B2 (ja) * 1987-03-16 1996-12-25 株式会社日立製作所 電気車用インバ−タ
US5074226A (en) * 1991-02-15 1991-12-24 Field Service Associates, Inc. Flue gas conditioning system
US5184291A (en) * 1991-06-13 1993-02-02 Crowe Lawrence E Converter and inverter support module
US5245527A (en) * 1991-12-24 1993-09-14 Siemens Electric Limited Modular ac drive controller
US5323295A (en) * 1992-07-21 1994-06-21 P & P Marketing, Inc. Assembly for integrating heat generating electronic device with nonheat generating devices
US6189352B1 (en) 1996-05-21 2001-02-20 Siemens Aktiengesellschaft Drive device for roll stands
US6262906B1 (en) 1996-05-21 2001-07-17 Siemens Aktiengesellschaft Air-cooled power converter, drive device for rolling stands, and power converter system
JP3159071B2 (ja) * 1996-08-01 2001-04-23 株式会社日立製作所 放熱フィンを有する電気装置
JPH11261265A (ja) * 1998-03-12 1999-09-24 Nec Corp 密閉型装置の放熱構造
JP4108348B2 (ja) * 2002-02-19 2008-06-25 株式会社三社電機製作所 電源装置
ES2504515T3 (es) * 2007-05-25 2014-10-08 Sma Solar Technology Ag Alojamiento de inversor
JP6458444B2 (ja) * 2014-10-21 2019-01-30 株式会社デンソー 電力変換装置
FR3065319B1 (fr) * 2017-04-13 2019-04-26 Institut Vedecom Module electronique de puissance et convertisseur electrique de puissance l’incorporant

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3147402A (en) * 1960-11-10 1964-09-01 Honeywell Regulator Co Printed circuit module with hinged circuit panel
US3219885A (en) * 1961-03-20 1965-11-23 Gen Motors Corp Transistor heat dissipator
US3236296A (en) * 1961-06-21 1966-02-22 Lambda Electronics Corp Heat exchanger
US3143592A (en) * 1961-11-14 1964-08-04 Inland Electronics Products Co Heat dissipating mounting structure for semiconductor devices
US3217793A (en) * 1962-11-30 1965-11-16 Wakefield Eng Inc Heat transfer
DE1614587B2 (de) * 1967-08-24 1976-05-13 Siemens AG, 1000 Berlin und 8000 München Gehaeuse fuer ein halbleiterbauelement
US3536960A (en) * 1968-06-26 1970-10-27 Electric Regulator Corp Heat sink module
US3601661A (en) * 1970-02-02 1971-08-24 Westinghouse Air Brake Co Finned modular electrical equipment package with mounting bracket

Also Published As

Publication number Publication date
DE2426229A1 (de) 1975-12-04
DE2426229C3 (de) 1979-10-25
US4015173A (en) 1977-03-29
DE2426229B2 (de) 1979-03-08
JPS511929A (xx) 1976-01-09
SE7506090L (sv) 1975-12-01
SE400693B (sv) 1978-04-03

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Legal Events

Date Code Title Description
PL Patent ceased