DE2151147B2 - Dünnschicht-Kondensator - Google Patents

Dünnschicht-Kondensator

Info

Publication number
DE2151147B2
DE2151147B2 DE2151147A DE2151147A DE2151147B2 DE 2151147 B2 DE2151147 B2 DE 2151147B2 DE 2151147 A DE2151147 A DE 2151147A DE 2151147 A DE2151147 A DE 2151147A DE 2151147 B2 DE2151147 B2 DE 2151147B2
Authority
DE
Germany
Prior art keywords
layer
edge
conductive layer
dielectric
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE2151147A
Other languages
German (de)
English (en)
Other versions
DE2151147A1 (de
DE2151147C3 (enExample
Inventor
Michael C.J. Cowpland
David J. Dickinson
Original Assignee
Microsystems International Ltd., Montreal, Quebec (Kanada)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microsystems International Ltd., Montreal, Quebec (Kanada) filed Critical Microsystems International Ltd., Montreal, Quebec (Kanada)
Publication of DE2151147A1 publication Critical patent/DE2151147A1/de
Publication of DE2151147B2 publication Critical patent/DE2151147B2/de
Application granted granted Critical
Publication of DE2151147C3 publication Critical patent/DE2151147C3/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H01L23/4855—Overhang structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE2151147A 1971-05-03 1971-10-14 Dünnschicht-Kondensator Granted DE2151147B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA111974 1971-05-03

Publications (3)

Publication Number Publication Date
DE2151147A1 DE2151147A1 (de) 1972-11-23
DE2151147B2 true DE2151147B2 (de) 1974-08-01
DE2151147C3 DE2151147C3 (enExample) 1975-04-03

Family

ID=4089544

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2151147A Granted DE2151147B2 (de) 1971-05-03 1971-10-14 Dünnschicht-Kondensator

Country Status (2)

Country Link
CA (1) CA923206A (enExample)
DE (1) DE2151147B2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19536528A1 (de) * 1995-09-29 1997-04-03 Siemens Ag Integrierbarer Kondensator und Verfahren zu seiner Herstellung
DE19536465A1 (de) * 1995-09-29 1997-04-03 Siemens Ag Integrierbarer Kondensator und Verfahren zu seiner Herstellung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19536528A1 (de) * 1995-09-29 1997-04-03 Siemens Ag Integrierbarer Kondensator und Verfahren zu seiner Herstellung
DE19536465A1 (de) * 1995-09-29 1997-04-03 Siemens Ag Integrierbarer Kondensator und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
CA923206A (en) 1973-03-20
DE2151147A1 (de) 1972-11-23
DE2151147C3 (enExample) 1975-04-03

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)