DE2151147C3 - - Google Patents

Info

Publication number
DE2151147C3
DE2151147C3 DE2151147A DE2151147A DE2151147C3 DE 2151147 C3 DE2151147 C3 DE 2151147C3 DE 2151147 A DE2151147 A DE 2151147A DE 2151147 A DE2151147 A DE 2151147A DE 2151147 C3 DE2151147 C3 DE 2151147C3
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2151147A
Other languages
German (de)
Other versions
DE2151147A1 (de
DE2151147B2 (de
Inventor
Michael C.J. Cowpland
David J. Dickinson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MICROSYSTEMS INTERNATIONAL Ltd MONTREAL QUEBEC (KANADA)
Original Assignee
MICROSYSTEMS INTERNATIONAL Ltd MONTREAL QUEBEC (KANADA)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MICROSYSTEMS INTERNATIONAL Ltd MONTREAL QUEBEC (KANADA) filed Critical MICROSYSTEMS INTERNATIONAL Ltd MONTREAL QUEBEC (KANADA)
Publication of DE2151147A1 publication Critical patent/DE2151147A1/de
Publication of DE2151147B2 publication Critical patent/DE2151147B2/de
Application granted granted Critical
Publication of DE2151147C3 publication Critical patent/DE2151147C3/de
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H01L23/4855Overhang structure
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE2151147A 1971-05-03 1971-10-14 Dünnschicht-Kondensator Granted DE2151147B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA111974 1971-05-03

Publications (3)

Publication Number Publication Date
DE2151147A1 DE2151147A1 (de) 1972-11-23
DE2151147B2 DE2151147B2 (de) 1974-08-01
DE2151147C3 true DE2151147C3 (enExample) 1975-04-03

Family

ID=4089544

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2151147A Granted DE2151147B2 (de) 1971-05-03 1971-10-14 Dünnschicht-Kondensator

Country Status (2)

Country Link
CA (1) CA923206A (enExample)
DE (1) DE2151147B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19536528A1 (de) * 1995-09-29 1997-04-03 Siemens Ag Integrierbarer Kondensator und Verfahren zu seiner Herstellung
DE19536465A1 (de) * 1995-09-29 1997-04-03 Siemens Ag Integrierbarer Kondensator und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
CA923206A (en) 1973-03-20
DE2151147A1 (de) 1972-11-23
DE2151147B2 (de) 1974-08-01

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)