DE2313327A1 - Verfahren zum befestigen einer mit leiterspuren versehenen isolierenden folie an stromleitern auf einem substrat - Google Patents

Verfahren zum befestigen einer mit leiterspuren versehenen isolierenden folie an stromleitern auf einem substrat

Info

Publication number
DE2313327A1
DE2313327A1 DE2313327A DE2313327A DE2313327A1 DE 2313327 A1 DE2313327 A1 DE 2313327A1 DE 2313327 A DE2313327 A DE 2313327A DE 2313327 A DE2313327 A DE 2313327A DE 2313327 A1 DE2313327 A1 DE 2313327A1
Authority
DE
Germany
Prior art keywords
conductor
substrate
conductor tracks
conductors
tin solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE2313327A
Other languages
German (de)
English (en)
Inventor
Herman Budde
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE2313327A1 publication Critical patent/DE2313327A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
DE2313327A 1972-04-06 1973-03-17 Verfahren zum befestigen einer mit leiterspuren versehenen isolierenden folie an stromleitern auf einem substrat Pending DE2313327A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7204575A NL7204575A (cg-RX-API-DMAC10.html) 1972-04-06 1972-04-06

Publications (1)

Publication Number Publication Date
DE2313327A1 true DE2313327A1 (de) 1973-10-18

Family

ID=19815787

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2313327A Pending DE2313327A1 (de) 1972-04-06 1973-03-17 Verfahren zum befestigen einer mit leiterspuren versehenen isolierenden folie an stromleitern auf einem substrat

Country Status (9)

Country Link
JP (1) JPS5113994B2 (cg-RX-API-DMAC10.html)
CA (1) CA987788A (cg-RX-API-DMAC10.html)
CH (1) CH554599A (cg-RX-API-DMAC10.html)
DE (1) DE2313327A1 (cg-RX-API-DMAC10.html)
FR (1) FR2179104B1 (cg-RX-API-DMAC10.html)
GB (1) GB1423868A (cg-RX-API-DMAC10.html)
HK (1) HK4177A (cg-RX-API-DMAC10.html)
IT (1) IT980751B (cg-RX-API-DMAC10.html)
NL (1) NL7204575A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019131950A1 (de) * 2019-11-26 2021-05-27 Landulf Martin Skoda Lötpad und Verfahren zum Löten

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156235A (en) * 1976-06-21 1977-12-26 Hitachi Ltd Transistor ignitor
JPS53101268U (cg-RX-API-DMAC10.html) * 1977-01-20 1978-08-16
CN107623993B (zh) * 2017-10-31 2020-06-23 Oppo广东移动通信有限公司 一种电路板、电路板制作方法、电子设备及其装配方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3474297A (en) * 1967-06-30 1969-10-21 Texas Instruments Inc Interconnection system for complex semiconductor arrays

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019131950A1 (de) * 2019-11-26 2021-05-27 Landulf Martin Skoda Lötpad und Verfahren zum Löten

Also Published As

Publication number Publication date
NL7204575A (cg-RX-API-DMAC10.html) 1973-10-09
FR2179104A1 (cg-RX-API-DMAC10.html) 1973-11-16
JPS5113994B2 (cg-RX-API-DMAC10.html) 1976-05-06
CH554599A (de) 1974-09-30
JPS4917970A (cg-RX-API-DMAC10.html) 1974-02-16
FR2179104B1 (cg-RX-API-DMAC10.html) 1977-12-30
IT980751B (it) 1974-10-10
HK4177A (en) 1977-01-28
CA987788A (en) 1976-04-20
GB1423868A (en) 1976-02-04

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Legal Events

Date Code Title Description
OHW Rejection