NL7101602A - - Google Patents

Info

Publication number
NL7101602A
NL7101602A NL7101602A NL7101602A NL7101602A NL 7101602 A NL7101602 A NL 7101602A NL 7101602 A NL7101602 A NL 7101602A NL 7101602 A NL7101602 A NL 7101602A NL 7101602 A NL7101602 A NL 7101602A
Authority
NL
Netherlands
Application number
NL7101602A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL7101602A priority Critical patent/NL7101602A/xx
Priority to DE2202801A priority patent/DE2202801C3/de
Priority to US00220981A priority patent/US3821847A/en
Priority to CA133,487A priority patent/CA978662A/en
Priority to CH152372A priority patent/CH537140A/de
Priority to AU38537/72A priority patent/AU471692B2/en
Priority to IT20144/72A priority patent/IT947242B/it
Priority to GB489772A priority patent/GB1373433A/en
Priority to FR7203794A priority patent/FR2124489B1/fr
Publication of NL7101602A publication Critical patent/NL7101602A/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49572Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/241Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/922Static electricity metal bleed-off metallic stock
    • Y10S428/9265Special properties
    • Y10S428/931Components of differing electric conductivity
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/922Static electricity metal bleed-off metallic stock
    • Y10S428/9335Product by special process
    • Y10S428/934Electrical process
    • Y10S428/935Electroplating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49121Beam lead frame or beam lead device
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
NL7101602A 1971-02-05 1971-02-05 NL7101602A (xx)

Priority Applications (9)

Application Number Priority Date Filing Date Title
NL7101602A NL7101602A (xx) 1971-02-05 1971-02-05
DE2202801A DE2202801C3 (de) 1971-02-05 1972-01-21 Verfahren zum Herstellen einer Kontaktierungsvorrichtung für Halbleiterkörper
US00220981A US3821847A (en) 1971-02-05 1972-01-26 Method of providing a pattern of conductors on an insulating flexible foil of a synthetic material
CA133,487A CA978662A (en) 1971-02-05 1972-01-31 Method of providing a pattern of conductors on an insulating flexible foil of a synthetic material
CH152372A CH537140A (de) 1971-02-05 1972-02-02 Verfahren zum Anbringen eines Leitermusters auf einer isolierenden biegsamen Kunststoffolie
AU38537/72A AU471692B2 (en) 1971-02-05 1972-02-02 Method of providing a. pattern of conductors onan insulating flexible foil ofa synthetic material
IT20144/72A IT947242B (it) 1971-02-05 1972-02-02 Metodo per formare un disegno di conduttori su di un sottile foglio flessibile ed isolante di materia le sintetico
GB489772A GB1373433A (en) 1971-02-05 1972-02-02 Providing patterns of conductors on an insulating flexible foil
FR7203794A FR2124489B1 (xx) 1971-02-05 1972-02-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7101602A NL7101602A (xx) 1971-02-05 1971-02-05

Publications (1)

Publication Number Publication Date
NL7101602A true NL7101602A (xx) 1972-08-08

Family

ID=19812419

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7101602A NL7101602A (xx) 1971-02-05 1971-02-05

Country Status (9)

Country Link
US (1) US3821847A (xx)
AU (1) AU471692B2 (xx)
CA (1) CA978662A (xx)
CH (1) CH537140A (xx)
DE (1) DE2202801C3 (xx)
FR (1) FR2124489B1 (xx)
GB (1) GB1373433A (xx)
IT (1) IT947242B (xx)
NL (1) NL7101602A (xx)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4134801A (en) * 1976-05-17 1979-01-16 U.S. Philips Corporation Terminal connections on microcircuit chips
GB2137805B (en) * 1982-11-19 1987-01-28 Stanley Bracey Chip carrier
GB8706857D0 (en) * 1987-03-23 1987-04-29 Bradley International Ltd Alle Chip carriers
US4827376A (en) * 1987-10-05 1989-05-02 Olin Corporation Heat dissipating interconnect tape for use in tape automated bonding
US4849857A (en) * 1987-10-05 1989-07-18 Olin Corporation Heat dissipating interconnect tape for use in tape automated bonding
US5032542A (en) * 1988-11-18 1991-07-16 Sanyo Electric Co., Ltd. Method of mass-producing integrated circuit devices using strip lead frame
JPH02306690A (ja) * 1989-05-22 1990-12-20 Toshiba Corp 表面実装用配線基板の製造方法
ATE139370T1 (de) * 1990-07-23 1996-06-15 Siemens Nixdorf Inf Syst Filmträger zur bandautomatischen verdrahtung
EP0737025A4 (en) * 1993-12-24 1998-06-17 Ibiden Co Ltd PRINTED CIRCUIT BOARD
US7128442B2 (en) * 2003-05-09 2006-10-31 Kian Shin Lee Illumination unit with a solid-state light generating source, a flexible substrate, and a flexible and optically transparent encapsulant
US6860620B2 (en) * 2003-05-09 2005-03-01 Agilent Technologies, Inc. Light unit having light emitting diodes

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2438205A (en) * 1945-09-15 1948-03-23 Douglas Aircraft Co Inc Measuring instrument
US2854386A (en) * 1955-02-07 1958-09-30 Aladdin Ind Inc Method of photographically printing conductive metallic patterns
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
ES316614A1 (es) * 1964-08-24 1966-07-01 Gen Electric Un procedimiento para preparar una composicion electronicamente conductora.
DE1263126B (de) * 1966-04-01 1968-03-14 Standard Elektrik Lorenz Ag Verfahren zur Herstellung von Duennfilmschaltungen
GB1188451A (en) * 1968-01-26 1970-04-15 Ass Elect Ind Improvements relating to methods of making Connections to Small Components
US3548494A (en) * 1968-01-31 1970-12-22 Western Electric Co Method of forming plated metallic patterns on a substrate
US3668003A (en) * 1969-11-26 1972-06-06 Cirkitrite Ltd Printed circuits

Also Published As

Publication number Publication date
AU3853772A (en) 1973-08-09
GB1373433A (en) 1974-11-13
FR2124489B1 (xx) 1975-10-24
AU471692B2 (en) 1973-08-09
DE2202801A1 (de) 1972-08-17
IT947242B (it) 1973-05-21
US3821847A (en) 1974-07-02
DE2202801C3 (de) 1981-12-17
FR2124489A1 (xx) 1972-09-22
DE2202801B2 (de) 1979-06-13
CA978662A (en) 1975-11-25
CH537140A (de) 1973-05-15

Similar Documents

Publication Publication Date Title
ATA136472A (xx)
FR2124489B1 (xx)
AR196074A1 (xx)
AU2658571A (xx)
AU2691671A (xx)
AU3005371A (xx)
AU2684071A (xx)
AU2742671A (xx)
AU2894671A (xx)
AU2941471A (xx)
AU2952271A (xx)
AU2755871A (xx)
AU2940971A (xx)
AU2654071A (xx)
AU2930871A (xx)
AU2669471A (xx)
AU3038671A (xx)
AU3025871A (xx)
AU2684171A (xx)
AU2963771A (xx)
AU2706571A (xx)
AU2724971A (xx)
AU2726271A (xx)
AU2938071A (xx)
AR192311Q (xx)