DE2213115C3 - Verfahren zum hochfesten Verbinden von Keramiken aus Karbiden, einschließlich des Diamanten, Boriden, Nitriden oder Suiziden mit Metall nach dem Trocken-Lötverfahren - Google Patents
Verfahren zum hochfesten Verbinden von Keramiken aus Karbiden, einschließlich des Diamanten, Boriden, Nitriden oder Suiziden mit Metall nach dem Trocken-LötverfahrenInfo
- Publication number
- DE2213115C3 DE2213115C3 DE2213115A DE2213115A DE2213115C3 DE 2213115 C3 DE2213115 C3 DE 2213115C3 DE 2213115 A DE2213115 A DE 2213115A DE 2213115 A DE2213115 A DE 2213115A DE 2213115 C3 DE2213115 C3 DE 2213115C3
- Authority
- DE
- Germany
- Prior art keywords
- metal
- active
- solder
- formation
- diamond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 51
- 239000002184 metal Substances 0.000 title claims description 50
- 238000000034 method Methods 0.000 title claims description 20
- 239000010432 diamond Substances 0.000 title claims description 19
- 239000000919 ceramic Substances 0.000 title claims description 17
- 238000005476 soldering Methods 0.000 title claims description 17
- 150000004767 nitrides Chemical class 0.000 title claims description 13
- 150000001247 metal acetylides Chemical class 0.000 title claims description 11
- 206010010144 Completed suicide Diseases 0.000 title claims description 7
- -1 diamonds Chemical class 0.000 title claims description 7
- 238000005304 joining Methods 0.000 title claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 229910003460 diamond Inorganic materials 0.000 claims description 13
- 150000002739 metals Chemical class 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 3
- 229910021332 silicide Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 230000002452 interceptive effect Effects 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 claims 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 239000011224 oxide ceramic Substances 0.000 description 9
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 6
- 229910052726 zirconium Inorganic materials 0.000 description 6
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000010942 ceramic carbide Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052735 hafnium Inorganic materials 0.000 description 3
- 229910052758 niobium Inorganic materials 0.000 description 3
- 239000010955 niobium Substances 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 101100365384 Mus musculus Eefsec gene Proteins 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000008275 binding mechanism Effects 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000006396 nitration reaction Methods 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001603 reducing effect Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/124—Metallic interlayers based on copper
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
- C04B2237/127—The active component for bonding being a refractory metal
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/363—Carbon
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S228/00—Metal fusion bonding
- Y10S228/903—Metal to nonmetal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2213115A DE2213115C3 (de) | 1972-03-17 | 1972-03-17 | Verfahren zum hochfesten Verbinden von Keramiken aus Karbiden, einschließlich des Diamanten, Boriden, Nitriden oder Suiziden mit Metall nach dem Trocken-Lötverfahren |
| GB1202873A GB1423238A (en) | 1972-03-17 | 1973-03-13 | Production of high-strength bonds |
| US340831A US3915369A (en) | 1972-03-17 | 1973-03-13 | Method of dry-soldering highly refractory materials |
