CH537140A - Verfahren zum Anbringen eines Leitermusters auf einer isolierenden biegsamen Kunststoffolie - Google Patents

Verfahren zum Anbringen eines Leitermusters auf einer isolierenden biegsamen Kunststoffolie

Info

Publication number
CH537140A
CH537140A CH152372A CH152372A CH537140A CH 537140 A CH537140 A CH 537140A CH 152372 A CH152372 A CH 152372A CH 152372 A CH152372 A CH 152372A CH 537140 A CH537140 A CH 537140A
Authority
CH
Switzerland
Prior art keywords
applying
plastic film
conductor pattern
flexible plastic
insulating flexible
Prior art date
Application number
CH152372A
Other languages
English (en)
Inventor
Leendert Nelse Jan
Adriaan Groenewegen Martinus
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH537140A publication Critical patent/CH537140A/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/931—Components of differing electric conductivity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CH152372A 1971-02-05 1972-02-02 Verfahren zum Anbringen eines Leitermusters auf einer isolierenden biegsamen Kunststoffolie CH537140A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7101602A NL7101602A (de) 1971-02-05 1971-02-05

Publications (1)

Publication Number Publication Date
CH537140A true CH537140A (de) 1973-05-15

Family

ID=19812419

Family Applications (1)

Application Number Title Priority Date Filing Date
CH152372A CH537140A (de) 1971-02-05 1972-02-02 Verfahren zum Anbringen eines Leitermusters auf einer isolierenden biegsamen Kunststoffolie

Country Status (9)

Country Link
US (1) US3821847A (de)
AU (1) AU471692B2 (de)
CA (1) CA978662A (de)
CH (1) CH537140A (de)
DE (1) DE2202801C3 (de)
FR (1) FR2124489B1 (de)
GB (1) GB1373433A (de)
IT (1) IT947242B (de)
NL (1) NL7101602A (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4134801A (en) * 1976-05-17 1979-01-16 U.S. Philips Corporation Terminal connections on microcircuit chips
GB2137805B (en) * 1982-11-19 1987-01-28 Stanley Bracey Chip carrier
GB8706857D0 (en) * 1987-03-23 1987-04-29 Bradley International Ltd Alle Chip carriers
US4827376A (en) * 1987-10-05 1989-05-02 Olin Corporation Heat dissipating interconnect tape for use in tape automated bonding
US4849857A (en) * 1987-10-05 1989-07-18 Olin Corporation Heat dissipating interconnect tape for use in tape automated bonding
US5032542A (en) * 1988-11-18 1991-07-16 Sanyo Electric Co., Ltd. Method of mass-producing integrated circuit devices using strip lead frame
JPH02306690A (ja) * 1989-05-22 1990-12-20 Toshiba Corp 表面実装用配線基板の製造方法
DE59107919D1 (de) * 1990-07-23 1996-07-18 Siemens Nixdorf Inf Syst Filmträger zur bandautomatischen Verdrahtung
US5956237A (en) * 1993-12-24 1999-09-21 Ibiden Co., Ltd. Primary printed wiring board
US7128442B2 (en) * 2003-05-09 2006-10-31 Kian Shin Lee Illumination unit with a solid-state light generating source, a flexible substrate, and a flexible and optically transparent encapsulant
US6860620B2 (en) * 2003-05-09 2005-03-01 Agilent Technologies, Inc. Light unit having light emitting diodes

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2438205A (en) * 1945-09-15 1948-03-23 Douglas Aircraft Co Inc Measuring instrument
US2854386A (en) * 1955-02-07 1958-09-30 Aladdin Ind Inc Method of photographically printing conductive metallic patterns
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
ES316614A1 (es) * 1964-08-24 1966-07-01 Gen Electric Un procedimiento para preparar una composicion electronicamente conductora.
DE1263126B (de) * 1966-04-01 1968-03-14 Standard Elektrik Lorenz Ag Verfahren zur Herstellung von Duennfilmschaltungen
GB1188451A (en) * 1968-01-26 1970-04-15 Ass Elect Ind Improvements relating to methods of making Connections to Small Components
US3548494A (en) * 1968-01-31 1970-12-22 Western Electric Co Method of forming plated metallic patterns on a substrate
US3668003A (en) * 1969-11-26 1972-06-06 Cirkitrite Ltd Printed circuits

Also Published As

Publication number Publication date
DE2202801B2 (de) 1979-06-13
IT947242B (it) 1973-05-21
AU3853772A (en) 1973-08-09
US3821847A (en) 1974-07-02
FR2124489A1 (de) 1972-09-22
CA978662A (en) 1975-11-25
GB1373433A (en) 1974-11-13
NL7101602A (de) 1972-08-08
AU471692B2 (en) 1973-08-09
DE2202801A1 (de) 1972-08-17
DE2202801C3 (de) 1981-12-17
FR2124489B1 (de) 1975-10-24

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Legal Events

Date Code Title Description
PL Patent ceased