DE2104207B2 - Verfahren zum verbinden eines kontaktierungsdrahtes - Google Patents

Verfahren zum verbinden eines kontaktierungsdrahtes

Info

Publication number
DE2104207B2
DE2104207B2 DE19712104207 DE2104207A DE2104207B2 DE 2104207 B2 DE2104207 B2 DE 2104207B2 DE 19712104207 DE19712104207 DE 19712104207 DE 2104207 A DE2104207 A DE 2104207A DE 2104207 B2 DE2104207 B2 DE 2104207B2
Authority
DE
Germany
Prior art keywords
contact wire
wire
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19712104207
Other languages
English (en)
Other versions
DE2104207A1 (de
DE2104207C3 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to DE2104207A priority Critical patent/DE2104207C3/de
Priority to US00219664A priority patent/US3787966A/en
Priority to AU38316/72A priority patent/AU456451B2/en
Publication of DE2104207A1 publication Critical patent/DE2104207A1/de
Publication of DE2104207B2 publication Critical patent/DE2104207B2/de
Application granted granted Critical
Publication of DE2104207C3 publication Critical patent/DE2104207C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
DE2104207A 1971-01-29 1971-01-29 Verfahren zum Verbinden eines Kontaktierungsdrahtes Expired DE2104207C3 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE2104207A DE2104207C3 (de) 1971-01-29 1971-01-29 Verfahren zum Verbinden eines Kontaktierungsdrahtes
US00219664A US3787966A (en) 1971-01-29 1972-01-21 Method of connecting a contacting wire to a metal contact on the surface of a semiconductor element
AU38316/72A AU456451B2 (en) 1971-01-29 1972-01-26 Method of connecting a contacting wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2104207A DE2104207C3 (de) 1971-01-29 1971-01-29 Verfahren zum Verbinden eines Kontaktierungsdrahtes

Publications (3)

Publication Number Publication Date
DE2104207A1 DE2104207A1 (de) 1972-08-24
DE2104207B2 true DE2104207B2 (de) 1973-08-16
DE2104207C3 DE2104207C3 (de) 1974-04-11

Family

ID=5797290

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2104207A Expired DE2104207C3 (de) 1971-01-29 1971-01-29 Verfahren zum Verbinden eines Kontaktierungsdrahtes

Country Status (3)

Country Link
US (1) US3787966A (de)
AU (1) AU456451B2 (de)
DE (1) DE2104207C3 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3941298A (en) * 1972-10-26 1976-03-02 Esec Sales S.A. Process of making wire connections in semi-conductor elements
US4067039A (en) * 1975-03-17 1978-01-03 Motorola, Inc. Ultrasonic bonding head
US4060888A (en) * 1976-06-29 1977-12-06 Tyco Filters Division, Inc. Method of improving ohmic contact through high-resistance oxide film
US4068371A (en) * 1976-07-12 1978-01-17 Miller Charles F Method for completing wire bonds
US4576322A (en) * 1984-09-14 1986-03-18 Burroughs Corporation Machine for ultrasonically bonding wires to cavity-down integrated circuit packages
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US4925085A (en) * 1989-05-25 1990-05-15 Motorola Inc. Bonding means and method
US5304429A (en) * 1992-03-24 1994-04-19 General Instrument Corporation Semiconductor devices having copper terminal leads
US7200930B2 (en) * 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
US7084656B1 (en) 1993-11-16 2006-08-01 Formfactor, Inc. Probe for semiconductor devices
JP3504448B2 (ja) * 1996-10-17 2004-03-08 株式会社ルネサステクノロジ 半導体装置
EP1375048B1 (de) * 2002-06-18 2008-05-21 F&K Delvotec Bondtechnik GmbH Bondeinrichtung und Drahtbonder

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3087239A (en) * 1959-06-19 1963-04-30 Western Electric Co Methods of bonding leads to semiconductive devices
US3328875A (en) * 1965-12-20 1967-07-04 Matheus D Pennings Method of attaching conductors to terminals

Also Published As

Publication number Publication date
US3787966A (en) 1974-01-29
AU3831672A (en) 1973-08-02
AU456451B2 (en) 1974-11-29
DE2104207A1 (de) 1972-08-24
DE2104207C3 (de) 1974-04-11

Similar Documents

Publication Publication Date Title
CH542330A (de) Verfahren zum Verbinden von Teilen eines Bauelementes
AT336386B (de) Verfahren zum herstellen eines futtermittels
CH533889A (de) Verfahren zum Herstellen eines Kabels
CH525095A (de) Verfahren zum Binden eines Buches
DE2104207B2 (de) Verfahren zum verbinden eines kontaktierungsdrahtes
CH540099A (de) Verfahren zum Beschichten einer Fläche
AT335376B (de) Verfahren zum aufsaugen von ol
AT335922B (de) Verfahren zum herstellen eines druckpfahles
DE2245679B2 (de) Verfahren zum herstellen eines koronaentladungsdrahtes
CH526848A (de) Verfahren zum Herstellen einer Spule
ATA913171A (de) Verfahren zum gleichmaessigen recken eines kabels
CH538699A (de) Verfahren zum Messen einer gespeicherten Ladung
AT306840B (de) Verfahren zum Herstellen eines Zweischichten-Sinterkontaktstückes
ATA580771A (de) Verfahren zum behandeln eines bahnfoermigen faservlieses
ATA893072A (de) Verfahren zum sterilisieren von gasen
AT337779B (de) Verfahren zum kontaktieren einer halbleiterscheibe
CH550632A (de) Verfahren zum befestigen eines drahtes an einem halbleiterkoerper.
AT313025B (de) Verfahren zum Strangpressen
AT307204B (de) Verfahren zum elektrischen Widerstandsschweißen
CH536197A (de) Verfahren zum Abdichten einer Oberfläche
CH542336A (de) Verfahren zum Eindecken eines Flachdaches
AT338845B (de) Verfahren zum frischen von metallen
AT309680B (de) Verfahren zum Reinigen von 6-α-Desoxy-5-hydroxytetracyclin
ATA1041772A (de) Verfahren zum verbinden von gewebeteilen
AT323462B (de) Verfahren zum unfruchtbarmachen eines tieres

Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)