DE2141682A1 - Verfahren zur Trennung einer Anzahl von aneinandergrenzenden Gegenständen, insbesondere elektronischen Schaltkreiselementen - Google Patents

Verfahren zur Trennung einer Anzahl von aneinandergrenzenden Gegenständen, insbesondere elektronischen Schaltkreiselementen

Info

Publication number
DE2141682A1
DE2141682A1 DE19712141682 DE2141682A DE2141682A1 DE 2141682 A1 DE2141682 A1 DE 2141682A1 DE 19712141682 DE19712141682 DE 19712141682 DE 2141682 A DE2141682 A DE 2141682A DE 2141682 A1 DE2141682 A1 DE 2141682A1
Authority
DE
Germany
Prior art keywords
cubes
lines
weakness
foaming
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712141682
Other languages
German (de)
English (en)
Inventor
Victor Edward Los Altos Calif. Althouse (V.StA.). M
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raychem Corp
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raychem Corp filed Critical Raychem Corp
Publication of DE2141682A1 publication Critical patent/DE2141682A1/de
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/35—Work-parting pullers [bursters]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979—Breaking through weakened portion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
DE19712141682 1970-08-19 1971-08-19 Verfahren zur Trennung einer Anzahl von aneinandergrenzenden Gegenständen, insbesondere elektronischen Schaltkreiselementen Pending DE2141682A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6518870A 1970-08-19 1970-08-19

Publications (1)

Publication Number Publication Date
DE2141682A1 true DE2141682A1 (de) 1972-03-16

Family

ID=22060923

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712141682 Pending DE2141682A1 (de) 1970-08-19 1971-08-19 Verfahren zur Trennung einer Anzahl von aneinandergrenzenden Gegenständen, insbesondere elektronischen Schaltkreiselementen

Country Status (7)

Country Link
US (1) US3677875A (https=)
AU (1) AU3243471A (https=)
BE (1) BE771535A (https=)
CA (1) CA928869A (https=)
DE (1) DE2141682A1 (https=)
FR (1) FR2102372A1 (https=)
NL (1) NL7111335A (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7317749A (https=) * 1972-12-27 1974-07-01
GB1487201A (en) * 1974-12-20 1977-09-28 Lucas Electrical Ltd Method of manufacturing semi-conductor devices
US4247031A (en) * 1979-04-10 1981-01-27 Rca Corporation Method for cracking and separating pellets formed on a wafer
US4732647A (en) * 1984-10-24 1988-03-22 Aine Harry E Batch method of making miniature capacitive force transducers assembled in wafer form
US4744550A (en) * 1986-04-24 1988-05-17 Asm America, Inc. Vacuum wafer expander apparatus
EP0363548B1 (en) * 1988-10-10 1994-03-23 International Business Machines Corporation Method of breaking a plate-like workpiece such as a semi-conductor wafer, and device for breaking said workpiece sandwiched between two foils
US5029418A (en) * 1990-03-05 1991-07-09 Eastman Kodak Company Sawing method for substrate cutting operations
US5413659A (en) * 1993-09-30 1995-05-09 Minnesota Mining And Manufacturing Company Array of conductive pathways
US5710065A (en) * 1995-01-03 1998-01-20 Texas Instruments Incorporated Method and apparatus for breaking and separating dies from a wafer
US5668062A (en) * 1995-08-23 1997-09-16 Texas Instruments Incorporated Method for processing semiconductor wafer with reduced particle contamination during saw
US6184063B1 (en) 1996-11-26 2001-02-06 Texas Instruments Incorporated Method and apparatus for breaking and separating a wafer into die using a multi-radii dome
US6685073B1 (en) 1996-11-26 2004-02-03 Texas Instruments Incorporated Method and apparatus for stretching and processing saw film tape after breaking a partially sawn wafer
US6162703A (en) * 1998-02-23 2000-12-19 Micron Technology, Inc. Packaging die preparation
US6403449B1 (en) 2000-04-28 2002-06-11 Micron Technology, Inc. Method of relieving surface tension on a semiconductor wafer

Also Published As

Publication number Publication date
FR2102372A1 (https=) 1972-04-07
BE771535A (fr) 1972-02-21
US3677875A (en) 1972-07-18
AU3243471A (en) 1973-02-22
NL7111335A (https=) 1972-02-22
CA928869A (en) 1973-06-19

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