NO118754B - - Google Patents
Download PDFInfo
- Publication number
- NO118754B NO118754B NO157673A NO15767365A NO118754B NO 118754 B NO118754 B NO 118754B NO 157673 A NO157673 A NO 157673A NO 15767365 A NO15767365 A NO 15767365A NO 118754 B NO118754 B NO 118754B
- Authority
- NO
- Norway
- Prior art keywords
- lid
- semiconductor
- box
- rings
- semiconductor system
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 claims description 41
- 239000007769 metal material Substances 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001245 Sb alloy Inorganic materials 0.000 description 1
- 229910000551 Silumin Inorganic materials 0.000 description 1
- KAPYVWKEUSXLKC-UHFFFAOYSA-N [Sb].[Au] Chemical compound [Sb].[Au] KAPYVWKEUSXLKC-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 239000002140 antimony alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910000830 fernico Inorganic materials 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Thyristors (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE481564 | 1964-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NO118754B true NO118754B (enrdf_load_stackoverflow) | 1970-02-09 |
Family
ID=20265035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO157673A NO118754B (enrdf_load_stackoverflow) | 1964-04-20 | 1965-04-13 |
Country Status (7)
| Country | Link |
|---|---|
| BE (1) | BE662743A (enrdf_load_stackoverflow) |
| CH (1) | CH431731A (enrdf_load_stackoverflow) |
| FI (1) | FI41178C (enrdf_load_stackoverflow) |
| FR (1) | FR1430747A (enrdf_load_stackoverflow) |
| GB (1) | GB1099874A (enrdf_load_stackoverflow) |
| NL (1) | NL6504892A (enrdf_load_stackoverflow) |
| NO (1) | NO118754B (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3457472A (en) * | 1966-10-10 | 1969-07-22 | Gen Electric | Semiconductor devices adapted for pressure mounting |
| US3489957A (en) * | 1967-09-07 | 1970-01-13 | Power Semiconductors Inc | Semiconductor device in a sealed package |
| DE2049012C3 (de) * | 1970-09-30 | 1979-07-12 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes |
| FR2496987A1 (fr) * | 1980-12-24 | 1982-06-25 | Jeumont Schneider | Electrodes pour pastille semi-conductrice de puissance |
| KR970000281B1 (ko) * | 1991-12-30 | 1997-01-08 | 엘지전자 주식회사 | 마그네트론의 냉각핀 |
-
1965
- 1965-04-13 NO NO157673A patent/NO118754B/no unknown
- 1965-04-14 GB GB1597065A patent/GB1099874A/en not_active Expired
- 1965-04-15 FI FI93465A patent/FI41178C/fi active
- 1965-04-15 NL NL6504892A patent/NL6504892A/xx unknown
- 1965-04-17 CH CH539865A patent/CH431731A/de unknown
- 1965-04-20 BE BE662743A patent/BE662743A/xx unknown
- 1965-04-20 FR FR13835A patent/FR1430747A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| BE662743A (enrdf_load_stackoverflow) | 1965-08-17 |
| NL6504892A (enrdf_load_stackoverflow) | 1965-10-21 |
| FI41178C (fi) | 1969-09-10 |
| CH431731A (de) | 1967-03-15 |
| FI41178B (enrdf_load_stackoverflow) | 1969-06-02 |
| FR1430747A (fr) | 1966-03-04 |
| GB1099874A (en) | 1968-01-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2933662A (en) | Semiconductor rectifier device | |
| US3609471A (en) | Semiconductor device with thermally conductive dielectric barrier | |
| US2806187A (en) | Semiconductor rectifier device | |
| US5793106A (en) | Semiconductor device | |
| US5446316A (en) | Hermetic package for a high power semiconductor device | |
| US2752541A (en) | Semiconductor rectifier device | |
| US12347814B2 (en) | Semiconductor package and semiconductor device | |
| WO1979001012A1 (en) | Fluid cooled semiconductor device | |
| JP3643525B2 (ja) | インバータ装置 | |
| WO2013141154A1 (ja) | 放熱フィン付き半導体モジュール | |
| KR100386787B1 (ko) | 직접 접촉 다이 부착 방법 및 장치 | |
| JP4575034B2 (ja) | インバータ装置 | |
| US4266089A (en) | All metal flat package having excellent heat transfer characteristics | |
| NO118754B (enrdf_load_stackoverflow) | ||
| JPH08306856A (ja) | マルチチップ・パッケージの作成方法 | |
| US2981873A (en) | Semiconductor device | |
| US3010057A (en) | Semiconductor device | |
| JP6119825B2 (ja) | パワーモジュール | |
| GB822711A (en) | Improvements relating to sealed rectifier units employing semi-conductors | |
| JP2007215302A (ja) | インバータ装置 | |
| US3280383A (en) | Electronic semiconductor device | |
| US2917686A (en) | Semiconductor rectifier device | |
| JP2021141221A (ja) | 半導体モジュール | |
| JP6380076B2 (ja) | 半導体装置 | |
| JP2013236035A (ja) | 半導体モジュール及び半導体モジュールの製造方法 |