BE836260A - Procede de formation de conducteurs electriques sur un substrat isolant - Google Patents
Procede de formation de conducteurs electriques sur un substrat isolantInfo
- Publication number
- BE836260A BE836260A BE162432A BE162432A BE836260A BE 836260 A BE836260 A BE 836260A BE 162432 A BE162432 A BE 162432A BE 162432 A BE162432 A BE 162432A BE 836260 A BE836260 A BE 836260A
- Authority
- BE
- Belgium
- Prior art keywords
- insulating substrate
- electric conductors
- training electric
- training
- conductors
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/531,430 US4068022A (en) | 1974-12-10 | 1974-12-10 | Methods of strengthening bonds |
Publications (1)
Publication Number | Publication Date |
---|---|
BE836260A true BE836260A (fr) | 1976-04-01 |
Family
ID=24117619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE162432A BE836260A (fr) | 1974-12-10 | 1975-12-04 | Procede de formation de conducteurs electriques sur un substrat isolant |
Country Status (2)
Country | Link |
---|---|
US (1) | US4068022A (fr) |
BE (1) | BE836260A (fr) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4016050A (en) * | 1975-05-12 | 1977-04-05 | Bell Telephone Laboratories, Incorporated | Conduction system for thin film and hybrid integrated circuits |
DE2906888A1 (de) * | 1979-02-22 | 1980-09-04 | Degussa | Verfahren zur herstellung hartloetfaehiger metallschichten auf keramik |
US4221047A (en) * | 1979-03-23 | 1980-09-09 | International Business Machines Corporation | Multilayered glass-ceramic substrate for mounting of semiconductor device |
US4366186A (en) * | 1979-09-27 | 1982-12-28 | Bell Telephone Laboratories, Incorporated | Ohmic contact to p-type InP |
US4409261A (en) * | 1980-02-07 | 1983-10-11 | Cts Corporation | Process for air firing oxidizable conductors |
US4495255A (en) * | 1980-10-30 | 1985-01-22 | At&T Technologies, Inc. | Laser surface alloying |
JPS5817649A (ja) * | 1981-07-24 | 1983-02-01 | Fujitsu Ltd | 電子部品パツケ−ジ |
JPS59167096A (ja) * | 1983-03-11 | 1984-09-20 | 日本電気株式会社 | 回路基板 |
US4685210A (en) * | 1985-03-13 | 1987-08-11 | The Boeing Company | Multi-layer circuit board bonding method utilizing noble metal coated surfaces |
US6001461A (en) * | 1992-08-27 | 1999-12-14 | Kabushiki Kaisha Toshiba | Electronic parts and manufacturing method thereof |
US5709958A (en) * | 1992-08-27 | 1998-01-20 | Kabushiki Kaisha Toshiba | Electronic parts |
US5399239A (en) * | 1992-12-18 | 1995-03-21 | Ceridian Corporation | Method of fabricating conductive structures on substrates |
JP3114538B2 (ja) * | 1994-12-12 | 2000-12-04 | 株式会社村田製作所 | 圧電体素子及びその製造方法 |
JP3000877B2 (ja) * | 1995-02-20 | 2000-01-17 | 松下電器産業株式会社 | 金メッキ電極の形成方法、基板及びワイヤボンディング方法 |
JP3022765B2 (ja) * | 1996-03-27 | 2000-03-21 | 日本電気株式会社 | 半導体装置及び半導体素子の実装方法 |
US5910644A (en) * | 1997-06-11 | 1999-06-08 | International Business Machines Corporation | Universal surface finish for DCA, SMT and pad on pad interconnections |
US6232651B1 (en) * | 1999-05-21 | 2001-05-15 | Samsung Aerospace Industries, Ltd. | Lead frame for semiconductor device |
JP6303481B2 (ja) * | 2013-12-20 | 2018-04-04 | セイコーエプソン株式会社 | 発光素子モジュール、量子干渉装置、原子発振器、電子機器および移動体 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3290127A (en) * | 1964-03-30 | 1966-12-06 | Bell Telephone Labor Inc | Barrier diode with metal contact and method of making |
US3386894A (en) * | 1964-09-28 | 1968-06-04 | Northern Electric Co | Formation of metallic contacts |
