BE771535A - Procede pour ecarter de petits objets les uns des autres - Google Patents
Procede pour ecarter de petits objets les uns des autresInfo
- Publication number
- BE771535A BE771535A BE771535A BE771535A BE771535A BE 771535 A BE771535 A BE 771535A BE 771535 A BE771535 A BE 771535A BE 771535 A BE771535 A BE 771535A BE 771535 A BE771535 A BE 771535A
- Authority
- BE
- Belgium
- Prior art keywords
- procedure
- another
- small objects
- objects away
- splitting small
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/35—Work-parting pullers [bursters]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49789—Obtaining plural product pieces from unitary workpiece
- Y10T29/4979—Breaking through weakened portion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US6518870A | 1970-08-19 | 1970-08-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
BE771535A true BE771535A (fr) | 1972-02-21 |
Family
ID=22060923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE771535A BE771535A (fr) | 1970-08-19 | 1971-08-19 | Procede pour ecarter de petits objets les uns des autres |
Country Status (7)
Country | Link |
---|---|
US (1) | US3677875A (fr) |
AU (1) | AU3243471A (fr) |
BE (1) | BE771535A (fr) |
CA (1) | CA928869A (fr) |
DE (1) | DE2141682A1 (fr) |
FR (1) | FR2102372A1 (fr) |
NL (1) | NL7111335A (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE385632B (sv) * | 1972-12-27 | 1976-07-12 | Vychislitelny Ts Sib Otdel Aka | Forfarande for framstellning av minnesblock med magnetkernor |
GB1487201A (en) * | 1974-12-20 | 1977-09-28 | Lucas Electrical Ltd | Method of manufacturing semi-conductor devices |
US4247031A (en) * | 1979-04-10 | 1981-01-27 | Rca Corporation | Method for cracking and separating pellets formed on a wafer |
US4732647A (en) * | 1984-10-24 | 1988-03-22 | Aine Harry E | Batch method of making miniature capacitive force transducers assembled in wafer form |
US4744550A (en) * | 1986-04-24 | 1988-05-17 | Asm America, Inc. | Vacuum wafer expander apparatus |
DE3888685T2 (de) * | 1988-10-10 | 1994-10-20 | Ibm | Verfahren zum Brechen eines plattenförmigen Werkstücks, insbesondere eines Halbleiterplättchens, und Vorrichtung zum Brechen des genannten zwischen zwei Folien sandwichartig angeordneten Werkstücks. |
US5029418A (en) * | 1990-03-05 | 1991-07-09 | Eastman Kodak Company | Sawing method for substrate cutting operations |
US5413659A (en) * | 1993-09-30 | 1995-05-09 | Minnesota Mining And Manufacturing Company | Array of conductive pathways |
US5710065A (en) * | 1995-01-03 | 1998-01-20 | Texas Instruments Incorporated | Method and apparatus for breaking and separating dies from a wafer |
US5668062A (en) * | 1995-08-23 | 1997-09-16 | Texas Instruments Incorporated | Method for processing semiconductor wafer with reduced particle contamination during saw |
US6685073B1 (en) | 1996-11-26 | 2004-02-03 | Texas Instruments Incorporated | Method and apparatus for stretching and processing saw film tape after breaking a partially sawn wafer |
US6184063B1 (en) | 1996-11-26 | 2001-02-06 | Texas Instruments Incorporated | Method and apparatus for breaking and separating a wafer into die using a multi-radii dome |
US6162703A (en) * | 1998-02-23 | 2000-12-19 | Micron Technology, Inc. | Packaging die preparation |
US6403449B1 (en) | 2000-04-28 | 2002-06-11 | Micron Technology, Inc. | Method of relieving surface tension on a semiconductor wafer |
-
1970
- 1970-08-19 US US65188A patent/US3677875A/en not_active Expired - Lifetime
-
1971
- 1971-08-09 CA CA120064A patent/CA928869A/en not_active Expired
- 1971-08-17 NL NL7111335A patent/NL7111335A/xx unknown
- 1971-08-17 AU AU32434/71A patent/AU3243471A/en not_active Expired
- 1971-08-19 BE BE771535A patent/BE771535A/fr unknown
- 1971-08-19 FR FR7130218A patent/FR2102372A1/fr not_active Withdrawn
- 1971-08-19 DE DE19712141682 patent/DE2141682A1/de active Pending
Also Published As
Publication number | Publication date |
---|---|
US3677875A (en) | 1972-07-18 |
NL7111335A (fr) | 1972-02-22 |
FR2102372A1 (fr) | 1972-04-07 |
AU3243471A (en) | 1973-02-22 |
DE2141682A1 (de) | 1972-03-16 |
CA928869A (en) | 1973-06-19 |
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