CH554599A - Verfahren zum befestigen einer mit leiterspuren versehenen isolierenden folie an stromleitern auf einem substrat. - Google Patents

Verfahren zum befestigen einer mit leiterspuren versehenen isolierenden folie an stromleitern auf einem substrat.

Info

Publication number
CH554599A
CH554599A CH475573A CH475573A CH554599A CH 554599 A CH554599 A CH 554599A CH 475573 A CH475573 A CH 475573A CH 475573 A CH475573 A CH 475573A CH 554599 A CH554599 A CH 554599A
Authority
CH
Switzerland
Prior art keywords
substrate
fixing
conductor tracks
current conductors
insulating foil
Prior art date
Application number
CH475573A
Other languages
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH554599A publication Critical patent/CH554599A/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
CH475573A 1972-04-06 1973-04-03 Verfahren zum befestigen einer mit leiterspuren versehenen isolierenden folie an stromleitern auf einem substrat. CH554599A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7204575A NL7204575A (de) 1972-04-06 1972-04-06

Publications (1)

Publication Number Publication Date
CH554599A true CH554599A (de) 1974-09-30

Family

ID=19815787

Family Applications (1)

Application Number Title Priority Date Filing Date
CH475573A CH554599A (de) 1972-04-06 1973-04-03 Verfahren zum befestigen einer mit leiterspuren versehenen isolierenden folie an stromleitern auf einem substrat.

Country Status (9)

Country Link
JP (1) JPS5113994B2 (de)
CA (1) CA987788A (de)
CH (1) CH554599A (de)
DE (1) DE2313327A1 (de)
FR (1) FR2179104B1 (de)
GB (1) GB1423868A (de)
HK (1) HK4177A (de)
IT (1) IT980751B (de)
NL (1) NL7204575A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156235A (en) * 1976-06-21 1977-12-26 Hitachi Ltd Transistor ignitor
JPS53101268U (de) * 1977-01-20 1978-08-16
CN107623993B (zh) * 2017-10-31 2020-06-23 Oppo广东移动通信有限公司 一种电路板、电路板制作方法、电子设备及其装配方法
DE102019131950A1 (de) * 2019-11-26 2021-05-27 Landulf Martin Skoda Lötpad und Verfahren zum Löten

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3474297A (en) * 1967-06-30 1969-10-21 Texas Instruments Inc Interconnection system for complex semiconductor arrays

Also Published As

Publication number Publication date
FR2179104B1 (de) 1977-12-30
DE2313327A1 (de) 1973-10-18
JPS5113994B2 (de) 1976-05-06
NL7204575A (de) 1973-10-09
GB1423868A (en) 1976-02-04
FR2179104A1 (de) 1973-11-16
IT980751B (it) 1974-10-10
JPS4917970A (de) 1974-02-16
CA987788A (en) 1976-04-20
HK4177A (en) 1977-01-28

Similar Documents

Publication Publication Date Title
DK255077A (da) Fremgangsmade til at pafore et afriveligt ledende lag pa en isoleret kabelleder
CH513570A (de) Elektrische Schaltung mit einem elektrisch isolierenden Träger und Verfahren zu deren Herstellung
IT1007196B (it) Metodo per effettuare connessioni elettriche a conduttori isolati sot tili e relativi connettori elettri ci
FR2294610A1 (fr) Procede de formation de conducteurs electriques sur un substrat isolant
IT951918B (it) Metodo ed apparecchio per fabbricare cavi elettrici isolati
NL7706107A (nl) Werkwijze voor het vormen van een geleiderpatroon op een isolerende laag.
BE836260A (fr) Procede de formation de conducteurs electriques sur un substrat isolant
IT983958B (it) Apparecchio per produrre condut tori elettrici isolati
CH554599A (de) Verfahren zum befestigen einer mit leiterspuren versehenen isolierenden folie an stromleitern auf einem substrat.
TR18538A (tr) Elektrik iletkenleri uezerinde yalitkan kaplamalarin elde edilmesine mahsus usul
IT970917B (it) Giunti perfezionati per cavi a conduttori isolati con dielettri co estruso
FR2283026A1 (fr) Rails conducteurs de courant raccordes sans solution de continuite
CH522999A (de) Biegsame, elektrisch isolierende Folie mit einem Muster von Leiterbahnen
AR210111A1 (es) Un metodo de fabricar una capa aislante en un cable
ATA254174A (de) Verfahren zur herstellung einer elektrisch leitenden metallschicht auf einem traeger
NL7416547A (nl) Kunststofbuis met elektrisch geleidende bekledingslaag.
SE7713869L (sv) Anordning for kontinuerlig merkning av isolerade elektriska ledare
IT961375B (it) Metodo per produrre disposizioni di conduttori elettrici per circuiti stampati
CH523741A (de) Verfahren zur Verbesserung der Oberflächenhaftfähigkeit einer elektrisch leitenden Trägerbahn
DK137585B (da) Fremgangsmåde til fremstilling af isolerende overtræk på elektriske ledere.
FI51711C (fi) Menetelmä eristyskerroksen valmistamiseksi sähköjohtimilla.
CH462909A (de) Verfahren zur Herstellung flächenhafter elektrischer Leitungszüge auf einem Isoliermaterial
AT349589B (de) Verfahren zur isolierung von elektrischen leitern mit harzschmelzen
CH550503A (de) Verfahren zum herstellen einer kabel-verbindungsanordnung fuer isolierte elektrische leiter.
NO774122L (no) Isolasjonslag for elektriske kabler

Legal Events

Date Code Title Description
PL Patent ceased