DE2151147C3 - - Google Patents
Info
- Publication number
- DE2151147C3 DE2151147C3 DE2151147A DE2151147A DE2151147C3 DE 2151147 C3 DE2151147 C3 DE 2151147C3 DE 2151147 A DE2151147 A DE 2151147A DE 2151147 A DE2151147 A DE 2151147A DE 2151147 C3 DE2151147 C3 DE 2151147C3
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
- H01L23/4855—Overhang structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA111974 | 1971-05-03 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2151147A1 DE2151147A1 (de) | 1972-11-23 |
| DE2151147B2 DE2151147B2 (de) | 1974-08-01 |
| DE2151147C3 true DE2151147C3 (enExample) | 1975-04-03 |
Family
ID=4089544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2151147A Granted DE2151147B2 (de) | 1971-05-03 | 1971-10-14 | Dünnschicht-Kondensator |
Country Status (2)
| Country | Link |
|---|---|
| CA (1) | CA923206A (enExample) |
| DE (1) | DE2151147B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19536528A1 (de) * | 1995-09-29 | 1997-04-03 | Siemens Ag | Integrierbarer Kondensator und Verfahren zu seiner Herstellung |
| DE19536465A1 (de) * | 1995-09-29 | 1997-04-03 | Siemens Ag | Integrierbarer Kondensator und Verfahren zu seiner Herstellung |
-
1971
- 1971-05-03 CA CA923206A patent/CA923206A/en not_active Expired
- 1971-10-14 DE DE2151147A patent/DE2151147B2/de active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| CA923206A (en) | 1973-03-20 |
| DE2151147A1 (de) | 1972-11-23 |
| DE2151147B2 (de) | 1974-08-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C3 | Grant after two publication steps (3rd publication) |