BE836260A - Procede de formation de conducteurs electriques sur un substrat isolant - Google Patents

Procede de formation de conducteurs electriques sur un substrat isolant

Info

Publication number
BE836260A
BE836260A BE162432A BE162432A BE836260A BE 836260 A BE836260 A BE 836260A BE 162432 A BE162432 A BE 162432A BE 162432 A BE162432 A BE 162432A BE 836260 A BE836260 A BE 836260A
Authority
BE
Belgium
Prior art keywords
insulating substrate
electric conductors
training electric
training
conductors
Prior art date
Application number
BE162432A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE836260A publication Critical patent/BE836260A/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
BE162432A 1974-12-10 1975-12-04 Procede de formation de conducteurs electriques sur un substrat isolant BE836260A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/531,430 US4068022A (en) 1974-12-10 1974-12-10 Methods of strengthening bonds

Publications (1)

Publication Number Publication Date
BE836260A true BE836260A (fr) 1976-04-01

Family

ID=24117619

Family Applications (1)

Application Number Title Priority Date Filing Date
BE162432A BE836260A (fr) 1974-12-10 1975-12-04 Procede de formation de conducteurs electriques sur un substrat isolant

Country Status (2)

Country Link
US (1) US4068022A (fr)
BE (1) BE836260A (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4016050A (en) * 1975-05-12 1977-04-05 Bell Telephone Laboratories, Incorporated Conduction system for thin film and hybrid integrated circuits
DE2906888A1 (de) * 1979-02-22 1980-09-04 Degussa Verfahren zur herstellung hartloetfaehiger metallschichten auf keramik
US4221047A (en) * 1979-03-23 1980-09-09 International Business Machines Corporation Multilayered glass-ceramic substrate for mounting of semiconductor device
US4366186A (en) * 1979-09-27 1982-12-28 Bell Telephone Laboratories, Incorporated Ohmic contact to p-type InP
US4409261A (en) * 1980-02-07 1983-10-11 Cts Corporation Process for air firing oxidizable conductors
US4495255A (en) * 1980-10-30 1985-01-22 At&T Technologies, Inc. Laser surface alloying
JPS5817649A (ja) * 1981-07-24 1983-02-01 Fujitsu Ltd 電子部品パツケ−ジ
JPS59167096A (ja) * 1983-03-11 1984-09-20 日本電気株式会社 回路基板
US4685210A (en) * 1985-03-13 1987-08-11 The Boeing Company Multi-layer circuit board bonding method utilizing noble metal coated surfaces
US6001461A (en) * 1992-08-27 1999-12-14 Kabushiki Kaisha Toshiba Electronic parts and manufacturing method thereof
US5709958A (en) * 1992-08-27 1998-01-20 Kabushiki Kaisha Toshiba Electronic parts
US5399239A (en) * 1992-12-18 1995-03-21 Ceridian Corporation Method of fabricating conductive structures on substrates
JP3114538B2 (ja) * 1994-12-12 2000-12-04 株式会社村田製作所 圧電体素子及びその製造方法
JP3000877B2 (ja) * 1995-02-20 2000-01-17 松下電器産業株式会社 金メッキ電極の形成方法、基板及びワイヤボンディング方法
JP3022765B2 (ja) * 1996-03-27 2000-03-21 日本電気株式会社 半導体装置及び半導体素子の実装方法
US5910644A (en) * 1997-06-11 1999-06-08 International Business Machines Corporation Universal surface finish for DCA, SMT and pad on pad interconnections
US6232651B1 (en) * 1999-05-21 2001-05-15 Samsung Aerospace Industries, Ltd. Lead frame for semiconductor device
JP6303481B2 (ja) * 2013-12-20 2018-04-04 セイコーエプソン株式会社 発光素子モジュール、量子干渉装置、原子発振器、電子機器および移動体

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3290127A (en) * 1964-03-30 1966-12-06 Bell Telephone Labor Inc Barrier diode with metal contact and method of making
US3386894A (en) * 1964-09-28 1968-06-04 Northern Electric Co Formation of metallic contacts
GB1202199A (en) * 1966-11-22 1970-08-12 G V Planer Ltd Improvements in or relating to thermoelectric devices
US3665254A (en) * 1970-10-12 1972-05-23 Rca Corp Semiconductor diode
US3765970A (en) * 1971-06-24 1973-10-16 Rca Corp Method of making beam leads for semiconductor devices
US3686080A (en) * 1971-07-21 1972-08-22 Rca Corp Method of fabrication of semiconductor devices
US3890177A (en) * 1971-08-27 1975-06-17 Bell Telephone Labor Inc Technique for the fabrication of air-isolated crossovers
US3708403A (en) * 1971-09-01 1973-01-02 L Terry Self-aligning electroplating mask
US3783056A (en) * 1972-06-20 1974-01-01 Bell Telephone Labor Inc Technique for the fabrication of an air isolated crossover

Also Published As

Publication number Publication date
US4068022A (en) 1978-01-10

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Legal Events

Date Code Title Description
RE20 Patent expired

Owner name: WESTERN ELECTRIC CY INC.

Effective date: 19951204