| FR7308840A FR2180669B1 (enExample) | 1972-03-17 | 1973-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2213115A DE2213115C3 (de) | 1972-03-17 | 1972-03-17 | Verfahren zum hochfesten Verbinden von Keramiken aus Karbiden, einschließlich des Diamanten, Boriden, Nitriden oder Suiziden mit Metall nach dem Trocken-Lötverfahren |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2213115A1 DE2213115A1 (de) | 1973-09-27 |
| DE2213115B2 DE2213115B2 (de) | 1975-04-30 |
| DE2213115C3 true DE2213115C3 (de) | 1975-12-04 |
Family
ID=5839298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2213115A Expired DE2213115C3 (de) | 1972-03-17 | 1972-03-17 | Verfahren zum hochfesten Verbinden von Keramiken aus Karbiden, einschließlich des Diamanten, Boriden, Nitriden oder Suiziden mit Metall nach dem Trocken-Lötverfahren |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3915369A (enExample) |
| DE (1) | DE2213115C3 (enExample) |
| FR (1) | FR2180669B1 (enExample) |
| GB (1) | GB1423238A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4319944A1 (de) * | 1993-06-03 | 1994-12-08 | Schulz Harder Juergen | Mehrfach-Substrat sowie Verfahren zu seiner Herstellung |
| DE10327360B4 (de) * | 2003-06-16 | 2012-05-24 | Curamik Electronics Gmbh | Verfahren zum Herstellen eines Keramik-Metall-Substrates |
| DE102012107570A1 (de) * | 2012-08-17 | 2014-02-20 | Curamik Electronics Gmbh | Verfahren zur Herstellung von Hohlkörpern, insbesondere von Kühlern, Hohlkörper sowie Kühler enthaltende elektrische oder elektronische Baugruppen |
Families Citing this family (68)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4468298A (en) * | 1982-12-20 | 1984-08-28 | Aluminum Company Of America | Diffusion welded nonconsumable electrode assembly and use thereof for electrolytic production of metals and silicon |
| US4457811A (en) * | 1982-12-20 | 1984-07-03 | Aluminum Company Of America | Process for producing elements from a fused bath using a metal strap and ceramic electrode body nonconsumable electrode assembly |
| US4468300A (en) * | 1982-12-20 | 1984-08-28 | Aluminum Company Of America | Nonconsumable electrode assembly and use thereof for the electrolytic production of metals and silicon |
| US4468299A (en) * | 1982-12-20 | 1984-08-28 | Aluminum Company Of America | Friction welded nonconsumable electrode assembly and use thereof for electrolytic production of metals and silicon |
| JPS60127271A (ja) * | 1983-12-14 | 1985-07-06 | 株式会社日立製作所 | 非酸化物系セラミックスと鋼との接合方法 |
| IT1200709B (it) * | 1984-08-13 | 1989-01-27 | De Beers Ind Diamond | Prodotto sinterizzato di diamante termicamente stabile |
| US4738389A (en) * | 1984-10-19 | 1988-04-19 | Martin Marietta Corporation | Welding using metal-ceramic composites |
| US4704338A (en) * | 1985-05-20 | 1987-11-03 | The United States Of America As Represented By The United States Department Of Energy | Steel bonded dense silicon nitride compositions and method for their fabrication |
| US4703884A (en) * | 1985-05-20 | 1987-11-03 | The United States Of America As Represented By The United States Department Of Energy | Steel bonded dense silicon nitride compositions and method for their fabrication |
| US4740429A (en) * | 1985-07-22 | 1988-04-26 | Ngk Insulators, Ltd. | Metal-ceramic joined articles |
| US5240171A (en) * | 1987-05-21 | 1993-08-31 | Lanxide Technology Company, Lp | Method for surface bonding of ceramic bodies |
| US4884737A (en) * | 1987-05-21 | 1989-12-05 | Lanxide Technology Company, Lp | Method for surface bonding of ceramic bodies |
| US4963523A (en) * | 1987-11-06 | 1990-10-16 | The United States Of America As Represented By The Secretary Of The Commerce | High-Tc superconducting unit having low contact surface resistivity and method of making. |
| US5149686A (en) * | 1987-11-06 | 1992-09-22 | The United States Of America As Represented By The Secretary Of Commerce | High Tc superconducting unit having low contact surface resistivity |
| US5251803A (en) * | 1988-07-22 | 1993-10-12 | Mitsubishi Denki Kabushiki Kaisha | Ceramic-metal composite substrate and method for producing the same |
| US5874175A (en) * | 1988-11-29 | 1999-02-23 | Li; Chou H. | Ceramic composite |
| US6413589B1 (en) | 1988-11-29 | 2002-07-02 | Chou H. Li | Ceramic coating method |
| US5392982A (en) * | 1988-11-29 | 1995-02-28 | Li; Chou H. | Ceramic bonding method |
| US5186380A (en) * | 1991-08-15 | 1993-02-16 | Handy & Harman | Titanium hydride coated brazing product |
| US5503703A (en) * | 1994-01-10 | 1996-04-02 | Dahotre; Narendra B. | Laser bonding process |
| US5569958A (en) * | 1994-05-26 | 1996-10-29 | Cts Corporation | Electrically conductive, hermetic vias and their use in high temperature chip packages |
| DE19528441C2 (de) * | 1995-03-01 | 1997-12-18 | Fraunhofer Ges Forschung | Untermetallisierung für Lotmaterialien |
| DE19608683B4 (de) * | 1996-03-06 | 2004-06-17 | Schulz-Harder, Jürgen, Dr.-Ing. | Verfahren zum Herstellen eines Substrates |
| US6286206B1 (en) | 1997-02-25 | 2001-09-11 | Chou H. Li | Heat-resistant electronic systems and circuit boards |
| US5937514A (en) | 1997-02-25 | 1999-08-17 | Li; Chou H. | Method of making a heat-resistant system |
| US6676492B2 (en) | 1998-12-15 | 2004-01-13 | Chou H. Li | Chemical mechanical polishing |
| US6976904B2 (en) * | 1998-07-09 | 2005-12-20 | Li Family Holdings, Ltd. | Chemical mechanical polishing slurry |
| US6458017B1 (en) | 1998-12-15 | 2002-10-01 | Chou H. Li | Planarizing method |
| DE10212495B4 (de) | 2002-03-21 | 2004-02-26 | Schulz-Harder, Jürgen, Dr.-Ing. | Verfahren zum Herstellen eines Metall-Keramik-Substrats, vorzugsweise eines Kupfer-Keramik-Substrats |
| DE102005042554B4 (de) | 2005-08-10 | 2008-04-30 | Curamik Electronics Gmbh | Metall-Keramik-Substrat und Verfahren zur Herstellung eines Metall-Keramik-Substrats |
| EP1959528B1 (de) | 2007-02-13 | 2017-04-12 | Laserline Gesellschaft für Entwicklung und Vertrieb von Diodenlasern mbH | Diodenlaseranordnung sowie Verfahren zum Herstellen einer solchen Anordnung |
| DE102007008027A1 (de) | 2007-02-13 | 2008-08-21 | Curamik Electronics Gmbh | Diodenlaseranordnung sowie Verfahren zum Herstellen einer solchen Anordnung |
| DE102007030389B4 (de) | 2007-03-30 | 2015-08-13 | Rogers Germany Gmbh | Moduleinheit mit einer Wärmesenke |
| DE102009041574A1 (de) | 2008-10-29 | 2010-05-12 | Electrovac Ag | Verbundmaterial, Verfahren zum Herstellen eines Verbundmaterials sowie Kleber oder Bondmaterial |
| DE102009015520A1 (de) | 2009-04-02 | 2010-10-07 | Electrovac Ag | Metall-Keramik-Substrat |
| DE102009022877B4 (de) | 2009-04-29 | 2014-12-24 | Rogers Germany Gmbh | Gekühlte elektrische Baueinheit |
| JP2012528471A (ja) | 2009-05-27 | 2012-11-12 | キュラミーク エレクトロニクス ゲーエムベーハー | 冷却される電気構成ユニット |
| DE102009033029A1 (de) | 2009-07-02 | 2011-01-05 | Electrovac Ag | Elektronische Vorrichtung |
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| DE102015108668B4 (de) | 2015-06-02 | 2018-07-26 | Rogers Germany Gmbh | Verfahren zur Herstellung eines Verbundmaterials |
