IT947242B - Metodo per formare un disegno di conduttori su di un sottile foglio flessibile ed isolante di materia le sintetico - Google Patents
Metodo per formare un disegno di conduttori su di un sottile foglio flessibile ed isolante di materia le sinteticoInfo
- Publication number
- IT947242B IT947242B IT20144/72A IT2014472A IT947242B IT 947242 B IT947242 B IT 947242B IT 20144/72 A IT20144/72 A IT 20144/72A IT 2014472 A IT2014472 A IT 2014472A IT 947242 B IT947242 B IT 947242B
- Authority
- IT
- Italy
- Prior art keywords
- conductors
- flexible
- thin
- forming
- insulating sheet
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/931—Components of differing electric conductivity
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Wire Bonding (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7101602A NL7101602A (it) | 1971-02-05 | 1971-02-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT947242B true IT947242B (it) | 1973-05-21 |
Family
ID=19812419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT20144/72A IT947242B (it) | 1971-02-05 | 1972-02-02 | Metodo per formare un disegno di conduttori su di un sottile foglio flessibile ed isolante di materia le sintetico |
Country Status (9)
Country | Link |
---|---|
US (1) | US3821847A (it) |
AU (1) | AU471692B2 (it) |
CA (1) | CA978662A (it) |
CH (1) | CH537140A (it) |
DE (1) | DE2202801C3 (it) |
FR (1) | FR2124489B1 (it) |
GB (1) | GB1373433A (it) |
IT (1) | IT947242B (it) |
NL (1) | NL7101602A (it) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4134801A (en) * | 1976-05-17 | 1979-01-16 | U.S. Philips Corporation | Terminal connections on microcircuit chips |
GB2137805B (en) * | 1982-11-19 | 1987-01-28 | Stanley Bracey | Chip carrier |
GB8706857D0 (en) * | 1987-03-23 | 1987-04-29 | Bradley International Ltd Alle | Chip carriers |
US4827376A (en) * | 1987-10-05 | 1989-05-02 | Olin Corporation | Heat dissipating interconnect tape for use in tape automated bonding |
US4849857A (en) * | 1987-10-05 | 1989-07-18 | Olin Corporation | Heat dissipating interconnect tape for use in tape automated bonding |
US5032542A (en) * | 1988-11-18 | 1991-07-16 | Sanyo Electric Co., Ltd. | Method of mass-producing integrated circuit devices using strip lead frame |
JPH02306690A (ja) * | 1989-05-22 | 1990-12-20 | Toshiba Corp | 表面実装用配線基板の製造方法 |
ATE139370T1 (de) * | 1990-07-23 | 1996-06-15 | Siemens Nixdorf Inf Syst | Filmträger zur bandautomatischen verdrahtung |
EP0737025A4 (en) * | 1993-12-24 | 1998-06-17 | Ibiden Co Ltd | PRINTED CIRCUIT BOARD |
US7128442B2 (en) * | 2003-05-09 | 2006-10-31 | Kian Shin Lee | Illumination unit with a solid-state light generating source, a flexible substrate, and a flexible and optically transparent encapsulant |
US6860620B2 (en) * | 2003-05-09 | 2005-03-01 | Agilent Technologies, Inc. | Light unit having light emitting diodes |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2438205A (en) * | 1945-09-15 | 1948-03-23 | Douglas Aircraft Co Inc | Measuring instrument |
US2854386A (en) * | 1955-02-07 | 1958-09-30 | Aladdin Ind Inc | Method of photographically printing conductive metallic patterns |
US3099608A (en) * | 1959-12-30 | 1963-07-30 | Ibm | Method of electroplating on a dielectric base |
ES316614A1 (es) * | 1964-08-24 | 1966-07-01 | Gen Electric | Un procedimiento para preparar una composicion electronicamente conductora. |
DE1263126B (de) * | 1966-04-01 | 1968-03-14 | Standard Elektrik Lorenz Ag | Verfahren zur Herstellung von Duennfilmschaltungen |
GB1188451A (en) * | 1968-01-26 | 1970-04-15 | Ass Elect Ind | Improvements relating to methods of making Connections to Small Components |
US3548494A (en) * | 1968-01-31 | 1970-12-22 | Western Electric Co | Method of forming plated metallic patterns on a substrate |
US3668003A (en) * | 1969-11-26 | 1972-06-06 | Cirkitrite Ltd | Printed circuits |
-
1971
- 1971-02-05 NL NL7101602A patent/NL7101602A/xx unknown
-
1972
- 1972-01-21 DE DE2202801A patent/DE2202801C3/de not_active Expired
- 1972-01-26 US US00220981A patent/US3821847A/en not_active Expired - Lifetime
- 1972-01-31 CA CA133,487A patent/CA978662A/en not_active Expired
- 1972-02-02 CH CH152372A patent/CH537140A/de not_active IP Right Cessation
- 1972-02-02 IT IT20144/72A patent/IT947242B/it active
- 1972-02-02 AU AU38537/72A patent/AU471692B2/en not_active Expired
- 1972-02-02 GB GB489772A patent/GB1373433A/en not_active Expired
- 1972-02-04 FR FR7203794A patent/FR2124489B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL7101602A (it) | 1972-08-08 |
FR2124489A1 (it) | 1972-09-22 |
US3821847A (en) | 1974-07-02 |
GB1373433A (en) | 1974-11-13 |
CH537140A (de) | 1973-05-15 |
DE2202801C3 (de) | 1981-12-17 |
FR2124489B1 (it) | 1975-10-24 |
AU3853772A (en) | 1973-08-09 |
DE2202801A1 (de) | 1972-08-17 |
AU471692B2 (en) | 1973-08-09 |
DE2202801B2 (de) | 1979-06-13 |
CA978662A (en) | 1975-11-25 |
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