DE2142535C3 - Verfahren zum Herstellen von elektrischen Mehrlagenschaltungen auf keramischer Basis - Google Patents

Verfahren zum Herstellen von elektrischen Mehrlagenschaltungen auf keramischer Basis

Info

Publication number
DE2142535C3
DE2142535C3 DE2142535A DE2142535A DE2142535C3 DE 2142535 C3 DE2142535 C3 DE 2142535C3 DE 2142535 A DE2142535 A DE 2142535A DE 2142535 A DE2142535 A DE 2142535A DE 2142535 C3 DE2142535 C3 DE 2142535C3
Authority
DE
Germany
Prior art keywords
ceramic
green
channels
disks
conductor track
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2142535A
Other languages
German (de)
English (en)
Other versions
DE2142535A1 (de
DE2142535B2 (de
Inventor
Leslie Clarence Poughkeepsie N.Y. Anderson (V.St.A.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE2142535A1 publication Critical patent/DE2142535A1/de
Publication of DE2142535B2 publication Critical patent/DE2142535B2/de
Application granted granted Critical
Publication of DE2142535C3 publication Critical patent/DE2142535C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • H10W70/095—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/069—Green sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE2142535A 1970-08-25 1971-08-25 Verfahren zum Herstellen von elektrischen Mehrlagenschaltungen auf keramischer Basis Expired DE2142535C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6677670A 1970-08-25 1970-08-25

Publications (3)

Publication Number Publication Date
DE2142535A1 DE2142535A1 (de) 1972-03-02
DE2142535B2 DE2142535B2 (de) 1979-12-20
DE2142535C3 true DE2142535C3 (de) 1980-08-28

Family

ID=22071618

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2142535A Expired DE2142535C3 (de) 1970-08-25 1971-08-25 Verfahren zum Herstellen von elektrischen Mehrlagenschaltungen auf keramischer Basis

Country Status (4)

Country Link
US (1) US3770529A (enExample)
JP (1) JPS5143181B1 (enExample)
DE (1) DE2142535C3 (enExample)
FR (1) FR2104259A5 (enExample)