| EP3301082B1 (en) | 2016-09-30 | 2024-09-18 | Infineon Technologies AG | Method for producing a metal-ceramic substrate |
| EP3326986B1 (en) | 2016-11-28 | 2020-11-25 | Infineon Technologies AG | Process for the manufacture of a metal-ceramic substrate |
| DE102018207955B4 (de) | 2018-05-22 | 2023-05-17 | Schweizer Electronic Ag | Leiterplattenmodul mit integriertem leistungselektronischen Metall-Keramik-Modul sowie Verfahren zu dessen Herstellung |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2015482A (en) * | 1932-06-29 | 1935-09-24 | Ergon Res Lab Inc | Method of effecting metal-refractory joint and joints resulting therefrom |
| US2385380A (en) * | 1944-01-06 | 1945-09-25 | Sylvania Electric Prod | Electrode support and contacting means |
| US2564738A (en) * | 1947-02-25 | 1951-08-21 | Foerderung Forschung Gmbh | Method of forming a vacuum-tight bond between ceramics and metals |
| US3180023A (en) * | 1961-02-02 | 1965-04-27 | Kaiser Aluminium Chem Corp | Method of joining an electrically conductive metal to a refractory hard metal |
| GB1047421A (enExample) * | 1962-10-15 | |||
| US3377696A (en) * | 1965-07-26 | 1968-04-16 | Gen Electric | Bonding diamond to molybdenum |
| US3444613A (en) * | 1965-11-24 | 1969-05-20 | Coast Metals Inc | Method of joining carbide to steel |
| NL153508B (nl) * | 1966-11-30 | 1977-06-15 | Philips Nv | Werkwijze voor het vacuuemdicht verbinden van een keramisch voorwerp met een metalen voorwerp en elektrische ontladingsbuis voorzien van een stroomtoevoergeleider verkregen volgens die werkwijze. |
| US3517432A (en) * | 1968-05-02 | 1970-06-30 | Atomic Energy Commission | Diffusion bonding of ceramics |
| US3826630A (en) * | 1970-04-23 | 1974-07-30 | De Beers Cons Mines Ltd | Coating for diamonds |
| US3795041A (en) * | 1970-09-24 | 1974-03-05 | Siemens Ag | Process for the production of metal-ceramic bond |
-
1972
- 1972-03-17 DE DE2213115A patent/DE2213115C3/de not_active Expired
-
1973
- 1973-03-13 FR FR7308840A patent/FR2180669B1/fr not_active Expired
- 1973-03-13 US US340831A patent/US3915369A/en not_active Expired - Lifetime
- 1973-03-13 GB GB1202873A patent/GB1423238A/en not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4319944A1 (de) * | 1993-06-03 | 1994-12-08 | Schulz Harder Juergen | Mehrfach-Substrat sowie Verfahren zu seiner Herstellung |
| DE4319944C2 (de) * | 1993-06-03 | 1998-07-23 | Schulz Harder Juergen | Mehrfach-Substrat sowie Verfahren zu seiner Herstellung |
| DE10327360B4 (de) * | 2003-06-16 | 2012-05-24 | Curamik Electronics Gmbh | Verfahren zum Herstellen eines Keramik-Metall-Substrates |
| DE102012107570A1 (de) * | 2012-08-17 | 2014-02-20 | Curamik Electronics Gmbh | Verfahren zur Herstellung von Hohlkörpern, insbesondere von Kühlern, Hohlkörper sowie Kühler enthaltende elektrische oder elektronische Baugruppen |
| DE102012107570B4 (de) * | 2012-08-17 | 2017-08-03 | Rogers Germany Gmbh | Verfahren zur Herstellung von Hohlkörpern, insbesondere von Kühlern, Hohlkörper sowie Kühler enthaltende elektrische oder elektronische Baugruppen |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2213115B2 (de) | 1975-04-30 |
| DE2213115A1 (de) | 1973-09-27 |
| FR2180669A1 (enExample) | 1973-11-30 |
| FR2180669B1 (enExample) | 1977-09-02 |
| GB1423238A (en) | 1976-02-04 |
| US3915369A (en) | 1975-10-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C3 | Grant after two publication steps (3rd publication) | ||
| E771 | Valid patent as to the heymanns-index 1977, willingness to grant licences | ||
| EHJ | Ceased/non-payment of the annual fee |