JPS5113994B2 - - Google Patents

Info

Publication number
JPS5113994B2
JPS5113994B2 JP48037491A JP3749173A JPS5113994B2 JP S5113994 B2 JPS5113994 B2 JP S5113994B2 JP 48037491 A JP48037491 A JP 48037491A JP 3749173 A JP3749173 A JP 3749173A JP S5113994 B2 JPS5113994 B2 JP S5113994B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP48037491A
Other languages
Japanese (ja)
Other versions
JPS4917970A (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4917970A publication Critical patent/JPS4917970A/ja
Publication of JPS5113994B2 publication Critical patent/JPS5113994B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
JP48037491A 1972-04-06 1973-04-03 Expired JPS5113994B2 (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7204575A NL7204575A (cg-RX-API-DMAC10.html) 1972-04-06 1972-04-06

Publications (2)

Publication Number Publication Date
JPS4917970A JPS4917970A (cg-RX-API-DMAC10.html) 1974-02-16
JPS5113994B2 true JPS5113994B2 (cg-RX-API-DMAC10.html) 1976-05-06

Family

ID=19815787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48037491A Expired JPS5113994B2 (cg-RX-API-DMAC10.html) 1972-04-06 1973-04-03

Country Status (9)

Country Link
JP (1) JPS5113994B2 (cg-RX-API-DMAC10.html)
CA (1) CA987788A (cg-RX-API-DMAC10.html)
CH (1) CH554599A (cg-RX-API-DMAC10.html)
DE (1) DE2313327A1 (cg-RX-API-DMAC10.html)
FR (1) FR2179104B1 (cg-RX-API-DMAC10.html)
GB (1) GB1423868A (cg-RX-API-DMAC10.html)
HK (1) HK4177A (cg-RX-API-DMAC10.html)
IT (1) IT980751B (cg-RX-API-DMAC10.html)
NL (1) NL7204575A (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156235A (en) * 1976-06-21 1977-12-26 Hitachi Ltd Transistor ignitor
JPS53101268U (cg-RX-API-DMAC10.html) * 1977-01-20 1978-08-16
CN107623993B (zh) * 2017-10-31 2020-06-23 Oppo广东移动通信有限公司 一种电路板、电路板制作方法、电子设备及其装配方法
DE102019131950A1 (de) * 2019-11-26 2021-05-27 Landulf Martin Skoda Lötpad und Verfahren zum Löten

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3474297A (en) * 1967-06-30 1969-10-21 Texas Instruments Inc Interconnection system for complex semiconductor arrays

Also Published As

Publication number Publication date
NL7204575A (cg-RX-API-DMAC10.html) 1973-10-09
FR2179104A1 (cg-RX-API-DMAC10.html) 1973-11-16
CH554599A (de) 1974-09-30
JPS4917970A (cg-RX-API-DMAC10.html) 1974-02-16
FR2179104B1 (cg-RX-API-DMAC10.html) 1977-12-30
IT980751B (it) 1974-10-10
DE2313327A1 (de) 1973-10-18
HK4177A (en) 1977-01-28
CA987788A (en) 1976-04-20
GB1423868A (en) 1976-02-04

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