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US4139405A (en) * 1975-10-30 1979-02-13 Mildred Kelley Seiberling Selective electron irradiation precuring of treads in tire making processes
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US4296272A (en) * 1979-11-30 1981-10-20 Rca Corporation Composite substrate
US4313262A (en) * 1979-12-17 1982-02-02 General Electric Company Molybdenum substrate thick film circuit
US4487993A (en) * 1981-04-01 1984-12-11 General Electric Company High density electronic circuits having very narrow conductors
US4417393A (en) * 1981-04-01 1983-11-29 General Electric Company Method of fabricating high density electronic circuits having very narrow conductors
JPS6038868B2 (ja) * 1981-11-06 1985-09-03 富士通株式会社 半導体パツケ−ジ
JPS58154293A (ja) * 1982-03-10 1983-09-13 株式会社日立製作所 グリ−ンシ−トの寸法安定化法
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FR2556503B1 (fr) * 1983-12-08 1986-12-12 Eurofarad Substrat d'interconnexion en alumine pour composant electronique
US4665468A (en) * 1984-07-10 1987-05-12 Nec Corporation Module having a ceramic multi-layer substrate and a multi-layer circuit thereupon, and process for manufacturing the same
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US4672739A (en) * 1985-04-11 1987-06-16 International Business Machines Corporation Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate
US4755631A (en) * 1985-04-11 1988-07-05 International Business Machines Corporation Apparatus for providing an electrical connection to a metallic pad situated on a brittle dielectric substrate
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US4677254A (en) * 1985-08-07 1987-06-30 International Business Machines Corporation Process for minimizing distortion in multilayer ceramic substrates and the intermediate unsintered green ceramic substrate produced thereby
US4721541A (en) * 1985-09-26 1988-01-26 Trak Microwave Corporation Ceramic diffusion bonding method
JPS6273799A (ja) * 1985-09-27 1987-04-04 日本電気株式会社 多層セラミツク配線基板
US4786342A (en) * 1986-11-10 1988-11-22 Coors Porcelain Company Method for producing cast tape finish on a dry-pressed substrate
AU1346088A (en) * 1987-02-04 1988-08-24 Coors Porcelain Company Ceramic substrate with conductively-filled vias and method for producing
JPS63240096A (ja) * 1987-03-27 1988-10-05 富士通株式会社 グリ−ンシ−ト多層法
DE3713987A1 (de) * 1987-04-27 1988-11-10 Siemens Ag Verfahren zur herstellung einer strukturierten keramikfolie bzw. eines aus solchen folien aufgebauten keramikkoerpers
US4799984A (en) * 1987-09-18 1989-01-24 E. I. Du Pont De Nemours And Company Method for fabricating multilayer circuits
JPH0743996B2 (ja) * 1988-03-02 1995-05-15 ガス放電表示装置の製造方法
US4806188A (en) * 1988-03-04 1989-02-21 E. I. Du Pont De Nemours And Company Method for fabricating multilayer circuits
US4816097A (en) * 1988-04-05 1989-03-28 The Boeing Company Method of manufacturing a non-metallic core having a perforated septum embedded therein
US4889573A (en) * 1988-05-23 1989-12-26 Tektronix, Inc. Method of forming a pattern of conductor runs on a sheet of dielectric material
US5437758A (en) * 1990-05-09 1995-08-01 Joseph B. Taphorn Green sheet manufacturing methods and apparatuses
US5293025A (en) * 1991-08-01 1994-03-08 E. I. Du Pont De Nemours And Company Method for forming vias in multilayer circuits
IT1252950B (it) * 1991-09-30 1995-07-06 Gisulfo Baccini Procedimento di bloccaggio fogli per circuiti green-tape
JPH05206341A (ja) * 1991-10-11 1993-08-13 W R Grace & Co 開口流路のあるセラミツク基質
JP3223199B2 (ja) * 1991-10-25 2001-10-29 ティーディーケイ株式会社 多層セラミック部品の製造方法および多層セラミック部品
KR0127666B1 (ko) * 1992-11-25 1997-12-30 모리시다 요이찌 세라믹전자부품 및 그 제조방법
US5367143A (en) * 1992-12-30 1994-11-22 International Business Machines Corporation Apparatus and method for multi-beam drilling
CN1044762C (zh) * 1993-09-22 1999-08-18 松下电器产业株式会社 印刷电路板及其制造方法
AT402135B (de) * 1994-03-30 1997-02-25 Electrovac Schaltungsträger
US5759331A (en) * 1994-07-15 1998-06-02 Paul J. Dostart Method of ensuring conductivity in the manufacturing of a multi-layer ceramic component containing interlayer conductive-filled via holes
US5658413A (en) * 1994-10-19 1997-08-19 Hewlett-Packard Company Miniaturized planar columns in novel support media for liquid phase analysis
US5500071A (en) * 1994-10-19 1996-03-19 Hewlett-Packard Company Miniaturized planar columns in novel support media for liquid phase analysis
US5962815A (en) * 1995-01-18 1999-10-05 Prolinx Labs Corporation Antifuse interconnect between two conducting layers of a printed circuit board
US5645673A (en) * 1995-06-02 1997-07-08 International Business Machines Corporation Lamination process for producing non-planar substrates
US5906042A (en) * 1995-10-04 1999-05-25 Prolinx Labs Corporation Method and structure to interconnect traces of two conductive layers in a printed circuit board
CN1094717C (zh) * 1995-11-16 2002-11-20 松下电器产业株式会社 印刷电路板的安装体
US5826330A (en) * 1995-12-28 1998-10-27 Hitachi Aic Inc. Method of manufacturing multilayer printed wiring board
US5948200A (en) * 1996-07-26 1999-09-07 Taiyo Yuden Co., Ltd. Method of manufacturing laminated ceramic electronic parts
US6016005A (en) * 1998-02-09 2000-01-18 Cellarosi; Mario J. Multilayer, high density micro circuit module and method of manufacturing same
JP3381779B2 (ja) * 1998-09-17 2003-03-04 セイコーエプソン株式会社 圧電振動子ユニット、圧電振動子ユニットの製造方法、及びインクジェット式記録ヘッド
DE60030195T2 (de) * 1999-04-02 2006-12-14 Murata Manufacturing Co., Ltd., Nagaokakyo Laserverfahren zur Bearbeitung von Löchern in einer keramischen Grünfolie
US6245185B1 (en) * 1999-07-15 2001-06-12 International Business Machines Corporation Method of making a multilayer ceramic product with thin layers
JP2001053443A (ja) * 1999-08-06 2001-02-23 Hitachi Ltd 電子回路基板の製造方法，電子回路基板の製造装置及び電子回路基板
JP3669255B2 (ja) * 2000-09-19 2005-07-06 株式会社村田製作所 セラミック多層基板の製造方法および未焼成セラミック積層体
JP2004520175A (ja) * 2001-05-29 2004-07-08 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 金属−セラミック接合
EP1408135A1 (en) * 2002-10-08 2004-04-14 Galileo Vacuum Systems S.R.L. Apparatus for physical vapour deposition
KR20030074582A (ko) * 2003-09-03 2003-09-19 학교법인 한국정보통신학원 초고주파 다층회로 구조 및 제작 방법
US8161609B2 (en) * 2008-05-21 2012-04-24 Intel Corporation Methods of fabricating an array capacitor
WO2009153728A1 (en) * 2008-06-16 2009-12-23 Nxp B.V. Through wafer via filling method

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US3561110A (en) * 1967-08-31 1971-02-09 Ibm Method of making connections and conductive paths

Also Published As

Publication number Publication date
DE2142535A1 (de) 1972-03-02
DE2142535B2 (de) 1979-12-20
JPS5143181B1 (enExample) 1976-11-19
US3770529A (en) 1973-11-06
FR2104259A5 (enExample) 1972-04-14

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Legal Events

Date Code Title Description
OD Request for examination
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee