DE2257650C3 - Prüftaster - Google Patents
PrüftasterInfo
- Publication number
- DE2257650C3 DE2257650C3 DE2257650A DE2257650A DE2257650C3 DE 2257650 C3 DE2257650 C3 DE 2257650C3 DE 2257650 A DE2257650 A DE 2257650A DE 2257650 A DE2257650 A DE 2257650A DE 2257650 C3 DE2257650 C3 DE 2257650C3
- Authority
- DE
- Germany
- Prior art keywords
- boom
- test
- contact
- attached
- test button
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000012360 testing method Methods 0.000 title claims description 105
- 239000000523 sample Substances 0.000 claims description 58
- 239000012212 insulator Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 30
- 238000013459 approach Methods 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241001422033 Thestylus Species 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910000923 precious metal alloy Inorganic materials 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measurement Of Current Or Voltage (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US20923671A | 1971-12-17 | 1971-12-17 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2257650A1 DE2257650A1 (de) | 1973-06-20 |
| DE2257650B2 DE2257650B2 (de) | 1981-04-09 |
| DE2257650C3 true DE2257650C3 (de) | 1981-12-17 |
Family
ID=22777924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2257650A Expired DE2257650C3 (de) | 1971-12-17 | 1972-11-24 | Prüftaster |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3781681A (enExample) |
| JP (1) | JPS5138224B2 (enExample) |
| BR (1) | BR7208873D0 (enExample) |
| CA (1) | CA978259A (enExample) |
| DE (1) | DE2257650C3 (enExample) |
| FR (1) | FR2163456B1 (enExample) |
| GB (1) | GB1409573A (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3939414A (en) * | 1974-01-28 | 1976-02-17 | Electroglas, Inc. | Micro-circuit test apparatus |
| JPS5153478A (ja) * | 1974-11-06 | 1976-05-11 | Hitachi Ltd | Koteipuroobukaado |
| US3963985A (en) * | 1974-12-12 | 1976-06-15 | International Business Machines Corporation | Probe device having probe heads and method of adjusting distances between probe heads |
| DD132718A3 (de) * | 1977-03-21 | 1978-10-25 | Werner Seewald | Nadeltraeger zum pruefen von halbleiterchips |
| JPS5883151U (ja) * | 1981-11-30 | 1983-06-06 | 日本電気ホームエレクトロニクス株式会社 | ウエハ−ブロ−バ− |
| DE3620947A1 (de) * | 1986-06-23 | 1988-01-07 | Feinmetall Gmbh | Kontaktelement fuer pruefkarten |
| US6037789A (en) * | 1989-09-27 | 2000-03-14 | Motorola, Inc. | Wiping contacts |
| US5066907A (en) * | 1990-02-06 | 1991-11-19 | Cerprobe Corporation | Probe system for device and circuit testing |
| US5378971A (en) * | 1990-11-30 | 1995-01-03 | Tokyo Electron Limited | Probe and a method of manufacturing the same |
| JP2873414B2 (ja) * | 1990-11-30 | 1999-03-24 | 東京エレクトロン株式会社 | 半導体ウエハ検査装置 |
| US5357192A (en) * | 1993-02-01 | 1994-10-18 | Motorola, Inc. | Method of contacting a semiconductor die with probes |
| US5751157A (en) * | 1996-07-22 | 1998-05-12 | Probe Technology | Method and apparatus for aligning probes |
| US6441315B1 (en) * | 1998-11-10 | 2002-08-27 | Formfactor, Inc. | Contact structures with blades having a wiping motion |
| US6392424B1 (en) * | 1999-08-12 | 2002-05-21 | Advanced Semiconductor Engineering Inc. | Press plate of wire bond checking system |
| CA2537850C (en) | 2003-09-05 | 2008-02-26 | Brunswick Bowling & Billiards Corporation | Apparatus and method for conditioning a bowling lane using precision delivery injectors |
| DE102006056543A1 (de) * | 2006-11-29 | 2008-06-19 | Suss Microtec Test Systems Gmbh | Sondenhalter für eine Sonde zur Prüfung von Halbleiterbauelementen |
| US9244099B2 (en) | 2011-05-09 | 2016-01-26 | Cascade Microtech, Inc. | Probe head assemblies, components thereof, test systems including the same, and methods of operating the same |
| CN103543298B (zh) * | 2012-07-13 | 2016-03-23 | 旺矽科技股份有限公司 | 探针固持结构及其光学检测装置 |
| US12306243B2 (en) | 2023-06-12 | 2025-05-20 | Formfactor, Inc. | Space transformers configured to be utilized in a probe system, probe systems that include the space transformers, and related methods |
| CN120522493B (zh) * | 2025-07-23 | 2025-09-23 | 快克智能装备股份有限公司 | 用于波峰焊的波峰失位检测装置及波峰失位检测方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3611128A (en) * | 1968-07-26 | 1971-10-05 | Hitachi Ltd | Probe header for testing integrated circuits |
| US3584300A (en) * | 1968-07-31 | 1971-06-08 | Bendix Corp | Platen-patch board assembly with spring biased electrical contact means to effect electrical test on an electrical circuit card |
| US3599093A (en) * | 1969-04-28 | 1971-08-10 | Rca Corp | Apparatus including a wire tipped probe for testing semiconductor wafers |
| US3648169A (en) * | 1969-05-26 | 1972-03-07 | Teledyne Inc | Probe and head assembly |
-
1971
- 1971-12-17 US US00209236A patent/US3781681A/en not_active Expired - Lifetime
-
1972
- 1972-11-14 FR FR7242129A patent/FR2163456B1/fr not_active Expired
- 1972-11-24 DE DE2257650A patent/DE2257650C3/de not_active Expired
- 1972-12-06 GB GB5618672A patent/GB1409573A/en not_active Expired
- 1972-12-08 JP JP47122659A patent/JPS5138224B2/ja not_active Expired
- 1972-12-13 CA CA159,073A patent/CA978259A/en not_active Expired
- 1972-12-15 BR BR8873/72A patent/BR7208873D0/pt unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5138224B2 (enExample) | 1976-10-20 |
| US3781681A (en) | 1973-12-25 |
| GB1409573A (en) | 1975-10-08 |
| DE2257650A1 (de) | 1973-06-20 |
| DE2257650B2 (de) | 1981-04-09 |
| FR2163456A1 (enExample) | 1973-07-27 |
| BR7208873D0 (pt) | 1974-01-03 |
| FR2163456B1 (enExample) | 1976-04-23 |
| CA978259A (en) | 1975-11-18 |
| JPS4873081A (enExample) | 1973-10-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OD | Request for examination | ||
| C3 | Grant after two publication steps (3rd publication) | ||
| 8339 | Ceased/non-payment of the annual fee |