DE2134391C3 - Elektrophoretisch auf einem Metallteil niedergeschlagene Schicht und Verfahren zu deren Herstellung - Google Patents
Elektrophoretisch auf einem Metallteil niedergeschlagene Schicht und Verfahren zu deren HerstellungInfo
- Publication number
- DE2134391C3 DE2134391C3 DE2134391A DE2134391A DE2134391C3 DE 2134391 C3 DE2134391 C3 DE 2134391C3 DE 2134391 A DE2134391 A DE 2134391A DE 2134391 A DE2134391 A DE 2134391A DE 2134391 C3 DE2134391 C3 DE 2134391C3
- Authority
- DE
- Germany
- Prior art keywords
- layer
- polyethylene
- electrophoretic
- conductor tracks
- ionomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 6
- 239000002184 metal Substances 0.000 title claims description 6
- 238000000034 method Methods 0.000 title description 18
- 238000004519 manufacturing process Methods 0.000 title description 4
- -1 Polyethylene Polymers 0.000 claims description 28
- 239000004698 Polyethylene Substances 0.000 claims description 25
- 229920000573 polyethylene Polymers 0.000 claims description 25
- 229920000554 ionomer Polymers 0.000 claims description 19
- 150000002148 esters Chemical class 0.000 claims description 17
- 239000004593 Epoxy Substances 0.000 claims description 16
- 229920000642 polymer Polymers 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 14
- 238000010292 electrical insulation Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 description 26
- 239000002585 base Substances 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 238000009413 insulation Methods 0.000 description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 8
- 239000000839 emulsion Substances 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 239000000725 suspension Substances 0.000 description 8
- 238000001556 precipitation Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 238000001652 electrophoretic deposition Methods 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 239000007900 aqueous suspension Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000003784 tall oil Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
- C09D5/4419—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications with polymers obtained otherwise than by polymerisation reactions only involving carbon-to-carbon unsaturated bonds
- C09D5/4423—Polyesters, esterified polyepoxides
- C09D5/4426—Esterified polyepoxides
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US064424A US3892646A (en) | 1970-08-17 | 1970-08-17 | Process for selectively forming electrophoretic coatings on electrical contacts |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2134391A1 DE2134391A1 (de) | 1972-02-24 |
| DE2134391B2 DE2134391B2 (de) | 1980-11-06 |
| DE2134391C3 true DE2134391C3 (de) | 1981-12-17 |
Family
ID=22055886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2134391A Expired DE2134391C3 (de) | 1970-08-17 | 1971-07-09 | Elektrophoretisch auf einem Metallteil niedergeschlagene Schicht und Verfahren zu deren Herstellung |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3892646A (OSRAM) |
| JP (1) | JPS5235693B1 (OSRAM) |
| CA (1) | CA943677A (OSRAM) |
| DE (1) | DE2134391C3 (OSRAM) |
| FR (1) | FR2102285B1 (OSRAM) |
| GB (1) | GB1330918A (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3543303A1 (de) * | 1984-12-13 | 1986-07-17 | Shinto Paint Co. Ltd., Amagasaki | Verfahren zur selektiven verbindung von substraten mit feinen leitungsmustern |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2117794B (en) * | 1982-04-06 | 1986-05-21 | Standard Telephones Cables Ltd | Electrocoating electrical components |
| GB2130218B (en) * | 1982-11-18 | 1986-06-18 | Ici Plc | Electrodepositable coating compositions |
| DE3333073A1 (de) * | 1983-09-14 | 1985-03-21 | Herberts Gmbh, 5600 Wuppertal | Verfahren zur herstellung von lagerfaehigen konzentraten und deren verwendung zur herstellung von ueberzugsmitteln |
| US4723083A (en) * | 1983-11-25 | 1988-02-02 | General Electric Company | Electrodeposited mica on coil bar connections and resulting products |