GB1202199A (en) * | 1966-11-22 | 1970-08-12 | G V Planer Ltd | Improvements in or relating to thermoelectric devices |
US3665254A (en) * | 1970-10-12 | 1972-05-23 | Rca Corp | Semiconductor diode |
US3765970A (en) * | 1971-06-24 | 1973-10-16 | Rca Corp | Method of making beam leads for semiconductor devices |
US3686080A (en) * | 1971-07-21 | 1972-08-22 | Rca Corp | Method of fabrication of semiconductor devices |
US3890177A (en) * | 1971-08-27 | 1975-06-17 | Bell Telephone Labor Inc | Technique for the fabrication of air-isolated crossovers |
US3708403A (en) * | 1971-09-01 | 1973-01-02 | L Terry | Self-aligning electroplating mask |
US3783056A (en) * | 1972-06-20 | 1974-01-01 | Bell Telephone Labor Inc | Technique for the fabrication of an air isolated crossover |
-
1974
- 1974-12-10 US US05/531,430 patent/US4068022A/en not_active Expired - Lifetime
-
1975
- 1975-12-04 BE BE162432A patent/BE836260A/fr not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US4068022A (en) | 1978-01-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2294610A1 (fr) | Procede de formation de conducteurs electriques sur un substrat isolant | |
BE836260A (fr) | Procede de formation de conducteurs electriques sur un substrat isolant | |
DK255077A (da) | Fremgangsmade til at pafore et afriveligt ledende lag pa en isoleret kabelleder | |
IT1094980B (it) | Metodo per la formazione di distanziatori su di un substrato isolante | |
SE406994B (sv) | Tradinforingsanordning for elektriska kontaktdon | |
BE859048A (fr) | Blocs isolants pour connecteurs electriques | |
BR7605255A (pt) | Conector eletrico incluindo contato abridor de isolamento | |
BE825023A (fr) | Procede de formation de revetements isolants sur des conducteurs electriques | |
JPS532357A (en) | Preetreating process for nonnelectroplating electroconductive metal onto insulating substrate | |
NO139906C (no) | Elektrisk kontaktinnretning omfattende et isolerende hus som danner klemmeopptagende hulrom | |
FR2286518A1 (fr) | Connecteur electrique perfectionne pour cable plat multiconducteur | |
SE7603439L (sv) | Klemdon for isolerande ledare | |
FR2342545A1 (fr) | Procede pour la fabrication de conducteurs electriques | |
NL174686C (nl) | Elektrische verbindingsinrichting voor elektrische geleiders. | |
FR2380636B1 (fr) | Procede pour former une couche electriquement isolante sur un substrat | |
GB1546240A (en) | Tool for stripping the insulation from electrical conductors | |
IT1059103B (it) | Processo per elettroisolare con duttori metallici | |
JPS5351474A (en) | Method of forming electrode on insulating substrate | |
DK137585B (da) | Fremgangsmåde til fremstilling af isolerende overtræk på elektriske ledere. | |
BE781752A (fr) | Conducteurs electriques isoles et procede de fabrication | |
BE843399A (fr) | Procede et dispositif pour fabriquer des contacts electriques | |
DK131177A (da) | Fremgangsmade til fremstilling af isolerende overtrek pa elektriske ledere | |
IT987377B (it) | Custodie isolanti per dispositivi elettrici | |
BE838572A (fr) | Procede de fabrication d'un conducteur electrique | |
HU172498B (hu) | Sposob nanesenija tokoprovodjahhego figurnogo sloja na poluprovodnikovyj ili izoljacionnyj nositel' |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RE20 | Patent expired |
Owner name: WESTERN ELECTRIC CY INC. Effective date: 19951204 |