DE2160283B2 - Verfahren zur Hersellung einer fotoempfindlichen Maskierungsschicht auf einem Halbleitersubstrat - Google Patents

Verfahren zur Hersellung einer fotoempfindlichen Maskierungsschicht auf einem Halbleitersubstrat

Info

Publication number
DE2160283B2
DE2160283B2 DE2160283A DE2160283A DE2160283B2 DE 2160283 B2 DE2160283 B2 DE 2160283B2 DE 2160283 A DE2160283 A DE 2160283A DE 2160283 A DE2160283 A DE 2160283A DE 2160283 B2 DE2160283 B2 DE 2160283B2
Authority
DE
Germany
Prior art keywords
substrate
masking material
semiconductor substrate
medium
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE2160283A
Other languages
German (de)
English (en)
Other versions
DE2160283A1 (de
Inventor
Lynn Forrest Reading Boyer
Anderson Forbes Johnson Jun.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of DE2160283A1 publication Critical patent/DE2160283A1/de
Publication of DE2160283B2 publication Critical patent/DE2160283B2/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • H10P14/6342—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Light Receiving Elements (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
  • Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)
  • Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
DE2160283A 1970-12-07 1971-12-04 Verfahren zur Hersellung einer fotoempfindlichen Maskierungsschicht auf einem Halbleitersubstrat Withdrawn DE2160283B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US9582170A 1970-12-07 1970-12-07

Publications (2)

Publication Number Publication Date
DE2160283A1 DE2160283A1 (de) 1972-06-22
DE2160283B2 true DE2160283B2 (de) 1974-09-26

Family

ID=22253735

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2160283A Withdrawn DE2160283B2 (de) 1970-12-07 1971-12-04 Verfahren zur Hersellung einer fotoempfindlichen Maskierungsschicht auf einem Halbleitersubstrat

Country Status (6)

Country Link
US (2) US3695928A (Direct)
JP (1) JPS5026919B1 (Direct)
CA (1) CA948048A (Direct)
DE (1) DE2160283B2 (Direct)
FR (1) FR2116568B1 (Direct)
GB (1) GB1375738A (Direct)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3722080A1 (de) * 1986-07-04 1988-01-28 Canon Kk Einrichtung zum bearbeiten von halbleiterplaettchen

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE32033E (en) * 1969-07-29 1985-11-19 Texas Instruments Incorporated Automated slice processing
US3888674A (en) * 1972-08-14 1975-06-10 Texas Instruments Inc Automatic slice processing
US3836388A (en) * 1972-10-18 1974-09-17 Western Electric Co Distributing a fluid evenly over the surface of an article
DE2944180A1 (de) * 1979-11-02 1981-05-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum herstellen einer einen halbleiterkoerper einseitig bedeckenden isolierschicht
US4314523A (en) * 1980-03-19 1982-02-09 E. I. Du Pont De Nemours And Company Centrifuge rotor apparatus for preparing particle spreads
US4280689A (en) * 1980-06-27 1981-07-28 Nasa Head for high speed spinner having a vacuum chuck
US4385083A (en) * 1980-08-25 1983-05-24 Applied Magnetics Corporation Apparatus and method for forming a thin film of coating material on a substrate having a vacuum applied to the edge thereof
WO1982001482A1 (en) * 1980-11-06 1982-05-13 Patent Versuch Censor Method and installation for the processing of the upper side of a flat part by means of a liquid
US5261566A (en) * 1981-02-16 1993-11-16 Tokyo Ohka Kogyo Co., Ltd. Solution-dropping nozzle device
GB8323303D0 (en) * 1983-08-31 1983-10-05 Campbell C V Masking service
JPS60210840A (ja) * 1984-03-06 1985-10-23 Fujitsu Ltd スピン処理装置
JPH0444216Y2 (Direct) * 1985-10-07 1992-10-19
US5871811A (en) * 1986-12-19 1999-02-16 Applied Materials, Inc. Method for protecting against deposition on a selected region of a substrate
KR970011644B1 (ko) * 1988-04-08 1997-07-12 고다까 토시오 도포 처리 장치
KR970007060B1 (ko) * 1989-02-17 1997-05-02 다이닛뽕 인사쓰 가부시끼가이샤 점성액체의 도포방법 및 도포장치
US5260174A (en) * 1989-02-17 1993-11-09 Dai Nippon Insatsu Kabushiki Kaisha Method and apparatus for forming a coating of a viscous liquid on an object
US5094884A (en) * 1990-04-24 1992-03-10 Machine Technology, Inc. Method and apparatus for applying a layer of a fluid material on a semiconductor wafer
US6179924B1 (en) 1998-04-28 2001-01-30 Applied Materials, Inc. Heater for use in substrate processing apparatus to deposit tungsten
US6165873A (en) * 1998-11-27 2000-12-26 Nec Corporation Process for manufacturing a semiconductor integrated circuit device
US6796517B1 (en) 2000-03-09 2004-09-28 Advanced Micro Devices, Inc. Apparatus for the application of developing solution to a semiconductor wafer
JP4179276B2 (ja) * 2004-12-24 2008-11-12 セイコーエプソン株式会社 溶媒除去装置および溶媒除去方法
WO2010033758A1 (en) * 2008-09-18 2010-03-25 Nordson Corporation Automated vacuum assisted valve priming system and methods of use
ES2568696B2 (es) * 2014-10-30 2016-11-14 Universidad De Cádiz Equipo para fabricación de láminas delgadas mediante el proceso de recubrimiento por rotación
RU2761134C2 (ru) * 2020-05-26 2021-12-06 Открытое акционерное общество "Научно-исследовательский институт полупроводникового машиностроения" (ОАО "НИИПМ") Устройство для нанесения фоторезиста на полупроводниковые пластины

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2386591A (en) * 1944-03-22 1945-10-09 James T Campbell Plate whirler
US2580131A (en) * 1947-02-25 1951-12-25 Chandler & Price Co Method and apparatus for coating a lithographic plate
US3008601A (en) * 1954-12-13 1961-11-14 Collette Gregoire Polytetrafluoroethylene coated cooking utensils
US2867551A (en) * 1955-08-24 1959-01-06 Owens Illinois Glass Co Apparatus and method for applying conductive coatings to insulators
US2953483A (en) * 1956-08-13 1960-09-20 Owens Illinois Glass Co Method and apparatus for applying coatings to selected areas of articles
US2946697A (en) * 1957-12-31 1960-07-26 Westinghouse Electric Corp Masking method and apparatus
US3538883A (en) * 1967-12-12 1970-11-10 Alco Standard Corp Vacuum chuck with safety device
US3577267A (en) * 1968-03-19 1971-05-04 Us Health Education & Welfare Method of preparing blood smears

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3722080A1 (de) * 1986-07-04 1988-01-28 Canon Kk Einrichtung zum bearbeiten von halbleiterplaettchen

Also Published As

Publication number Publication date
US3791342A (en) 1974-02-12
US3695928A (en) 1972-10-03
FR2116568A1 (Direct) 1972-07-13
CA948048A (en) 1974-05-28
FR2116568B1 (Direct) 1978-01-27
JPS5026919B1 (Direct) 1975-09-04
JPS4711719A (Direct) 1972-06-10
GB1375738A (Direct) 1974-11-27
DE2160283A1 (de) 1972-06-22

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