| JPS61147593A (ja) * | 1984-12-20 | 1986-07-05 | 神東塗料株式会社 | 導電性接着剤層を付与したフレキシブル回路基材およびその製造方法 |
| US4714646A (en) * | 1986-03-24 | 1987-12-22 | International Business Machines Corporation | Electrophoretic insulation of metal circuit board core |
| US4751172A (en) * | 1986-08-01 | 1988-06-14 | Shipley Company Inc. | Process for forming metal images |
| US5202222A (en) * | 1991-03-01 | 1993-04-13 | Shipley Company Inc. | Selective and precise etching and plating of conductive substrates |
| US5160579A (en) * | 1991-06-05 | 1992-11-03 | Macdermid, Incorporated | Process for manufacturing printed circuit employing selective provision of solderable coating |
| US5288377A (en) * | 1991-06-05 | 1994-02-22 | Macdermid, Incorporated | Process for the manufacture of printed circuits using electrophoretically deposited organic resists |
| ATE195560T1 (de) * | 1993-01-11 | 2000-09-15 | Macdermid Inc | Phosphatisierungsverfahren, insbesondere für die herstellung von leiterplatten und verwendung organischer rückstände |
| US5590460A (en) | 1994-07-19 | 1997-01-07 | Tessera, Inc. | Method of making multilayer circuit |
| US6423907B1 (en) | 1998-02-09 | 2002-07-23 | Tessera, Inc. | Components with releasable leads |
| US6492201B1 (en) * | 1998-07-10 | 2002-12-10 | Tessera, Inc. | Forming microelectronic connection components by electrophoretic deposition |
| US6808527B2 (en) | 2000-04-10 | 2004-10-26 | Depuy Orthopaedics, Inc. | Intramedullary nail with snap-in window insert |
| US6379865B1 (en) | 2000-04-11 | 2002-04-30 | 3M Innovative Properties Company | Photoimageable, aqueous acid soluble polyimide polymers |
| US6803092B2 (en) | 2001-06-26 | 2004-10-12 | 3M Innovative Properties Company | Selective deposition of circuit-protective polymers |
| US10199810B2 (en) | 2013-02-20 | 2019-02-05 | Viper Innovations Ltd | Rejuvenation of subsea electrical cable insulation |
| GB2548266B (en) * | 2015-11-04 | 2018-06-27 | Payton Planar Magnetics Ltd | Planar transformer components comprising electrophoretically deposited coating |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3280019A (en) * | 1963-07-03 | 1966-10-18 | Ibm | Method of selectively coating semiconductor chips |
| US3403089A (en) * | 1965-04-05 | 1968-09-24 | Union Carbide Corp | Repairing insulation of electrical conductors by electrodeposition |
| DE1571083A1 (de) * | 1965-10-08 | 1970-12-17 | Metallgesellschaft Ag | Verfahren zur elektrophoretischen Beschichtung von Gegenstaenden |
| US3516913A (en) * | 1967-04-28 | 1970-06-23 | Desoto Inc | Electrodeposition of heat - hardenable water - dispersible hydroxy-functional hydrophylic resins of low acid value and mixtures thereof with water insoluble aminoplast resins |
| US3576728A (en) * | 1968-03-20 | 1971-04-27 | Sherwin Williams Co | Electrophoretic coating process |
| US3645873A (en) * | 1969-06-30 | 1972-02-29 | Ibm | Method of producing insulated wire assemblies |
-
1970
- 1970-08-17 US US064424A patent/US3892646A/en not_active Expired - Lifetime
-
1971
- 1971-05-26 GB GB1711071A patent/GB1330918A/en not_active Expired
- 1971-06-22 FR FR7123171A patent/FR2102285B1/fr not_active Expired
- 1971-07-09 DE DE2134391A patent/DE2134391C3/de not_active Expired
- 1971-07-15 JP JP46052153A patent/JPS5235693B1/ja active Pending
- 1971-07-20 CA CA118,593A patent/CA943677A/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3543303A1 (de) * | 1984-12-13 | 1986-07-17 | Shinto Paint Co. Ltd., Amagasaki | Verfahren zur selektiven verbindung von substraten mit feinen leitungsmustern |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2102285B1 (OSRAM) | 1974-03-22 |
| FR2102285A1 (OSRAM) | 1972-04-07 |
| GB1330918A (en) | 1973-09-19 |
| CA943677A (en) | 1974-03-12 |
| DE2134391B2 (de) | 1980-11-06 |
| US3892646A (en) | 1975-07-01 |
| JPS5235693B1 (OSRAM) | 1977-09-10 |
| DE2134391A1 (de) | 1972-02-24 |
| JPS474082A (OSRAM) | 1972-02-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OD | Request for examination | ||
| C3 | Grant after two publication steps (3rd publication) | ||
| 8339 | Ceased/non-payment of the annual fee |