NL7204575A - - Google Patents

Info

Publication number
NL7204575A
NL7204575A NL7204575A NL7204575A NL7204575A NL 7204575 A NL7204575 A NL 7204575A NL 7204575 A NL7204575 A NL 7204575A NL 7204575 A NL7204575 A NL 7204575A NL 7204575 A NL7204575 A NL 7204575A
Authority
NL
Netherlands
Application number
NL7204575A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL7204575A priority Critical patent/NL7204575A/xx
Priority to DE2313327A priority patent/DE2313327A1/de
Priority to CA167,674A priority patent/CA987788A/en
Priority to GB1590573A priority patent/GB1423868A/en
Priority to JP48037491A priority patent/JPS5113994B2/ja
Priority to CH475573A priority patent/CH554599A/xx
Priority to IT67953/73A priority patent/IT980751B/it
Priority to FR7312124A priority patent/FR2179104B1/fr
Publication of NL7204575A publication Critical patent/NL7204575A/xx
Priority to HK41/77A priority patent/HK4177A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
NL7204575A 1972-04-06 1972-04-06 NL7204575A (cg-RX-API-DMAC10.html)

Priority Applications (9)

Application Number Priority Date Filing Date Title
NL7204575A NL7204575A (cg-RX-API-DMAC10.html) 1972-04-06 1972-04-06
DE2313327A DE2313327A1 (de) 1972-04-06 1973-03-17 Verfahren zum befestigen einer mit leiterspuren versehenen isolierenden folie an stromleitern auf einem substrat
CA167,674A CA987788A (en) 1972-04-06 1973-04-02 Method of securing an insulating foil comprising conductor tracks to current conductors on a substrate
GB1590573A GB1423868A (en) 1972-04-06 1973-04-03 Forming electrically-conductive solder-connections between current-conductors on a substrate and conductor-tracks of an insulating flexible foil
JP48037491A JPS5113994B2 (cg-RX-API-DMAC10.html) 1972-04-06 1973-04-03
CH475573A CH554599A (de) 1972-04-06 1973-04-03 Verfahren zum befestigen einer mit leiterspuren versehenen isolierenden folie an stromleitern auf einem substrat.
IT67953/73A IT980751B (it) 1972-04-06 1973-04-03 Procedimento per collegare una fo glietta isolante comprendente pi ste conduttrici ai conduttori di corrente su un substrato
FR7312124A FR2179104B1 (cg-RX-API-DMAC10.html) 1972-04-06 1973-04-04
HK41/77A HK4177A (en) 1972-04-06 1977-01-20 Improvements in and relating to forming electrically-conductive solder-connections between current-conductors on a substrate and conductor-tracks of an insulating flexible foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7204575A NL7204575A (cg-RX-API-DMAC10.html) 1972-04-06 1972-04-06

Publications (1)

Publication Number Publication Date
NL7204575A true NL7204575A (cg-RX-API-DMAC10.html) 1973-10-09

Family

ID=19815787

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7204575A NL7204575A (cg-RX-API-DMAC10.html) 1972-04-06 1972-04-06

Country Status (9)

Country Link
JP (1) JPS5113994B2 (cg-RX-API-DMAC10.html)
CA (1) CA987788A (cg-RX-API-DMAC10.html)
CH (1) CH554599A (cg-RX-API-DMAC10.html)
DE (1) DE2313327A1 (cg-RX-API-DMAC10.html)
FR (1) FR2179104B1 (cg-RX-API-DMAC10.html)
GB (1) GB1423868A (cg-RX-API-DMAC10.html)
HK (1) HK4177A (cg-RX-API-DMAC10.html)
IT (1) IT980751B (cg-RX-API-DMAC10.html)
NL (1) NL7204575A (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156235A (en) * 1976-06-21 1977-12-26 Hitachi Ltd Transistor ignitor
JPS53101268U (cg-RX-API-DMAC10.html) * 1977-01-20 1978-08-16
CN107623993B (zh) * 2017-10-31 2020-06-23 Oppo广东移动通信有限公司 一种电路板、电路板制作方法、电子设备及其装配方法
DE102019131950A1 (de) * 2019-11-26 2021-05-27 Landulf Martin Skoda Lötpad und Verfahren zum Löten

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3474297A (en) * 1967-06-30 1969-10-21 Texas Instruments Inc Interconnection system for complex semiconductor arrays

Also Published As

Publication number Publication date
FR2179104A1 (cg-RX-API-DMAC10.html) 1973-11-16
JPS5113994B2 (cg-RX-API-DMAC10.html) 1976-05-06
CH554599A (de) 1974-09-30
JPS4917970A (cg-RX-API-DMAC10.html) 1974-02-16
FR2179104B1 (cg-RX-API-DMAC10.html) 1977-12-30
IT980751B (it) 1974-10-10
DE2313327A1 (de) 1973-10-18
HK4177A (en) 1977-01-28
CA987788A (en) 1976-04-20
GB1423868A (en) 1976-02-04

Similar Documents

Publication Publication Date Title
JPS4992992A (cg-RX-API-DMAC10.html)
FR2178194B1 (cg-RX-API-DMAC10.html)
FR2171966B1 (cg-RX-API-DMAC10.html)
JPS4882725A (cg-RX-API-DMAC10.html)
FR2179104B1 (cg-RX-API-DMAC10.html)
FR2198818B1 (cg-RX-API-DMAC10.html)
FR2187385B1 (cg-RX-API-DMAC10.html)
JPS5312614B2 (cg-RX-API-DMAC10.html)
JPS5223140Y2 (cg-RX-API-DMAC10.html)
FR2186511A1 (cg-RX-API-DMAC10.html)
CS154090B1 (cg-RX-API-DMAC10.html)
JPS4959606U (cg-RX-API-DMAC10.html)
CS155028B1 (cg-RX-API-DMAC10.html)
CS157307B1 (cg-RX-API-DMAC10.html)
JPS4971035U (cg-RX-API-DMAC10.html)
JPS4963304U (cg-RX-API-DMAC10.html)
CS156971B1 (cg-RX-API-DMAC10.html)
CS152690B1 (cg-RX-API-DMAC10.html)
CS157934B1 (cg-RX-API-DMAC10.html)
CH575128A5 (cg-RX-API-DMAC10.html)
CH588722A5 (cg-RX-API-DMAC10.html)
CH570340A5 (cg-RX-API-DMAC10.html)
CH599224A5 (cg-RX-API-DMAC10.html)
CH559015A5 (cg-RX-API-DMAC10.html)
CH563455A5 (cg-RX-API-DMAC10.html)