DE2049012C3 - Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes - Google Patents

Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes

Info

Publication number
DE2049012C3
DE2049012C3 DE2049012A DE2049012A DE2049012C3 DE 2049012 C3 DE2049012 C3 DE 2049012C3 DE 2049012 A DE2049012 A DE 2049012A DE 2049012 A DE2049012 A DE 2049012A DE 2049012 C3 DE2049012 C3 DE 2049012C3
Authority
DE
Germany
Prior art keywords
clamping
heat sink
tension spring
screwed
semiconductor component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2049012A
Other languages
German (de)
English (en)
Other versions
DE2049012B2 (de
DE2049012A1 (de
Inventor
Oswald 1000 Berlin Nitsche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE2049012A priority Critical patent/DE2049012C3/de
Priority to CH1308771A priority patent/CH528818A/de
Priority to SE7112069A priority patent/SE376687B/xx
Priority to FR7135312A priority patent/FR2108123B1/fr
Publication of DE2049012A1 publication Critical patent/DE2049012A1/de
Priority to DE19722224040 priority patent/DE2224040C3/de
Publication of DE2049012B2 publication Critical patent/DE2049012B2/de
Application granted granted Critical
Publication of DE2049012C3 publication Critical patent/DE2049012C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01059—Praseodymium [Pr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
DE2049012A 1970-09-30 1970-09-30 Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes Expired DE2049012C3 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE2049012A DE2049012C3 (de) 1970-09-30 1970-09-30 Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes
CH1308771A CH528818A (de) 1970-09-30 1971-09-07 Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes
SE7112069A SE376687B (enrdf_load_stackoverflow) 1970-09-30 1971-09-23
FR7135312A FR2108123B1 (enrdf_load_stackoverflow) 1970-09-30 1971-09-30
DE19722224040 DE2224040C3 (de) 1970-09-30 1972-05-12 Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2049012A DE2049012C3 (de) 1970-09-30 1970-09-30 Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes

Publications (3)

Publication Number Publication Date
DE2049012A1 DE2049012A1 (de) 1972-04-06
DE2049012B2 DE2049012B2 (de) 1978-11-09
DE2049012C3 true DE2049012C3 (de) 1979-07-12

Family

ID=5784322

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2049012A Expired DE2049012C3 (de) 1970-09-30 1970-09-30 Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes

Country Status (4)

Country Link
CH (1) CH528818A (enrdf_load_stackoverflow)
DE (1) DE2049012C3 (enrdf_load_stackoverflow)
FR (1) FR2108123B1 (enrdf_load_stackoverflow)
SE (1) SE376687B (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2224040C3 (de) * 1970-09-30 1981-07-30 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes
CS180334B1 (en) * 1975-11-28 1977-12-30 Jiri Kovar Power semiconducting disc elements suppressing and jigging equipment

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO118754B (enrdf_load_stackoverflow) * 1964-04-20 1970-02-09 Asea Ab
SE339716B (enrdf_load_stackoverflow) * 1968-04-23 1971-10-18 Asea Ab

Also Published As

Publication number Publication date
FR2108123B1 (enrdf_load_stackoverflow) 1977-08-05
SE376687B (enrdf_load_stackoverflow) 1975-06-02
FR2108123A1 (enrdf_load_stackoverflow) 1972-05-12
DE2049012B2 (de) 1978-11-09
CH528818A (de) 1972-09-30
DE2049012A1 (de) 1972-04-06

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Legal Events

Date Code Title Description
OF Willingness to grant licences before publication of examined application
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee